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TMS320F28332PTPQ

Texas Instruments

TMS320F28332PTPQ by Texas Instruments

TMS320F28332PTPQ by Texas Instruments is a 32-bit DSP with 20-bit address bus, operating at max 100 MHz. Ideal for automotive applications, it features low power mode, boundary scan support, and 13312 RAM words for efficient signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,565 parts In-Stock

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8,565

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Digiode

USA . 1,142 parts In-Stock

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1,142

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Distributors (Availability)

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AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$5.656

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682

$5.656

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One Stop Electronics

USA . 1,229 parts In-Stock

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$10.000

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$10.000

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Parana Technologies

USA . 1,727 parts In-Stock

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$76.186

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1,727

$76.186

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Corohmni

South Africa . 2,060 parts In-Stock

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$76.553

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2,060

$76.553

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DigiPath Technology Company

USA . 1,068 parts In-Stock

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$83.890

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$77.179

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1,068

$83.890

$77.179

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ChromeModa Solutions

Germany . 3,847 parts In-Stock

1+ parts

$85.602

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$70.194

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3,847

$85.602

$70.194

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IDEA Electronic Components Group

UK . 755 parts In-Stock

1+ parts

$85.602

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$81.322

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$77.042

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755

$85.602

$81.322

$77.042

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Corphita

USA . 4,163 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320F28332PTPQ by Texas Instruments, a leader in digital signal processors. This cutting-edge device is designed for a wide range of applications, offering customers the value of superior quality and efficiency. With advanced technology and a commitment to innovation, Texas Instruments delivers a product that exceeds expectations, providing the competitive edge needed in today's fast-paced market. Discover the advantages of the TMS320F28332PTPQ and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits, saving space and reducing production costs.

Maximum Supply Voltage: 1.89 V

The low maximum supply voltage ensures energy efficiency and helps prevent damage to the device from voltage spikes.

Address Bus Width: 20

Having a wide address bus width allows the processor to access a large memory space, enabling faster data processing and improved performance.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easy to integrate the DSP into various electronic systems.

Bit Size: 32

A 32-bit architecture allows for high-speed processing of digital signals, leading to enhanced performance and efficiency.

Power Supplies (V): 1.9,3.3

Having multiple power supply options allows for flexibility in different operating environments and power requirements.

No. of Terminals: 176

With a high number of terminals, the DSP can support a wide range of input and output connections, enhancing its versatility.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures the device can operate reliably even in low-power conditions, making it suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and high-intensity usage.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the DSP can function effectively in both extreme cold and hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, improving overall system stability and performance.

RAM Words: 13312

With a large RAM capacity, the DSP can store and process a significant amount of data, enabling complex signal processing tasks.

Width: 24 mm

The compact width of the DSP makes it suitable for integration into space-constrained electronic devices.

Boundary Scan: YES

Boundary scan capability facilitates efficient testing and debugging of the DSP during production, ensuring product quality and reliability.

External Data Bus Width: 32

A wide external data bus width allows for high-speed data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

The high maximum clock frequency enables the DSP to process data at a rapid pace, making it suitable for real-time signal processing applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and assembly of the DSP onto PCBs, resulting in reliable connections.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architectures allows for efficient data transfer and communication within the DSP, enhancing overall performance.

Length: 24 mm

The compact length of the DSP makes it easy to fit into various electronic designs without taking up too much space.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means that the DSP is built to withstand the rigors of automotive applications, ensuring durability and reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various digital signal processing tasks and peripheral IC types makes the DSP versatile and suitable for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology enhances energy efficiency and performance, making the DSP suitable for battery-powered and low-power applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and ease of assembly onto PCBs, ensuring reliable electrical connections.

Nominal Supply Voltage: 1.8 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the DSP, maintaining performance under varying operating conditions.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting of the DSP on PCBs, saving space and enabling compact device designs.

Format: FLOATING POINT

Supporting floating-point calculations enables the DSP to handle complex mathematical operations accurately, making it suitable for signal processing tasks that require precision.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 indicates the DSP can withstand moderate exposure to moisture during assembly and operation.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when not performing intensive tasks, conserving energy and extending battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28332PTPQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Words:

13312

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320F28332PTPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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