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TMS320DM648ZUTD1

Texas Instruments

TMS320DM648ZUTD1 by Texas Instruments

TMS320DM648ZUTD1 by Texas Instruments is a 32-bit DSP with 8192 RAM words, operating at 1.2V, 1.8V, and 3.3V. It features a grid array package style with 529 terminals for applications in digital signal processing and other peripheral IC types requiring fixed-point format and CMOS technology.

Median Price

$117.588

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 21 parts In-Stock

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-

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$102.000

1k+ parts

$91.260

10k+ parts

$85.900

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$102.000

$91.260

$85.900

DigiKey

USA . 21 parts In-Stock

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Verical

USA . 21 parts In-Stock

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$133.175

1k+ parts

$120.425

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21

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$133.175

$120.425

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Distributors (In-Stock)

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Digiode

USA . 1,591 parts In-Stock

1+ parts

$107.673

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Vyrian

USA . 2,962 parts In-Stock

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DigiKey Marketplace

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Bristol Electronics

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Atlantic Semiconductor

USA . 15 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 676 parts In-Stock

1+ parts

$16.059

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676

$16.059

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Parana Technologies

USA . 1,446 parts In-Stock

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$32.654

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$110.750

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$32.654

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$110.750

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DigiPath Technology Company

USA . 385 parts In-Stock

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$35.956

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$33.080

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385

$35.956

$33.080

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ChromeModa Solutions

Germany . 3,761 parts In-Stock

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$36.690

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$30.086

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3,761

$36.690

$30.086

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IDEA Electronic Components Group

UK . 621 parts In-Stock

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$36.690

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$34.856

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$33.021

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621

$36.690

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$33.021

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$52.729

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$47.983

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$43.238

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$52.729

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$43.238

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Corphita

USA . 3,976 parts In-Stock

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$102.006

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Microchip USA

USA . 274 parts In-Stock

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$114.230

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$111.180

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$109.660

10k+ parts

$108.140

274

$114.230

$111.180

$109.660

$108.140

Component Stockers USA

USA . 34 parts In-Stock

1+ parts

$114.950

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GreenTree Electronics

Israel . 206 parts In-Stock

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Overview

Unlock the full potential of your digital signal processing projects with the TMS320DM648ZUTD1 by Texas Instruments. This high-quality DSP offers unparalleled performance and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this DSP provides seamless integration and exceptional speed, allowing you to achieve optimal results in record time. Experience the value and benefits of Texas Instruments' expertise with the TMS320DM648ZUTD1 – the perfect solution for your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic circuits.

Bit Size: 32

32-bit processing capability enables high-speed and efficient signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple voltage options allows for flexibility in designing and integrating the DSP into various systems.

No. of Terminals: 529

A higher number of terminals provide more connectivity options and functionality for the DSP.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style allows for denser component packing and efficient use of board space.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes ensures good electrical conductivity and corrosion resistance.

RAM Words: 8192

Ample RAM capacity enables efficient data storage and processing for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for 30 seconds ensures robustness during assembly processes.

Peak Reflow Temperature °C: 245

High peak reflow temperature rating ensures the DSP can withstand soldering processes without damage.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processing functionality along with other peripheral capabilities make this DSP versatile for a wide range of applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance for efficient signal processing tasks.

Terminal Form: BALL

Ball terminal form provides reliable connections and ease of use during the assembly process.

Terminal Pitch: 0.8 mm

A small terminal pitch allows for denser mounting of components on PCBs, saving space and enabling compact designs.

Format: FIXED POINT

Fixed-point format simplifies calculations and processing tasks, making the DSP suitable for real-time applications.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates the DSP is moderately sensitive to moisture exposure, requiring proper handling and storage to maintain performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM648ZUTD1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

529

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320DM648ZUTD1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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