Loading...

TMS320VC5401ZGU50

Texas Instruments

TMS320VC5401ZGU50 by Texas Instruments

TMS320VC5401ZGU50 by Texas Instruments is a 16-bit DSP with 20-bit address bus, operating at max 20 MHz. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and boundary scan support. With a compact package style of 144 terminals in grid array form, it offers high performance in a small footprint.

Median Price

$4.910

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 481 parts In-Stock

1+ parts

-

100+ parts

$4.910

1k+ parts

-

10k+ parts

-

481

-

$4.910

-

-

Rochester

USA . 85 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

$3.800

10k+ parts

$3.580

85

-

$4.250

$3.800

$3.580

Verical

USA . 85 parts In-Stock

1+ parts

-

100+ parts

$5.313

1k+ parts

$4.750

10k+ parts

$4.475

85

-

$5.313

$4.750

$4.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,921 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

3,921

$4.484

-

-

-

Vyrian

USA . 5,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,605

-

-

-

-

DigiKey Marketplace

USA . 481 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

481

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,316 parts In-Stock

1+ parts

$4.248

100+ parts

-

1k+ parts

-

10k+ parts

-

1,316

$4.248

-

-

-

Corohmni

South Africa . 334 parts In-Stock

1+ parts

$31.890

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$31.890

-

-

-

Parana Technologies

USA . 704 parts In-Stock

1+ parts

$74.137

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$74.137

-

-

-

DigiPath Technology Company

USA . 1,776 parts In-Stock

1+ parts

$81.634

100+ parts

-

1k+ parts

-

10k+ parts

-

1,776

$81.634

-

-

-

ChromeModa Solutions

Germany . 1,037 parts In-Stock

1+ parts

$83.300

100+ parts

$68.306

1k+ parts

-

10k+ parts

-

1,037

$83.300

$68.306

-

-

IDEA Electronic Components Group

UK . 728 parts In-Stock

1+ parts

$83.300

100+ parts

$79.135

1k+ parts

$74.970

10k+ parts

-

728

$83.300

$79.135

$74.970

-

Microchip USA

USA . 391 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

391

-

-

-

-

Overview

Experience the power of cutting-edge technology with the TMS320VC5401ZGU50 by Texas Instruments. As a leader in manufacturing digital signal processors, Texas Instruments ensures top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its low power mode, high clock frequency, and advanced internal bus architecture, this product provides optimal performance for all your processing needs. Upgrade your systems with the TMS320VC5401ZGU50 and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the DSP onto circuit boards.

Maximum Supply Voltage: 1.98 V

Having a maximum supply voltage of 1.98 V makes this DSP suitable for low power applications, helping to conserve energy.

Address Bus Width: 20

A wide address bus width of 20 allows for efficient memory address handling and data processing capabilities.

Package Shape: SQUARE

The square package shape is compact and space-efficient, making it ideal for applications with limited board space.

Bit Size: 16

With a bit size of 16, this DSP can handle moderate to complex digital signal processing tasks effectively.

Power Supplies (V): 1.8, 3.3

Having multiple power supply options (1.8V and 3.3V) allows for flexibility in power management and compatibility with different systems.

No. of Terminals: 144

With a high number of terminals, this DSP can accommodate a wide range of connections and peripherals for enhanced functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures efficient heat dissipation and easy integration into compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage of 1.71 V allows for operation in low power modes while maintaining performance.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides good conductivity and resistance to oxidation, ensuring reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom makes for easier and more secure mounting on circuit boards.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for a slim profile and space-saving design.

RAM Words: 8192

With a large RAM capacity of 8192 words, this DSP can store and process a significant amount of data efficiently.

Width: 12 mm

The compact width of 12 mm enables easy integration into tight spaces and small form factor devices.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

With an external data bus width of 16, this DSP can efficiently transfer data between peripherals and memory.

Maximum Clock Frequency: 20 MHz

A maximum clock frequency of 20 MHz enables fast data processing and real-time signal handling.

Maximum Time At Peak Reflow Temperature (s): 30

The DSP can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joints and component integrity during assembly.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for parallel processing and efficient data transfer within the DSP.

Length: 12 mm

The short length of 12 mm contributes to the compact and space-saving design of the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor along with other peripheral IC types allows for versatile functionality and integration in various systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides good contact reliability and mechanical strength for secure connections.

Nominal Supply Voltage: 1.8 V

Having a nominal supply voltage of 1.8V ensures stable operation and compatibility with standard power sources.

Terminal Pitch: 0.8 mm

With a small terminal pitch of 0.8 mm, the DSP allows for high-density mounting and space-efficient board layouts.

Format: FIXED POINT

The fixed-point format provides efficient and predictable arithmetic operations, essential for digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates good moisture resistance, ensuring the DSP's reliability in various environmental conditions.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in power-efficient modes when performance requirements are lower, saving energy.

Barrel Shifter: YES

Having a barrel shifter enables efficient shift operations and bit manipulation, essential for complex data processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5401ZGU50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5401ZGU50 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20