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TMS320LF2403APAGA

Texas Instruments

TMS320LF2403APAGA by Texas Instruments

TMS320LF2403APAGA by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 20 MHz. Ideal for industrial applications, it features 3 external interrupts, ADC channels, and PWM channels for precise digital signal processing tasks. With low power mode and flash ROM programmability, this CMOS technology-based processor offers efficient performance in a compact square package.

Median Price

$23.960

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,133 parts In-Stock

1+ parts

$14.432

100+ parts

$12.606

1k+ parts

$8.694

10k+ parts

-

1,133

$14.432

$12.606

$8.694

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Farnell

UK . 69 parts In-Stock

1+ parts

$19.398

100+ parts

$17.149

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-

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69

$19.398

$17.149

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Mouser Electronics

USA . 112 parts In-Stock

1+ parts

$23.960

100+ parts

$17.660

1k+ parts

$15.990

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112

$23.960

$17.660

$15.990

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DigiKey

USA . 84 parts In-Stock

1+ parts

$23.960

100+ parts

$18.049

1k+ parts

$15.992

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-

84

$23.960

$18.049

$15.992

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Newark

USA . 69 parts In-Stock

1+ parts

$24.680

100+ parts

$17.540

1k+ parts

$17.230

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69

$24.680

$17.540

$17.230

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Element14

Singapore . 69 parts In-Stock

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$28.650

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69

$28.650

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Distributors (In-Stock)

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Digiode

USA . 411 parts In-Stock

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$13.710

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411

$13.710

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Vyrian

USA . 5,626 parts In-Stock

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Euro-Tech

UK . 264 parts In-Stock

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264

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Digital Electronic Gebert Verwaltungs UG

Germany . 134 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,210 parts In-Stock

1+ parts

$12.989

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-

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1,210

$12.989

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Continental Prestige Electronics

USA . 141 parts In-Stock

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$19.230

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141

$19.230

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Microchip USA

USA . 2,773 parts In-Stock

1+ parts

$53.680

100+ parts

$52.910

1k+ parts

$52.530

10k+ parts

$52.140

2,773

$53.680

$52.910

$52.530

$52.140

Corohmni

South Africa . 732 parts In-Stock

1+ parts

$57.316

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732

$57.316

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Parana Technologies

USA . 1,717 parts In-Stock

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$63.479

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1,717

$63.479

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DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$69.898

100+ parts

$64.307

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1,223

$69.898

$64.307

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ChromeModa Solutions

Germany . 993 parts In-Stock

1+ parts

$71.325

100+ parts

$58.486

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993

$71.325

$58.486

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IDEA Electronic Components Group

UK . 777 parts In-Stock

1+ parts

$71.325

100+ parts

$67.759

1k+ parts

$64.192

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777

$71.325

$67.759

$64.192

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A-Z Elektronik GmbH

Germany . 6,386 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 2,038 parts In-Stock

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Epart123

USA . 1,920 parts In-Stock

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$21.900

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$21.900

Kepictronics

USA . 721 parts In-Stock

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721

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GreenTree Electronics

Israel . 640 parts In-Stock

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640

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ChipstoGo Electronic ltd

UK . 120 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320LF2403APAGA by Texas Instruments. Manufactured with the highest quality standards, this DSP offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile product provides value through its advanced features and benefits. Experience seamless operation, efficient power consumption, and cutting-edge technology with the TMS320LF2403APAGA, setting new standards in the world of digital signal processors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring long-lasting performance.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, which can potentially improve the processing power and efficiency of the DSP.

ADC Channels: YES

Including ADC channels allows the DSP to process analog signals, making it versatile for a variety of applications.

Maximum Clock Frequency: 20 MHz

With a high maximum clock frequency, this DSP can handle complex signal processing tasks quickly and efficiently.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being specifically designed as a digital signal processor ensures that this product is optimized for signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2403APAGA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2403APAGA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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