Loading...

TMS320SP103AZGW2

Texas Instruments

TMS320SP103AZGW2 by Texas Instruments

TMS320SP103AZGW2 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 22-bit address bus width. Ideal for digital signal processing applications requiring low power mode and fixed-point format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,492 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,492

-

-

-

-

Digiode

USA . 2,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,088

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$6.515

100+ parts

-

1k+ parts

-

10k+ parts

-

836

$6.515

-

-

-

Ampacity Inc.

Singapore . 545 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$12.000

-

-

-

One Stop Electronics

USA . 1,132 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,132

$19.000

-

-

-

Corohmni

South Africa . 890 parts In-Stock

1+ parts

$47.832

100+ parts

-

1k+ parts

-

10k+ parts

-

890

$47.832

-

-

-

Parana Technologies

USA . 356 parts In-Stock

1+ parts

$76.085

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$76.085

-

-

-

DigiPath Technology Company

USA . 869 parts In-Stock

1+ parts

$83.779

100+ parts

$77.077

1k+ parts

-

10k+ parts

-

869

$83.779

$77.077

-

-

ChromeModa Solutions

Germany . 2,668 parts In-Stock

1+ parts

$85.489

100+ parts

$70.101

1k+ parts

-

10k+ parts

-

2,668

$85.489

$70.101

-

-

IDEA Electronic Components Group

UK . 1,058 parts In-Stock

1+ parts

$85.489

100+ parts

$81.215

1k+ parts

$76.940

10k+ parts

-

1,058

$85.489

$81.215

$76.940

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,461

-

-

-

-

Corphita

USA . 3,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,074

-

-

-

-

Microchip USA

USA . 469 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

469

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320SP103AZGW2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This Digital Signal Processor (DSP) is perfect for a wide range of applications, providing integrated cache, low power mode, and multiple DMA channels. With its advanced features and high-performance capabilities, this product offers unparalleled value and benefits to customers seeking efficient and reliable solutions. Experience the difference with Texas Instruments and elevate your projects to new heights with the TMS320SP103AZGW2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight construction and durability, making the product suitable for portable devices.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP, enhancing overall performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.65 V

Operating within a maximum supply voltage of 1.65V ensures efficient power consumption and protection against voltage spikes, enhancing the product's reliability.

On Chip Data RAM Width: 16

A wider on-chip data RAM width of 16 bits allows for faster data processing and storage, improving the overall performance of the DSP.

Address Bus Width: 22

With a larger address bus width of 22 bits, the DSP can access and manage a larger memory space efficiently, enabling more complex signal processing tasks.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it easier to integrate the DSP into various electronic devices without wasting space.

Bit Size: 16

A 16-bit architecture allows for efficient processing of data and instructions, making the DSP suitable for a wide range of signal processing applications.

No. of Terminals: 240

Having a higher number of terminals enables the DSP to interface with a wide range of external components and peripherals, enhancing its versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high-density mounting options, allowing for more compact and space-saving PCB designs.

Minimum Supply Voltage: 1.55 V

Operating within a minimum supply voltage of 1.55V ensures reliable performance even under low power conditions, making the DSP energy-efficient.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the DSP can withstand higher temperature environments, ensuring reliable operation in various conditions.

No. of External Interrupts: 6

Having 6 external interrupts enables the DSP to respond quickly to external events or signals, improving real-time processing capabilities.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the DSP can function in colder environments, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides good conductivity and corrosion resistance, enhancing the reliability and longevity of the DSP.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly, allowing for easier integration of the DSP into electronic systems.

Maximum Seated Height: 1.4 mm

The low seated height of 1.4mm allows for slim and compact device designs, making the DSP suitable for applications with space constraints.

Width: 15 mm

With a width of 15mm, the DSP can be easily integrated into various electronic devices, offering flexibility in design and installation.

Boundary Scan: YES

Support for boundary scan technology enables easier debugging and testing of the DSP during manufacturing and maintenance, ensuring high quality and reliability.

External Data Bus Width: 32

A wider external data bus width of 32 bits allows for faster data transfer between the DSP and external components, enhancing overall processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the DSP onto PCBs, reducing the risk of soldering defects.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the DSP can withstand high-temperature soldering processes, ensuring secure and reliable connections.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for efficient data transfer and communication within the DSP, improving overall performance and processing capabilities.

Length: 15 mm

With a length of 15mm, the DSP can be easily integrated into compact electronic devices, offering flexibility in design and space-saving benefits.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, the product is specifically designed for signal processing tasks, making it a specialized and efficient choice for such applications.

No. of Timers: 2

Having 2 timers allows for precise timing and scheduling of tasks within the DSP, enhancing its ability to manage time-sensitive operations effectively.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable for various applications.

Terminal Form: BALL

The terminal form of balls enables easy and reliable connections between the DSP and PCB, ensuring secure electrical contacts for stable operation.

Nominal Supply Voltage: 1.6 V

Operating at a nominal supply voltage of 1.6V ensures stable and efficient performance, balancing power consumption and processing capabilities effectively.

No. of DMA Channels: 6

With 6 DMA channels, the DSP can efficiently manage data transfer between peripherals and memory, improving overall system performance and data handling.

ROM Programmability: MROM

MROM (Mask ROM) programmability provides a permanent and secure storage solution for critical firmware and data, ensuring reliable and secure operation of the DSP.

Terminal Pitch: 0.8 mm

Having a terminal pitch of 0.8mm allows for fine-pitch mounting, enabling high-density PCB designs and compact electronic devices with tight layout requirements.

Format: FIXED POINT

Being a fixed-point format DSP allows for efficient arithmetic operations on fixed-point data types, making it suitable for various signal processing tasks with precise calculations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate exposure to moisture during manufacturing and storage, ensuring reliability and durability in humid environments.

Low Power Mode: YES

Support for low power mode enhances energy efficiency, enabling the DSP to operate in power-sensitive applications or extend battery life in portable devices.

On Chip Program ROM Width: 16

Having a wide on-chip program ROM width of 16 bits allows for efficient storage and retrieval of program instructions, enhancing the overall performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320SP103AZGW2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320SP103AZGW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20