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TMS320F28232ZHHA

Texas Instruments

TMS320F28232ZHHA by Texas Instruments

TMS320F28232ZHHA by Texas Instruments is a 32-bit DSP with 1.89V max supply voltage, 100MHz clock frequency, and 179 terminals. Ideal for industrial applications requiring low power consumption, it features 53248 bytes of RAM, flash ROM programmability, and 6 DMA channels for efficient data transfer.

Median Price

$19.372

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$17.220

1k+ parts

$15.410

10k+ parts

$14.500

41

-

$17.220

$15.410

$14.500

Verical

USA . 41 parts In-Stock

1+ parts

-

100+ parts

$21.525

1k+ parts

$19.262

10k+ parts

$18.125

41

-

$21.525

$19.262

$18.125

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,757 parts In-Stock

1+ parts

$18.174

100+ parts

-

1k+ parts

-

10k+ parts

-

2,757

$18.174

-

-

-

Vyrian

USA . 8,677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,677

-

-

-

-

DigiKey Marketplace

USA . 41 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

41

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 41 parts In-Stock

1+ parts

$16.260

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$16.260

-

-

-

Corphita

USA . 4,318 parts In-Stock

1+ parts

$17.217

100+ parts

-

1k+ parts

-

10k+ parts

-

4,318

$17.217

-

-

-

Microchip USA

USA . 124 parts In-Stock

1+ parts

$51.440

100+ parts

$50.700

1k+ parts

$50.330

10k+ parts

$49.970

124

$51.440

$50.700

$50.330

$49.970

Corohmni

South Africa . 891 parts In-Stock

1+ parts

$71.774

100+ parts

-

1k+ parts

-

10k+ parts

-

891

$71.774

-

-

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Parana Technologies

USA . 599 parts In-Stock

1+ parts

$71.887

100+ parts

-

1k+ parts

-

10k+ parts

-

599

$71.887

-

-

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ChromeModa Solutions

Germany . 5,515 parts In-Stock

1+ parts

$80.772

100+ parts

$66.233

1k+ parts

-

10k+ parts

-

5,515

$80.772

$66.233

-

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IDEA Electronic Components Group

UK . 554 parts In-Stock

1+ parts

$80.772

100+ parts

$76.733

1k+ parts

$72.695

10k+ parts

-

554

$80.772

$76.733

$72.695

-

DigiPath Technology Company

USA . 1,171 parts In-Stock

1+ parts

-

100+ parts

$72.824

1k+ parts

-

10k+ parts

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1,171

-

$72.824

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Overview

Unlock the full potential of your digital signal processing applications with the TMS320F28232ZHHA by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This powerful DSP boasts a range of features to enhance performance, including low power mode and multiple PWM channels. Perfect for industrial settings, this DSP offers high-speed processing capabilities and robust internal bus architecture. Experience seamless operation and efficiency with the TMS320F28232ZHHA, the ultimate solution for your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into electronic circuit boards.

Maximum Supply Voltage: 1.89 V

Efficient operation with a maximum supply voltage of 1.89V.

On Chip Data RAM Width: 16

16-bit data RAM width allows for efficient processing and storage of data.

Address Bus Width: 20

20-bit address bus width provides sufficient address space for memory and peripherals.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality for automotive applications.

Bit Size: 32

32-bit architecture allows for high-speed processing and performance.

Power Supplies (V): 1.9,3.3

Support for multiple power supply voltages allows for flexible integration in various systems.

No. of Terminals: 179

High number of terminals enables connectivity to a wide range of external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, fine pitch package style provides compact and efficient packaging for space-constrained applications.

Minimum Supply Voltage: 1.71 V

Operates efficiently with a minimum supply voltage of 1.71V.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

CPU Family: C28X

C28X CPU family offers high-performance processing capabilities suitable for a variety of applications.

No. of External Interrupts: 8

8 external interrupts enable efficient handling of external events and real-time interactions.

Minimum Operating Temperature: -40 °C

Operates reliably at low temperatures, making it suitable for harsh environments.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and resistance to corrosion.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and connection in circuit board layouts.

Maximum Seated Height: 1.4 mm

Low seated height enables compact and slim designs for electronic systems.

RAM Words: 52

52 RAM words provide sufficient memory capacity for data storage and processing.

Width: 12 mm

Compact width of 12mm allows for easy integration into various system designs.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during development and production.

External Data Bus Width: 32

32-bit external data bus width allows for high-speed communication with external devices and memory.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency of 100MHz enables fast processing and real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for 30 seconds, ensuring reliability during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder joints and reliability in manufacturing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and performance.

Length: 12 mm

Compact length of 12mm allows for space-efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized digital signal processor peripheral IC type provides dedicated processing capabilities for signal processing tasks.

No. of Timers: 19

19 timers enable precise timing and synchronization functions for various applications.

RAM Bytes: 53248

Large RAM capacity of 53248 bytes allows for efficient data storage and processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides reliable and robust connections in surface mount applications.

Maximum Supply Current: 315 mA

Maximum supply current of 315mA ensures sufficient power delivery for high-performance processing.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8V ensures consistent and reliable operation.

No. of DMA Channels: 6

6 DMA channels enable efficient data transfer and processing without CPU intervention.

PWM Channels: YES

Support for PWM channels enables precise control of power output and motor control applications.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible and easy firmware updates and customization.

Terminal Pitch: 0.8 mm

Compact terminal pitch of 0.8mm allows for high-density mounting on PCBs.

Format: FIXED POINT

Fixed-point format offers efficient processing of integer-based calculations for signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 ensures compatibility with standard moisture-reflow soldering processes.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation and extended battery life in portable devices.

On Chip Program ROM Width: 16

16-bit on-chip program ROM width facilitates efficient storage and execution of program code.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F28232ZHHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of Terminals:

179

No. of Timers:

19

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

53248

RAM Words:

52

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

315 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28232ZHHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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