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TMS320DM647ZUT9

Texas Instruments

TMS320DM647ZUT9 by Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$72.754

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 97 parts In-Stock

1+ parts

-

100+ parts

$64.670

1k+ parts

$57.860

10k+ parts

$54.460

97

-

$64.670

$57.860

$54.460

DigiKey

USA . 97 parts In-Stock

1+ parts

-

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-

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97

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Verical

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$80.838

1k+ parts

$72.325

10k+ parts

$68.075

88

-

$80.838

$72.325

$68.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,288 parts In-Stock

1+ parts

$68.258

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1,288

$68.258

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Vyrian

USA . 8,537 parts In-Stock

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8,537

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Chip Stock

USA . 425 parts In-Stock

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425

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DigiKey Marketplace

USA . 187 parts In-Stock

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187

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Cyclops Electronics Ltd

UK . 34 parts In-Stock

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34

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Bristol Electronics

USA . 14 parts In-Stock

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Classic Components Corporation

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$17.570

100+ parts

$15.989

1k+ parts

$14.407

10k+ parts

-

2,000

$17.570

$15.989

$14.407

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Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

$37.110

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2,286

$37.110

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DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

$40.863

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1,176

$40.863

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ChromeModa Solutions

Germany . 4,464 parts In-Stock

1+ parts

$41.697

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$34.192

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$41.697

$34.192

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IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$41.697

100+ parts

$39.612

1k+ parts

$37.527

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2,246

$41.697

$39.612

$37.527

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Corohmni

South Africa . 616 parts In-Stock

1+ parts

$61.925

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616

$61.925

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Corphita

USA . 2,791 parts In-Stock

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$64.665

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2,791

$64.665

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Microchip USA

USA . 223 parts In-Stock

1+ parts

$119.930

100+ parts

$117.840

1k+ parts

$116.800

10k+ parts

$115.760

223

$119.930

$117.840

$116.800

$115.760

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM647ZUT9 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

900 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B529

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

529

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA529,23X23,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

TMS320DM647ZUT9 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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