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TMS320DM8168SCYGA2

Texas Instruments

TMS320DM8168SCYGA2 by Texas Instruments

TMS320DM8168SCYGA2 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for industrial applications requiring high-performance digital signal processing capabilities in a compact package.

Median Price

$130.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 660 parts In-Stock

1+ parts

$129.920

100+ parts

$127.330

1k+ parts

$124.730

10k+ parts

-

660

$129.920

$127.330

$124.730

-

Texas Instruments

USA . 582 parts In-Stock

1+ parts

$130.739

100+ parts

$118.341

1k+ parts

$112.706

10k+ parts

-

582

$130.739

$118.341

$112.706

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 315 parts In-Stock

1+ parts

$124.202

100+ parts

-

1k+ parts

-

10k+ parts

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315

$124.202

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Vyrian

USA . 2,136 parts In-Stock

1+ parts

-

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2,136

-

-

-

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Chip Stock

USA . 371 parts In-Stock

1+ parts

-

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-

1k+ parts

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371

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 164 parts In-Stock

1+ parts

$10.850

100+ parts

-

1k+ parts

-

10k+ parts

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164

$10.850

-

-

-

Component Stockers USA

USA . 3,165 parts In-Stock

1+ parts

$16.150

100+ parts

-

1k+ parts

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10k+ parts

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3,165

$16.150

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Corohmni

South Africa . 353 parts In-Stock

1+ parts

$40.353

100+ parts

-

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-

10k+ parts

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353

$40.353

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-

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Parana Technologies

USA . 383 parts In-Stock

1+ parts

$53.402

100+ parts

-

1k+ parts

-

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383

$53.402

-

-

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DigiPath Technology Company

USA . 2,245 parts In-Stock

1+ parts

$58.802

100+ parts

-

1k+ parts

-

10k+ parts

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2,245

$58.802

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

1+ parts

$60.002

100+ parts

$57.002

1k+ parts

$54.002

10k+ parts

-

1,364

$60.002

$57.002

$54.002

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ChromeModa Solutions

Germany . 902 parts In-Stock

1+ parts

$60.002

100+ parts

$49.202

1k+ parts

-

10k+ parts

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902

$60.002

$49.202

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Corphita

USA . 373 parts In-Stock

1+ parts

$117.665

100+ parts

-

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373

$117.665

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Microchip USA

USA . 1,865 parts In-Stock

1+ parts

$161.640

100+ parts

$157.330

1k+ parts

$155.170

10k+ parts

$153.010

1,865

$161.640

$157.330

$155.170

$153.010

Perfect Parts

USA . 99 parts In-Stock

1+ parts

-

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99

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Overview

Experience superior performance and reliability with the TMS320DM8168SCYGA2 from Texas Instruments, a leading manufacturer in the industry. This Digital Signal Processor offers unparalleled efficiency and versatility for a wide range of applications. With integrated cache and low power mode, this product delivers exceptional value and benefits to customers seeking cutting-edge technology. Whether you're in industrial automation, telecommunications, or automotive electronics, the TMS320DM8168SCYGA2 is the perfect solution for your needs. Trust Texas Instruments for top-quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various operating environments.

Integrated Cache: YES

The integrated cache improves the processing speed and efficiency of the DSP, enhancing its overall performance.

Maximum Supply Voltage: 1.05 V

The high maximum supply voltage allows for flexibility in power requirements and can support higher performance demands.

Address Bus Width: 15

The wide address bus width enables the DSP to access a larger memory space efficiently, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape facilitates easier integration into electronic systems and allows for efficient use of space.

Bit Size: 32

The 32-bit architecture enables the DSP to handle complex calculations and process data with higher precision.

No. of Terminals: 1031

The high number of terminals provides connectivity options and flexibility for interfacing with other components in the system.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage helps in reducing power consumption and enhances the energy efficiency of the DSP.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range ensures the DSP can function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the DSP to operate in extreme cold conditions without any loss in performance.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections and longevity of the DSP.

RAM Words: 16384

The large RAM capacity allows the DSP to store and access a significant amount of data quickly, improving its processing capabilities.

Width: 25 mm

The compact width of the DSP makes it suitable for space-constrained applications and allows for easy integration into various electronic devices.

Boundary Scan: YES

The boundary scan feature enables efficient testing and debugging of the DSP during the development stage, reducing time-to-market.

External Data Bus Width: 32

The wide external data bus width allows for fast data transfer between the DSP and external memory devices, improving overall system performance.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates that the DSP is resistant to moisture-induced damage, making it suitable for various operating environments.

Low Power Mode: YES

The low power mode helps in reducing power consumption during idle or low-demand periods, improving the energy efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168SCYGA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168SCYGA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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