Loading...

TMS320DM6433ZWT7

Texas Instruments

TMS320DM6433ZWT7 by Texas Instruments

TMS320DM6433ZWT7 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, making it ideal for applications requiring high-speed signal processing in commercial-grade environments. With low power mode and multiple internal bus architecture, it offers efficient performance for digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,326

-

-

-

-

Digiode

USA . 1,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,967

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 239 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

239

$1.000

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.945

100+ parts

$9.960

1k+ parts

$8.975

10k+ parts

-

450

$10.945

$9.960

$8.975

-

AZTECH Wire

Italy . 403 parts In-Stock

1+ parts

$15.963

100+ parts

-

1k+ parts

-

10k+ parts

-

403

$15.963

-

-

-

Parana Technologies

USA . 1,433 parts In-Stock

1+ parts

$35.091

100+ parts

$3,258.724

1k+ parts

$31.582

10k+ parts

-

1,433

$35.091

$3,258.724

$31.582

-

DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

$38.639

100+ parts

-

1k+ parts

-

10k+ parts

-

1,643

$38.639

-

-

-

Corohmni

South Africa . 846 parts In-Stock

1+ parts

$38.710

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$38.710

-

-

-

ChromeModa Solutions

Germany . 1,397 parts In-Stock

1+ parts

$39.428

100+ parts

$32.331

1k+ parts

-

10k+ parts

-

1,397

$39.428

$32.331

-

-

IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$39.428

100+ parts

$37.457

1k+ parts

$35.485

10k+ parts

-

267

$39.428

$37.457

$35.485

-

Microchip USA

USA . 470 parts In-Stock

1+ parts

$100.670

100+ parts

$99.790

1k+ parts

$99.790

10k+ parts

$98.920

470

$100.670

$99.790

$99.790

$98.920

Corphita

USA . 3,354 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,354

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,220

-

-

-

-

Metaverse IC Inc.

Canada . 331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

331

-

-

-

-

Overview

Unleash the power of innovation with the TMS320DM6433ZWT7 by Texas Instruments, a cutting-edge Digital Signal Processor designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this DSP offers unparalleled quality and reliability. Ideal for a wide range of applications, from audio processing to image recognition, this processor delivers exceptional performance and efficiency. Experience the value and benefits of the TMS320DM6433ZWT7, where advanced technology meets seamless functionality to bring your ideas to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the DSP, making it suitable for various operating conditions.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency by storing frequently accessed data, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26 V, the DSP operates efficiently while consuming low power, making it energy-efficient.

On Chip Data RAM Width: 8

Having an on-chip data RAM width of 8 enhances data storage capabilities and enables faster access to information for processing.

Address Bus Width: 32

A wide address bus width of 32 allows for efficient communication within the system and supports complex data processing tasks.

Package Shape: SQUARE

Square package shape provides ease of handling and efficient placement on circuit boards, optimizing the overall design and layout of the system.

Bit Size: 32

A 32-bit architecture enables the DSP to handle larger data sets and complex algorithms, improving overall performance and processing capabilities.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supplies allows flexibility in system design and operation, catering to various power requirements of different applications.

No. of Terminals: 361

Having 361 terminals enables seamless connectivity with other components, facilitating integration and communication within the system.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style provides compactness and optimal space utilization, essential for modern electronic devices with limited space.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage of 1.14 V ensures efficient operation even under low power conditions, contributing to energy savings and extended battery life.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliability and stable performance in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C allows the DSP to function in cold environments without compromising on performance and reliability.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on PCBs, simplifying the assembly process and enhancing overall productivity.

Maximum Seated Height: 1.4 mm

Low maximum seated height of 1.4 mm enables a compact and slim design, which is essential for space-constrained applications and portable devices.

RAM Words: 20480

With 20480 RAM words, the DSP has ample memory capacity to store large amounts of data and instructions, supporting complex computational tasks.

Width: 16 mm

A compact width of 16 mm allows for easy integration into various electronic devices without occupying excessive space, ensuring efficient space utilization.

Boundary Scan: YES

Boundary scan feature enables testing and debugging of the DSP during production and maintenance, ensuring high reliability and quick fault detection.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables fast data transfer and communication with external devices, enhancing system efficiency and performance.

Maximum Clock Frequency: 27 MHz

High maximum clock frequency of 27 MHz allows for swift processing and execution of instructions, resulting in improved performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Extended maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal management during assembly, enhancing reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C enables robust solder joints and secure connections, ensuring long-term reliability and stability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speed and efficiency within the DSP, supporting complex operations and improving overall performance.

Length: 16 mm

A compact length of 16 mm allows for space-efficient placement on PCBs and within electronic devices, minimizing footprint and optimizing design layout.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating conditions in commercial applications, offering reliability and consistent performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed as a digital signal processor, with additional peripheral IC types, making it versatile and adaptable for a wide range of signal processing applications.

No. of Timers: 5

Having 5 timers allows for precise timing control and synchronization of operations, essential for applications requiring accurate time-sensitive functions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

Ball terminal form enables reliable connections and easy soldering, enhancing the robustness and stability of the DSP within the system.

Nominal Supply Voltage: 1.2 V

Having a nominal supply voltage of 1.2 V ensures consistent and stable operation, optimizing power efficiency and performance of the DSP.

No. of DMA Channels: 72

With 72 DMA channels, the DSP supports efficient data transfer and processing tasks, improving system performance and response times.

ROM Programmability: MROM

MROM programmability enables secure and permanent storage of essential instructions and data, ensuring reliability and consistency of operation.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8 mm allows for high-density mounting and efficient use of PCB space, essential for compact and miniaturized electronic devices.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and improves computational efficiency, making the DSP suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to prevent damage and ensure performance reliability.

Low Power Mode: YES

Low power mode enables energy-saving operation when processing load is reduced, enhancing battery life and overall power efficiency of the DSP.

On Chip Program ROM Width: 8

An on-chip program ROM width of 8 enhances storage capacity for essential program instructions, enabling efficient program execution and system operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6433ZWT7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6433ZWT7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20