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TMS320VC5402ZGU100

Texas Instruments

TMS320VC5402ZGU100 by Texas Instruments

TMS320VC5402ZGU100 by Texas Instruments is a 16-bit DSP with 20-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, on-chip data RAM of 16 bits and supports boundary scan testing.

Median Price

$7.310

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 52 parts In-Stock

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-

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$6.330

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$5.660

10k+ parts

$5.330

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$6.330

$5.660

$5.330

DigiKey

USA . 52 parts In-Stock

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$7.310

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Verical

USA . 52 parts In-Stock

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$8.300

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$8.300

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Distributors (In-Stock)

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Digiode

USA . 2,491 parts In-Stock

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$6.678

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$6.678

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Nova Conductors

Japan . 77 parts In-Stock

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$6.750

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Vyrian

USA . 3,299 parts In-Stock

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Chip Stock

USA . 2,900 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

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PC Components Company LLC

USA . 125 parts In-Stock

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Bristol Electronics

USA . 125 parts In-Stock

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Euro-Tech

UK . 80 parts In-Stock

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Semtec, LLC

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Distributors (Availability)

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Ampacity Inc.

Singapore . 52 parts In-Stock

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$5.980

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Corphita

USA . 1,227 parts In-Stock

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$6.327

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$6.327

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AZTECH Wire

Italy . 337 parts In-Stock

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$18.569

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$18.569

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Microchip USA

USA . 466 parts In-Stock

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$18.900

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$18.630

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$18.500

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$18.360

466

$18.900

$18.630

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$18.360

Corohmni

South Africa . 1,100 parts In-Stock

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$60.243

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Parana Technologies

USA . 2,106 parts In-Stock

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$74.893

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DigiPath Technology Company

USA . 1,510 parts In-Stock

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$82.466

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$82.466

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IDEA Electronic Components Group

UK . 1,461 parts In-Stock

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$84.149

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$79.942

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$75.734

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1,461

$84.149

$79.942

$75.734

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ChromeModa Solutions

Germany . 139 parts In-Stock

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$84.149

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$69.002

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QUARKTWIN TECHNOLOGY LTD

USA . 14,106 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,601 parts In-Stock

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Kepictronics

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Netroflash

USA . 2,000 parts In-Stock

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$6.615

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$6.412

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$6.278

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$6.278

Perfect Parts

USA . 585 parts In-Stock

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Metaverse IC Inc.

Canada . 549 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 160 parts In-Stock

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Glotronic Ltd.

UK . 128 parts In-Stock

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Overview

Experience superior performance and reliability with the TMS320VC5402ZGU100 by Texas Instruments, a leading manufacturer in the digital signal processors (DSPs) category. This powerful product offers unmatched value, benefits, and advantages to customers seeking high-quality solutions for their applications. Whether you're in need of efficient data processing or precise control, this DSP delivers exceptional results while ensuring optimal functionality and durability. Trust Texas Instruments to provide cutting-edge technology that meets your demands and exceeds your expectations. Elevate your projects with the TMS320VC5402ZGU100 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and flexibility for various applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.98 V

Ensures stable performance within specified voltage limits.

On Chip Data RAM Width: 16

Provides sufficient memory for processing data efficiently.

Address Bus Width: 20

Allows for efficient memory addressing capabilities.

Package Shape: SQUARE

Space-saving design for compact applications.

Bit Size: 16

Suitable for handling a wide range of digital signals.

Power Supplies (V): 1.8, 3.3

Offers flexibility in power input options.

No. of Terminals: 144

Provides ample connectivity options for external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances signal performance and heat dissipation.

Minimum Supply Voltage: 1.71 V

Ensures reliable operation even at low voltage levels.

Maximum Operating Temperature: 100 °C

Suitable for industrial applications with high temperature requirements.

No. of External Interrupts: 4

Allows for efficient handling of external events and interrupts.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and conductive surface for terminal connections.

Terminal Position: BOTTOM

Facilitates easy installation and connectivity on circuit boards.

Maximum Seated Height: 1.4 mm

Low profile design for compact and integrated applications.

RAM Words: 16384

Sufficient memory capacity for processing complex algorithms.

Width: 12 mm

Compact size for space-constrained applications.

Boundary Scan: YES

Allows for efficient debugging and testing of the device.

External Data Bus Width: 16

Efficient data transfer capabilities between external devices.

Maximum Clock Frequency: 20 MHz

High-speed processing capabilities for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high temperature reflow soldering processes.

Internal Bus Architecture: MULTIPLE

Enhances data processing capabilities and efficiency.

Length: 12 mm

Compact design for space-efficient applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial operating conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for various digital signal processing tasks.

No. of Timers: 2

Allows for precise time monitoring and control.

Technology: CMOS

Low power consumption and high noise immunity.

Terminal Form: BALL

Provides reliable and secure electrical connections.

Nominal Supply Voltage: 1.8 V

Optimal voltage for efficient performance and power consumption.

No. of DMA Channels: 6

Efficient data transfer capabilities for high-speed processing.

ROM Programmability: MROM

Allows for secure and non-volatile storage of program code.

Terminal Pitch: 0.8 mm

Fine pitch design for precise terminal connections.

Format: FIXED POINT

Suitable for applications requiring fixed-point arithmetic.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture levels during operation.

Low Power Mode: YES

Provides power-saving options for energy-efficient operation.

Barrel Shifter: YES

Efficient data manipulation capabilities for signal processing tasks.

On Chip Program ROM Width: 16

Sufficient storage capacity for program code and instructions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5402ZGU100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5402ZGU100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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