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TMS320LC549PGE-66

Texas Instruments

TMS320LC549PGE-66 by Texas Instruments

TMS320LC549PGE-66 by Texas Instruments is a 16-bit DSP with 3.3V power supply, 20MHz clock frequency, and 32768 RAM words. Ideal for industrial applications requiring low power consumption, it features a 23-bit address bus width and operates in an extended temperature range from -40 to 100°C.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Vyrian

USA . 7,768 parts In-Stock

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Digiode

USA . 1,911 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 24 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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Semi Source

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Goldney Electronics S.L.

Spain . 2 parts In-Stock

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One Stop Electronics

USA . 902 parts In-Stock

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AZTECH Wire

Italy . 598 parts In-Stock

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$11.336

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Parana Technologies

USA . 1,912 parts In-Stock

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Corohmni

South Africa . 5,247 parts In-Stock

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DigiPath Technology Company

USA . 326 parts In-Stock

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$80.615

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IDEA Electronic Components Group

UK . 2,090 parts In-Stock

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ChromeModa Solutions

Germany . 1,396 parts In-Stock

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Component Stockers USA

USA . 752 parts In-Stock

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Microchip USA

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Corphita

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A-Z Elektronik GmbH

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Experience unmatched innovation and performance with the TMS320LC549PGE-66 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability in their products. This DSP is perfect for a wide range of applications, offering customers exceptional value and benefits. With its advanced features and cutting-edge technology, the TMS320LC549PGE-66 ensures superior performance and efficiency, making it the ideal choice for all your digital signal processing needs. Upgrade your systems today with this top-of-the-line product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, increasing compatibility with different systems and applications.

Bit Size: 16

The 16-bit bit size allows for faster processing speeds and improved performance in handling complex digital signals.

RAM Words: 32768

Large RAM capacity enables the storage and manipulation of a significant amount of data, enhancing the processing capabilities of the DSP.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency provides fast operation, making the DSP suitable for real-time signal processing applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions, making the DSP ideal for industrial applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC549PGE-66 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320LC549PGE-66 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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