Loading...

TMS320F2801ZGMS

Texas Instruments

TMS320F2801ZGMS by Texas Instruments

TMS320F2801ZGMS by Texas Instruments is a 32-bit DSP with max clock freq of 100MHz, RAM of 6144 words, and low power mode. Ideal for automotive applications due to temp grade of -40 to 125°C, it features boundary scan, CMOS tech, and operates on supply voltages of 1.8V & 3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,592

-

-

-

-

Digiode

USA . 1,838 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,838

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 642 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

642

$5.000

-

-

-

AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$7.877

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$7.877

-

-

-

One Stop Electronics

USA . 1,231 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,231

$22.000

-

-

-

Parana Technologies

USA . 1,424 parts In-Stock

1+ parts

$63.716

100+ parts

-

1k+ parts

-

10k+ parts

-

1,424

$63.716

-

-

-

DigiPath Technology Company

USA . 543 parts In-Stock

1+ parts

$70.159

100+ parts

$64.546

1k+ parts

-

10k+ parts

-

543

$70.159

$64.546

-

-

ChromeModa Solutions

Germany . 6,700 parts In-Stock

1+ parts

$71.591

100+ parts

$58.705

1k+ parts

-

10k+ parts

-

6,700

$71.591

$58.705

-

-

IDEA Electronic Components Group

UK . 1,374 parts In-Stock

1+ parts

$71.591

100+ parts

$68.011

1k+ parts

$64.432

10k+ parts

-

1,374

$71.591

$68.011

$64.432

-

Corohmni

South Africa . 381 parts In-Stock

1+ parts

$83.765

100+ parts

-

1k+ parts

-

10k+ parts

-

381

$83.765

-

-

-

Corphita

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

552

-

-

-

-

Microchip USA

USA . 179 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

179

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320F2801ZGMS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors designed for a wide range of applications. This product offers customers unmatched value, benefits, and advantages with its innovative features and reliable performance. Trust Texas Instruments to provide you with the tools you need to succeed in the digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides a good balance of cost-effectiveness and durability for the product.

Surface Mount: YES

Being surface mountable allows for easy integration into PCBs and helps in saving space.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage allows for flexibility in power supply options and requirements.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on the PCB layout.

Bit Size: 32

A 32-bit architecture allows for high computational performance and precision in signal processing tasks.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply options enables compatibility with various system configurations.

No. of Terminals: 100

Having a sufficient number of terminals allows for connection to external circuitry and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances thermal performance and enables high-density mounting.

Minimum Supply Voltage: 1.71 V

The lower minimum supply voltage ensures efficient power utilization and low power consumption.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for demanding industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range allows for reliable operation in extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and assembly.

Maximum Seated Height: 1.4 mm

The low maximum seated height helps in achieving a compact overall product size.

RAM Words: 6144

With 6144 RAM words, the product can efficiently store and process data during operation.

Width: 10 mm

The slim width of 10 mm aids in space-saving and allows for compact system designs.

Boundary Scan: YES

Boundary scan capability enhances testability and reliability during production and maintenance.

Maximum Clock Frequency: 100 MHz

Support for a high clock frequency of 100 MHz enables rapid signal processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable solder joints and interconnects.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data transfer speeds and system performance.

Length: 10 mm

The compact length of 10 mm contributes to the overall small form factor of the product.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures reliability and compliance with stringent industry standards for automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor with additional peripheral ICs enhances the product's versatility and functionality.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

The ball terminal form ensures secure connections and reliable electrical contact.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage is common and widely compatible, making integration easier.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise alignment and soldering during assembly.

Format: FIXED POINT

The fixed-point format facilitates accurate and efficient computation in signal processing operations.

Moisture Sensitivity Level (MSL): 3

Having MSL 3 indicates moderate sensitivity to moisture, ensuring reliability in typical operating environments.

Low Power Mode: YES

Support for low power mode enables energy-efficient operation and extends battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2801ZGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

6144

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2801ZGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20