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TMS320P25FNL

Texas Instruments

TMS320P25FNL by Texas Instruments

TMS320P25FNL by Texas Instruments is a 16-bit DSP with 5V supply, 40.96 MHz clock frequency, and 544 RAM words. Ideal for digital signal processing applications due to its multiple internal bus architecture and on-chip data RAM width of 16 bits. Package style is chip carrier with dimensions of 24.205mm x 24.205mm and J bend terminal form.

Median Price

$46.642

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 217 parts In-Stock

1+ parts

-

100+ parts

$41.460

1k+ parts

$37.090

10k+ parts

$34.910

217

-

$41.460

$37.090

$34.910

DigiKey

USA . 217 parts In-Stock

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-

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217

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Verical

USA . 217 parts In-Stock

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-

100+ parts

$51.825

1k+ parts

$46.362

10k+ parts

$43.638

217

-

$51.825

$46.362

$43.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,800 parts In-Stock

1+ parts

$43.766

100+ parts

-

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1,800

$43.766

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DigiKey Marketplace

USA . 217 parts In-Stock

1+ parts

$47.910

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217

$47.910

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ComSIT Distribution GmbH

Germany . 11,772 parts In-Stock

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ComSIT USA

USA . 11,772 parts In-Stock

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Vyrian

USA . 8,617 parts In-Stock

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8,617

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Connector Distribution Corp

USA . 184 parts In-Stock

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184

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Right Parts Inc.

USA . 184 parts In-Stock

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184

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Lantek

USA . 128 parts In-Stock

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128

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LWI Electronics Inc

India . 85 parts In-Stock

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85

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Cyclops Electronics Ltd

UK . 59 parts In-Stock

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Microfarads

USA . 18 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 18 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 154 parts In-Stock

1+ parts

$10.547

100+ parts

-

1k+ parts

$10.125

10k+ parts

$10.125

154

$10.547

-

$10.125

$10.125

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$17.052

100+ parts

-

1k+ parts

$17.272

10k+ parts

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750

$17.052

-

$17.272

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DigiPath Technology Company

USA . 992 parts In-Stock

1+ parts

$18.777

100+ parts

$17.275

1k+ parts

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992

$18.777

$17.275

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ChromeModa Solutions

Germany . 6,794 parts In-Stock

1+ parts

$19.160

100+ parts

$15.711

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6,794

$19.160

$15.711

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IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$19.160

100+ parts

$18.202

1k+ parts

$17.244

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500

$19.160

$18.202

$17.244

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Corphita

USA . 4,861 parts In-Stock

1+ parts

$41.463

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4,861

$41.463

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Component Stockers USA

USA . 279 parts In-Stock

1+ parts

$46.710

100+ parts

$43.910

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279

$46.710

$43.910

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Corohmni

South Africa . 1,122 parts In-Stock

1+ parts

$83.503

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$83.503

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 138 parts In-Stock

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GreenTree Electronics

Israel . 128 parts In-Stock

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ChipstoGo Electronic ltd

UK . 54 parts In-Stock

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Assy Fe

Spain . 22 parts In-Stock

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Overview

Unlock the full potential of your digital signal processing tasks with the TMS320P25FNL by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and reliability. This DSP is perfect for applications that require high-speed data processing, making it ideal for telecommunications, audio processing, and industrial automation. With its advanced features and cutting-edge technology, the TMS320P25FNL offers unmatched value and performance, giving you a competitive edge in your projects. Trust Texas Instruments to deliver excellence with every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage provides flexibility in power supply options and supports stable performance under varying voltage conditions.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on a circuit board, optimizing space utilization and ensuring a neat layout.

Bit Size: 16

16-bit processing capability enables efficient handling of data and operations, suitable for a wide range of digital signal processing tasks.

Maximum Clock Frequency: 40.96 MHz

High maximum clock frequency allows for fast processing speed, enabling real-time signal processing and high-performance computing tasks.

Technology: MOS

MOS technology offers high speed and low power consumption, making the DSP energy-efficient and suitable for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320P25FNL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40.96 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-J68

Length:

24.205 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Serial I/Os:

0

No. of Terminals:

68

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.205 mm

Peripheral IC Type:

Trade Compliance

TMS320P25FNL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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