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TMS320TCI6608AXCYP

Texas Instruments

TMS320TCI6608AXCYP by Texas Instruments

TMS320TCI6608AXCYP by Texas Instruments is a DSP with CMOS technology. It features a peak reflow temperature of 245°C, 30s at peak reflow temp, and MSL of 4. Ideal for applications requiring high-performance digital signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,597 parts In-Stock

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Digiode

USA . 2,618 parts In-Stock

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One Stop Electronics

USA . 498 parts In-Stock

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$3.000

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498

$3.000

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AZTECH Wire

Italy . 212 parts In-Stock

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$19.849

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Parana Technologies

USA . 1,742 parts In-Stock

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$64.085

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Corohmni

South Africa . 509 parts In-Stock

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$66.559

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DigiPath Technology Company

USA . 268 parts In-Stock

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$70.566

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$64.921

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268

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ChromeModa Solutions

Germany . 2,008 parts In-Stock

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$72.006

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$59.045

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$72.006

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IDEA Electronic Components Group

UK . 466 parts In-Stock

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$72.006

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$68.406

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$64.805

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Corphita

USA . 2,540 parts In-Stock

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Microchip USA

USA . 1,559 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the TMS320TCI6608AXCYP by Texas Instruments, a leader in digital signal processing technology. Designed for a wide range of applications, this DSP offers unmatched quality and reliability. Experience seamless integration and enhanced functionality with this cutting-edge product. Trust in Texas Instruments to deliver innovative solutions that exceed expectations. Elevate your projects with the TMS320TCI6608AXCYP and revolutionize your approach to digital signal processing.

Feature Benefit Bullets

Terminal Finish: TIN

TIN terminal finish provides better conductivity and corrosion resistance compared to other finishes, ensuring reliable performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes, saving time and cost during manufacturing.

Peak Reflow Temperature °C: 245

The high peak reflow temperature allows for effective soldering of the components, leading to strong and durable connections.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Having a versatile peripheral IC type like a digital signal processor with mixed capabilities enables the product to handle a wide range of signal processing tasks effectively.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making it suitable for efficient signal processing applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the product has a moderate sensitivity to moisture, allowing for easier handling during reflow soldering processes and storage in manufacturing environments.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI6608AXCYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

Peak Reflow Temperature (C):

245

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320TCI6608AXCYP Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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