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TMS320DM8168BCYG0

Texas Instruments

TMS320DM8168BCYG0 by Texas Instruments

TMS320DM8168BCYG0 by Texas Instruments is a 32-bit DSP with 16-bit external data bus, clocked at 27 MHz. It features 16384 RAM words and operates on a supply voltage range of 0.95V to 1.05V. Ideal for applications requiring low power consumption and high processing speeds in digital signal processing tasks.

Median Price

$108.075

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$93.750

1k+ parts

$83.880

10k+ parts

$78.940

13

-

$93.750

$83.880

$78.940

DigiKey

USA . 13 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13

-

-

-

-

Verical

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$122.400

1k+ parts

$110.675

10k+ parts

-

13

-

$122.400

$110.675

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,166 parts In-Stock

1+ parts

$98.962

100+ parts

-

1k+ parts

-

10k+ parts

-

2,166

$98.962

-

-

-

DigiKey Marketplace

USA . 13 parts In-Stock

1+ parts

$108.340

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$108.340

-

-

-

Vyrian

USA . 7,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,868

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,958 parts In-Stock

1+ parts

$16.630

100+ parts

-

1k+ parts

$16.900

10k+ parts

-

1,958

$16.630

-

$16.900

-

DigiPath Technology Company

USA . 2,239 parts In-Stock

1+ parts

$18.311

100+ parts

-

1k+ parts

-

10k+ parts

-

2,239

$18.311

-

-

-

ChromeModa Solutions

Germany . 4,277 parts In-Stock

1+ parts

$18.685

100+ parts

$15.322

1k+ parts

-

10k+ parts

-

4,277

$18.685

$15.322

-

-

IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$18.685

100+ parts

$17.751

1k+ parts

$16.816

10k+ parts

-

2,080

$18.685

$17.751

$16.816

-

Corohmni

South Africa . 5,221 parts In-Stock

1+ parts

$49.488

100+ parts

-

1k+ parts

-

10k+ parts

-

5,221

$49.488

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$62.572

100+ parts

$56.941

1k+ parts

$51.309

10k+ parts

-

2,500

$62.572

$56.941

$51.309

-

Corphita

USA . 1,617 parts In-Stock

1+ parts

$93.753

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$93.753

-

-

-

Microchip USA

USA . 336 parts In-Stock

1+ parts

$150.000

100+ parts

$146.000

1k+ parts

$144.000

10k+ parts

$142.000

336

$150.000

$146.000

$144.000

$142.000

Overview

Experience unparalleled performance and reliability with the TMS320DM8168BCYG0 by Texas Instruments, a leading manufacturer in the industry. As part of the Digital Signal Processors category, this product offers cutting-edge technology for a wide range of applications. With its superior quality and innovative features, customers can expect seamless integration, high-speed processing, and exceptional efficiency. Elevate your projects to the next level with the TMS320DM8168BCYG0 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection for the internals of the DSP, making it durable and reliable.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.05 V

Provides a suitable power input for the DSP to operate efficiently.

Address Bus Width: 28

Allows for addressing a wide range of memory locations, enhancing the DSP's capabilities.

Package Shape: SQUARE

Helps in efficient space utilization on the circuit board.

Bit Size: 32

Enables the DSP to process data in larger chunks, improving performance.

No. of Terminals: 1031

Offers a wide range of connectivity options for interfacing with other components.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Facilitates easy and convenient connection on the circuit board.

RAM Words: 16384

Offers ample memory storage for efficient data processing and manipulation.

Width: 25 mm

Compact size makes it suitable for space-constrained applications.

Boundary Scan: YES

Facilitates testing and debugging during manufacturing and maintenance.

External Data Bus Width: 16

Allows for efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 27 MHz

Enables fast processing speed for real-time applications.

Internal Bus Architecture: MULTIPLE

Enhances data transfer efficiency within the DSP, improving performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Versatile functionality for diverse signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Format: FLOATING POINT

Supports complex mathematical calculations and precision in data processing.

Low Power Mode: YES

Enables energy efficiency and extends battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168BCYG0 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

28

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168BCYG0 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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