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TMS320R2812GHHQ

Texas Instruments

TMS320R2812GHHQ by Texas Instruments

TMS320R2812GHHQ by Texas Instruments is a 32-bit DSP with 20480 RAM words, operating at up to 150 MHz. Ideal for automotive applications, it features a low profile grid array package with 179 terminals and supports boundary scan testing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,702 parts In-Stock

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Digiode

USA . 3,656 parts In-Stock

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One Stop Electronics

USA . 1,074 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 883 parts In-Stock

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$16.769

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883

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Corohmni

South Africa . 8 parts In-Stock

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$23.757

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Parana Technologies

USA . 1,882 parts In-Stock

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$29.051

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$54.852

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DigiPath Technology Company

USA . 1,267 parts In-Stock

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$31.989

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$29.430

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1,267

$31.989

$29.430

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ChromeModa Solutions

Germany . 1,544 parts In-Stock

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$32.642

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$26.766

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$26.766

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IDEA Electronic Components Group

UK . 767 parts In-Stock

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$32.642

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$31.010

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$29.378

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$32.642

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Corphita

USA . 1,464 parts In-Stock

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Microchip USA

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Overview

Unleash the power of cutting-edge technology with the TMS320R2812GHHQ by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that redefine performance and efficiency. Designed to meet the demands of various applications, this DSP offers unparalleled value, benefits, and advantages to customers seeking optimal processing capabilities. Elevate your projects with the TMS320R2812GHHQ and experience the superior quality and reliability that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy is a common and cost-effective material for packaging digital signal processors, making this product affordable for a wide range of applications.

Maximum Supply Voltage: 2 V

With a maximum supply voltage of 2V, this DSP is suitable for low-power applications where energy efficiency is crucial.

Bit Size: 32

A larger bit size of 32 allows for more precise calculations and processing of digital signals, making this product suitable for complex signal processing tasks.

Power Supplies (V): 1.8, 3.3

With multiple power supply options, this DSP can operate in a variety of systems with different voltage requirements.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer within the DSP, improving overall processing performance.

Maximum Clock Frequency: 150 MHz

A high maximum clock frequency of 150 MHz enables this DSP to handle fast data processing tasks with minimal delay.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this DSP can withstand harsh temperature conditions, making it suitable for use in vehicles.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With a digital signal processor as the primary peripheral IC type, this product is specifically designed for signal processing tasks, offering high performance in this area.

Technical Specifications

Digital Signal Processors (DSPs) TMS320R2812GHHQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

179

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320R2812GHHQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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