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TMS320F243PGE

Texas Instruments

TMS320F243PGE by Texas Instruments

TMS320F243PGE by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at max 5MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,280 parts In-Stock

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7,280

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Digiode

USA . 2,880 parts In-Stock

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2,880

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LIBRA Elektronik GmbH

Germany . 17 parts In-Stock

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17

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Electronic Expediters

USA . 6 parts In-Stock

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6

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One Stop Electronics

USA . 1,382 parts In-Stock

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$13.000

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1,382

$13.000

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AZTECH Wire

Italy . 573 parts In-Stock

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$15.478

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573

$15.478

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Parana Technologies

USA . 1,927 parts In-Stock

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$28.036

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$2,603.558

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$25.232

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1,927

$28.036

$2,603.558

$25.232

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DigiPath Technology Company

USA . 1,431 parts In-Stock

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$30.871

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$30.871

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ChromeModa Solutions

Germany . 6,152 parts In-Stock

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$31.501

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$25.831

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$31.501

$25.831

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IDEA Electronic Components Group

UK . 610 parts In-Stock

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$31.501

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$29.926

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$28.351

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610

$31.501

$29.926

$28.351

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Corohmni

South Africa . 320 parts In-Stock

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$80.703

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320

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Corphita

USA . 4,838 parts In-Stock

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Microchip USA

USA . 376 parts In-Stock

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376

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Overview

Discover the powerful TMS320F243PGE by Texas Instruments, a top-of-the-line Digital Signal Processor designed for applications that demand high performance and efficiency. With Texas Instruments' renowned reputation for quality and innovation, this DSP delivers exceptional value and benefits to customers. Ideal for a wide range of applications, this product offers unparalleled advantages in signal processing, making it the ultimate choice for those seeking cutting-edge technology. Experience superior performance and reliability with the TMS320F243PGE, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this DSP can handle a wide range of input power levels, improving its versatility.

Address Bus Width: 16

A 16-bit address bus width enables efficient memory access and data processing capabilities, enhancing the performance of the DSP.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit layouts and reduces wasted space on the PCB.

Bit Size: 16

A 16-bit processing capability provides sufficient precision for a variety of signal processing tasks, making this DSP suitable for a range of applications.

Power Supplies (V): 5

Operating at a standard 5V power supply, this DSP is compatible with common power sources and can easily be integrated into existing systems.

No. of Terminals: 144

With 144 terminals, this DSP offers ample connectivity options for interfacing with other components and peripherals, enhancing its functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact and space-efficient placement on the PCB, ideal for designs with size constraints.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the DSP can operate efficiently even in scenarios where power input may fluctuate or be limited.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DSP can withstand elevated temperatures without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

Capable of functioning at temperatures as low as 0°C, this DSP is reliable in various operating environments, including cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures high conductivity and resistance to corrosion, maintaining signal integrity and longevity of the DSP.

Terminal Position: QUAD

Quad terminal position enables stable and secure connections, reducing the risk of signal interference or disconnection during operation.

Maximum Seated Height: 1.6 mm

With a low maximum seated height, this DSP can be accommodated in slim designs, allowing for compact and sleek product configurations.

RAM Words: 544

A large RAM capacity of 544 words provides ample storage for temporary data and calculations, enhancing the processing capabilities of the DSP.

Width: 20 mm

The 20mm width offers a balance between compactness and ease of integration, fitting well within standard PCB layouts and enclosures.

Boundary Scan: YES

Boundary scan capability facilitates efficient testing and debugging during production, ensuring high quality and reliability of the DSP.

External Data Bus Width: 16

A 16-bit external data bus width allows for fast data transfer between the DSP and external memory or peripherals, optimizing performance.

Maximum Clock Frequency: 5 MHz

Operating at a maximum clock frequency of 5 MHz, this DSP can handle high-speed signal processing tasks with efficiency and accuracy.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering and component assembly, contributing to the overall durability of the product.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, this DSP can undergo soldering processes without damage, guaranteeing robust assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the DSP, enabling concurrent operations and multitasking capabilities.

Length: 20 mm

The 20mm length complements the width dimension, providing a compact form factor that is conducive to space-constrained applications.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this DSP is suitable for mainstream applications and deployments, offering reliability and stability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

As a digital signal processor with additional peripheral functionality, this DSP can fulfill a diverse range of signal processing and interfacing requirements.

Technology: CMOS

Utilizing CMOS technology, this DSP optimizes power efficiency and processing speed, making it suitable for portable and energy-conscious applications.

Terminal Form: GULL WING

Gull wing terminal form provides robust connection points for surface mounting, ensuring secure attachment and reliable performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, this DSP maintains consistent performance and compatibility with standard power sources.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this DSP offers high-density packaging options and precise alignment for streamlined PCB assembly.

Format: FIXED POINT

Operating in fixed-point format, this DSP provides efficient and deterministic processing of numerical data, suitable for real-time applications and algorithms.

Low Power Mode: YES

The low power mode feature enables energy-saving operation, extending battery life and reducing overall power consumption in portable or battery-powered devices.

Barrel Shifter: YES

Incorporating a barrel shifter enhances data manipulation capabilities within the DSP, facilitating complex arithmetic and logic operations with efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F243PGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

5 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320F243PGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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