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TMS320F243PGEA

Texas Instruments

TMS320F243PGEA by Texas Instruments

TMS320F243PGEA by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 5MHz clock freq. Ideal for industrial applications due to -40 to 85°C temp range, low power mode, and barrel shifter feature. Package style: flatpack, low profile, fine pitch.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

USA . 2,118 parts In-Stock

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Digiode

USA . 434 parts In-Stock

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Chip Stock

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LWI Electronics Inc

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AZTECH Wire

Italy . 897 parts In-Stock

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$5.093

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One Stop Electronics

USA . 434 parts In-Stock

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Parana Technologies

USA . 193 parts In-Stock

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ChromeModa Solutions

Germany . 6,484 parts In-Stock

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IDEA Electronic Components Group

UK . 465 parts In-Stock

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$51.009

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$48.325

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Corohmni

South Africa . 667 parts In-Stock

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Component Stockers USA

USA . 425 parts In-Stock

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Corphita

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Futuretech Components

Singapore . 2,074 parts In-Stock

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Microchip USA

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DigiPath Technology Company

USA . 366 parts In-Stock

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Benley Electronics

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Kepictronics

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Overview

Unleash the power of cutting-edge technology with the TMS320F243PGEA by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers top-notch quality and reliability. This versatile product is perfect for a wide range of applications, offering customers unmatched value and performance. With its innovative features and advanced design, the TMS320F243PGEA provides users with a seamless experience and unparalleled benefits. Trust Texas Instruments to elevate your projects to new heights with this exceptional DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product suitable for various industrial applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this DSP can handle a wide range of input power levels, increasing its versatility.

Bit Size: 16

A 16-bit architecture allows for more complex processing tasks and higher precision, making this DSP suitable for demanding signal processing applications.

RAM Words: 544

With a large amount of RAM, this DSP can store and process a significant amount of data, enabling it to handle complex algorithms efficiently.

Maximum Clock Frequency: 5 MHz

A high maximum clock frequency allows for faster processing speeds, making this DSP ideal for real-time applications where quick response times are crucial.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this DSP is reliable in harsh environments, making it a dependable choice for industrial applications.

Format: FIXED POINT

Fixed-point processing offers a balance between performance and power efficiency, making this DSP well-suited for applications that require high computational performance while conserving energy.

Low Power Mode: YES

The availability of a low power mode helps conserve energy and extend battery life, making this DSP suitable for portable devices or applications where power consumption is a concern.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F243PGEA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

5 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320F243PGEA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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