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TMS320F28234ZAYA

Texas Instruments

TMS320F28234ZAYA by Texas Instruments

TMS320F28234ZAYA by Texas Instruments is a 32-bit DSP with 179 terminals, operating at up to 150 MHz. It features 8 external interrupts, 6 DMA channels, and PWM channels for digital signal processing applications. With a low power mode and industrial temperature grade, it offers high performance in a compact square package.

Median Price

$27.803

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 878 parts In-Stock

1+ parts

$21.016

100+ parts

$18.357

1k+ parts

$12.660

10k+ parts

-

878

$21.016

$18.357

$12.660

-

Mouser Electronics

USA . 150 parts In-Stock

1+ parts

$34.590

100+ parts

$24.170

1k+ parts

$23.640

10k+ parts

-

150

$34.590

$24.170

$23.640

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,151 parts In-Stock

1+ parts

$19.965

100+ parts

-

1k+ parts

-

10k+ parts

-

2,151

$19.965

-

-

-

Vyrian

USA . 2,958 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,958

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,037 parts In-Stock

1+ parts

$17.116

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

$17.116

-

-

-

Corphita

USA . 1,760 parts In-Stock

1+ parts

$18.914

100+ parts

-

1k+ parts

-

10k+ parts

-

1,760

$18.914

-

-

-

Parana Technologies

USA . 1,698 parts In-Stock

1+ parts

$36.287

100+ parts

-

1k+ parts

-

10k+ parts

-

1,698

$36.287

-

-

-

DigiPath Technology Company

USA . 1,029 parts In-Stock

1+ parts

$39.957

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$39.957

-

-

-

ChromeModa Solutions

Germany . 1,242 parts In-Stock

1+ parts

$40.772

100+ parts

$33.433

1k+ parts

-

10k+ parts

-

1,242

$40.772

$33.433

-

-

IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$40.772

100+ parts

$38.733

1k+ parts

$36.695

10k+ parts

-

1,156

$40.772

$38.733

$36.695

-

Microchip USA

USA . 2,893 parts In-Stock

1+ parts

$54.420

100+ parts

$53.640

1k+ parts

$53.250

10k+ parts

$52.860

2,893

$54.420

$53.640

$53.250

$52.860

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320F28234ZAYA Digital Signal Processor by Texas Instruments. Crafted with precision and reliability, this innovative product offers unmatched performance in a variety of applications. From industrial automation to automotive systems, this DSP delivers exceptional value and benefits to customers seeking high-quality solutions. Experience seamless operation and advanced functionality with the TMS320F28234ZAYA, setting new standards in the world of digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.995 V

Allows for flexible power supply options while ensuring optimal performance of the DSP.

On Chip Data RAM Width: 16

Provides sufficient memory capacity for data storage and processing, enabling high-speed operations.

Package Shape: SQUARE

Allows for compact and space-efficient design, suitable for applications with limited board space.

Bit Size: 32

Offers high computational power and precision for advanced signal processing tasks.

No. of Terminals: 179

Provides versatile connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates reliable and high-density mounting on PCBs, enhancing overall system integration.

Minimum Supply Voltage: 1.805 V

Ensures stable operation at lower power levels, increasing energy efficiency and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

Supports operation in a wide range of temperature environments, making the DSP suitable for industrial applications.

CPU Family: C28X

Specific processor architecture optimized for signal processing tasks, offering superior performance and efficiency.

No. of External Interrupts: 8

Allows for real-time response to external events, enhancing the responsiveness and versatility of the DSP.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold conditions, expanding the range of potential applications.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable signal transmission and long-term durability.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with analog sensors and signals, expanding the DSP's versatility.

Terminal Position: BOTTOM

Facilitates easy and efficient PCB layout and soldering, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

Low profile design for space-constrained applications and compatibility with various board stacking configurations.

RAM Words: 34816

Sufficient memory capacity for storing and processing data, supporting complex algorithms and applications.

Width: 12 mm

Compact form factor for easy integration into different system designs and configurations.

Boundary Scan: YES

Facilitates testing, debugging, and fault detection during the manufacturing and maintenance process, ensuring product reliability.

Maximum Clock Frequency: 150 MHz

High clock speed for fast signal processing and execution of complex algorithms, leading to improved performance.

Maximum Time At Peak Reflow Temperature (s): 30

Optimized reflow profile for reliable soldering and assembly, ensuring product quality and durability.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes, complying with industry standards and regulations.

Internal Bus Architecture: MULTIPLE

Efficient data transfer and communication within the DSP, enhancing overall system performance and throughput.

Length: 12 mm

Optimal size for compact system designs and integration into various electronic devices and applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with extended temperature ranges and harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile functionality for signal processing applications and control tasks, offering a comprehensive solution in a single device.

No. of Timers: 3

Supports timing and scheduling functions for various tasks and operations, enhancing the versatility of the DSP.

RAM Bytes: 69632

Large memory capacity for data storage and processing, accommodating complex algorithms and applications.

Technology: CMOS

Low power consumption and high-speed operation for efficient signal processing and performance, leading to energy savings.

Terminal Form: BALL

Facilitates soldering and mounting on PCBs, providing reliable interconnections and signal paths.

Maximum Supply Current: 0.315 mA

Low power consumption for energy-efficient operation and extended battery life in portable applications.

Nominal Supply Voltage: 1.9 V

Stable voltage supply for consistent and reliable operation, ensuring optimal performance of the DSP.

No. of DMA Channels: 6

Supports efficient data transfer and processing tasks, enhancing system performance and throughput.

PWM Channels: YES

Allows for pulse-width modulation for precise control and modulation of signals, expanding the DSP's functionality.

ROM Programmability: FLASH

Flexible and reprogrammable memory for storing program code and configuration data, enabling customization and updates.

Terminal Pitch: 0.8 mm

Fine pitch spacing for compact and high-density interconnections, enabling efficient board layout and assembly.

Format: FLOATING POINT

Supports advanced numerical processing and calculations with high precision and accuracy, suitable for complex algorithms.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during handling and assembly, ensuring product reliability.

Low Power Mode: YES

Enables power-saving operation for energy efficiency and extending battery life in low-power applications.

On Chip Program ROM Width: 16

Efficient memory architecture for storing program code and instructions on-chip, enhancing system performance and responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28234ZAYA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

179

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

69632

RAM Words:

34816

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

.315 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

TMS320F28234ZAYA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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