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TMS320DM648ZUT9HK

Texas Instruments

TMS320DM648ZUT9HK by Texas Instruments

TMS320DM648ZUT9HK by Texas Instruments is a DSP with 32-bit external data bus, 14-bit address bus, and CMOS technology. It is used in digital signal processing applications requiring low power mode and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,461 parts In-Stock

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Digiode

USA . 4,793 parts In-Stock

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4,793

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Distributors (Availability)

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Ampacity Inc.

Singapore . 962 parts In-Stock

1+ parts

$8.000

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962

$8.000

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AZTECH Wire

Italy . 538 parts In-Stock

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$11.076

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538

$11.076

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Parana Technologies

USA . 490 parts In-Stock

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$24.858

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$25.540

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490

$24.858

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$25.540

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DigiPath Technology Company

USA . 1,333 parts In-Stock

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$27.371

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1,333

$27.371

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ChromeModa Solutions

Germany . 2,347 parts In-Stock

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$27.930

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$22.903

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2,347

$27.930

$22.903

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IDEA Electronic Components Group

UK . 1,061 parts In-Stock

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$27.930

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$26.534

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$25.137

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1,061

$27.930

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$25.137

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One Stop Electronics

USA . 996 parts In-Stock

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$33.000

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996

$33.000

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Corohmni

South Africa . 1,966 parts In-Stock

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$78.528

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Component Stockers USA

USA . 254 parts In-Stock

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$99.990

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254

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Corphita

USA . 2,300 parts In-Stock

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Microchip USA

USA . 120 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320DM648ZUT9HK from Texas Instruments, a leading manufacturer in the industry. As a top-of-the-line Digital Signal Processor (DSP), this product offers cutting-edge technology for a wide range of applications. With a focus on quality and innovation, Texas Instruments delivers a product that exceeds expectations in terms of reliability and functionality. Unlock a world of possibilities and enhance your projects with the superior value and benefits that the TMS320DM648ZUT9HK provides to customers. Elevate your work to new heights with this exceptional DSP solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost effectiveness, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and cost during manufacturing.

Maximum Supply Voltage: 1.26 V

This allows for efficient power usage while still providing enough voltage for optimal performance.

Address Bus Width: 14

A wider address bus allows for access to a larger memory space, enhancing the capabilities of the DSP.

Package Shape: SQUARE

Square packages are easier to handle and arrange on a PCB, simplifying the layout and design process.

No. of Terminals: 520

Having a high number of terminals allows for more connectivity options and functionality in the product.

Minimum Supply Voltage: 1.14 V

Ensuring a stable minimum supply voltage enables the DSP to operate reliably under various conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can function in demanding environmental conditions without overheating.

Terminal Finish: TIN SILVER COPPER

This finish provides good conductivity and durability for the terminals, ensuring a reliable connection.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and allows for better heat dissipation, improving overall performance.

Maximum Seated Height: 3.3 mm

A compact seated height saves space on the PCB and allows for a more streamlined and efficient design.

Width: 19 mm

A moderate width enables easy integration into various PCB layouts while still maintaining a compact form factor.

Boundary Scan: YES

Boundary scan capability helps with testing and debugging during the manufacturing process, ensuring a high-quality end product.

External Data Bus Width: 32

A wider external data bus allows for faster data transfers and processing, improving the overall performance of the DSP.

Peak Reflow Temperature °C: 245

With a high peak reflow temperature, the DSP can withstand the soldering process without any damage, ensuring a reliable connection.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data handling and processing capabilities, making the DSP versatile and powerful.

Terminal Form: BALL

Ball terminal form is common for surface mount components, allowing for easy and reliable solder connections during manufacturing.

Nominal Supply Voltage: 1.2 V

Having a stable nominal supply voltage ensures consistent performance and reliable operation of the DSP.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the DSP can withstand a moderate level of moisture exposure, increasing its durability in various environments.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption when the DSP is not operating at full capacity, improving energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM648ZUT9HK attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

520

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM648ZUT9HK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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