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TMS320LC541PZ2-40

Texas Instruments

TMS320LC541PZ2-40 by Texas Instruments

TMS320LC541PZ2-40 by Texas Instruments is a 16-bit DSP with 3.3V supply, 20MHz clock frequency, and 2560 RAM words. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and on-chip program ROM width of 16 bits.

Median Price

$10.060

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 3,600 parts In-Stock

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$10.060

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3,600

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Vyrian

USA . 5,632 parts In-Stock

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5,632

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Digiode

USA . 1,518 parts In-Stock

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1,518

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Legend Electronics Inc.

USA . 720 parts In-Stock

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720

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$13.099

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338

$13.099

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One Stop Electronics

USA . 277 parts In-Stock

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$15.000

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277

$15.000

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Parana Technologies

USA . 561 parts In-Stock

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$47.870

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561

$47.870

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ChromeModa Solutions

Germany . 6,495 parts In-Stock

1+ parts

$53.786

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$44.105

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6,495

$53.786

$44.105

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IDEA Electronic Components Group

UK . 2,251 parts In-Stock

1+ parts

$53.786

100+ parts

$51.097

1k+ parts

$48.407

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2,251

$53.786

$51.097

$48.407

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Corohmni

South Africa . 5,011 parts In-Stock

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$68.349

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5,011

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Assy Fe

Spain . 2,190 parts In-Stock

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2,190

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DigiPath Technology Company

USA . 1,109 parts In-Stock

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$48.493

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1,109

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$48.493

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Corphita

USA . 886 parts In-Stock

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Microchip USA

USA . 156 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the TMS320LC541PZ2-40 by Texas Instruments. As a leader in innovative technology, Texas Instruments delivers unparalleled quality and reliability in the field of digital signal processors. The TMS320LC541PZ2-40 is perfect for applications that require high-speed data processing and precision performance. Experience the value and benefits of this product, from its low power mode to its flexible internal bus architecture. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good insulation and protection for the components inside the package.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages for versatility in different applications.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage on the chip.

Address Bus Width: 16

Wide address bus width enables access to a large memory space for processing.

Package Shape: SQUARE

Square shape allows for compact and space-efficient integration into electronic systems.

Bit Size: 16

16-bit processing capability offers sufficient computational power for digital signal processing tasks.

Power Supplies (V): 3.3

Optimal power supply voltage for efficient operation with low power consumption.

No. of Terminals: 100

Sufficient number of terminals for connectivity and interfacing with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low profile design with fine pitch terminals for compact and high-density packaging.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages while maintaining performance and reliability.

No. of External Interrupts: 5

Multiple external interrupts allow for efficient handling of external events in real-time.

Terminal Position: QUAD

Quad terminal position for easy and secure soldering onto circuit boards.

Maximum Seated Height: 1.6 mm

Low profile design with minimal seated height for space-constrained applications.

RAM Words: 2560

Sufficient RAM words for storing and processing data in digital signal processing applications.

Width: 14 mm

Compact width for easy integration into electronic systems with limited space.

Boundary Scan: YES

Boundary scan capability for efficient testing and debugging of the chip during production.

External Data Bus Width: 16

Wide external data bus width for high-speed data transfer between the processor and external components.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency for fast processing of digital signals and data.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture for efficient data transfer and processing within the chip.

Length: 14 mm

Compact length for space-efficient placement on circuit boards.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing tasks, ensuring optimized performance.

Technology: CMOS

CMOS technology offers low power consumption and high reliability for electronic devices.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connectivity to circuit boards.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage for stable and efficient operation of the digital signal processor.

ROM Programmability: MROM

MROM programmability ensures permanent storage of essential program data for reliable operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density integration onto circuit boards.

Format: FIXED POINT

Fixed-point format for precise and accurate numerical calculations in signal processing applications.

Low Power Mode: YES

Low power mode option for energy-efficient operation and extended battery life.

Barrel Shifter: YES

Barrel shifter feature for efficient data manipulation and processing.

On Chip Program ROM Width: 16

Wide program ROM width for storing program instructions and data for processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC541PZ2-40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Serial I/Os:

1

No. of Terminals:

100

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2560

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC541PZ2-40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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