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TMS320DM6433ZDU7

Texas Instruments

TMS320DM6433ZDU7 by Texas Instruments

TMS320DM6433ZDU7 by Texas Instruments is a 32-bit DSP with integrated cache and 32-bit external data bus width. It operates at a max clock frequency of 27 MHz, suitable for digital signal processing applications requiring high-speed performance in commercial temperature grades.

Median Price

$43.065

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 360 parts In-Stock

1+ parts

$32.820

100+ parts

$29.173

1k+ parts

$21.451

10k+ parts

-

360

$32.820

$29.173

$21.451

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Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$53.310

100+ parts

$37.490

1k+ parts

$37.470

10k+ parts

-

40

$53.310

$37.490

$37.470

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,943 parts In-Stock

1+ parts

$31.179

100+ parts

-

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1,943

$31.179

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Vyrian

USA . 4,563 parts In-Stock

1+ parts

$32.820

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4,563

$32.820

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ACDS - Activité Composants Distribution Service

France . 23 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 200 parts In-Stock

1+ parts

$27.900

100+ parts

-

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200

$27.900

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Corphita

USA . 3,171 parts In-Stock

1+ parts

$29.538

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3,171

$29.538

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Corohmni

South Africa . 2,565 parts In-Stock

1+ parts

$33.920

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2,565

$33.920

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Parana Technologies

USA . 1,461 parts In-Stock

1+ parts

$53.378

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1,461

$53.378

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DigiPath Technology Company

USA . 1,296 parts In-Stock

1+ parts

$58.776

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1,296

$58.776

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IDEA Electronic Components Group

UK . 1,858 parts In-Stock

1+ parts

$59.975

100+ parts

$56.976

1k+ parts

$53.978

10k+ parts

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1,858

$59.975

$56.976

$53.978

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ChromeModa Solutions

Germany . 364 parts In-Stock

1+ parts

$59.975

100+ parts

$49.180

1k+ parts

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364

$59.975

$49.180

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QUARKTWIN TECHNOLOGY LTD

USA . 15,035 parts In-Stock

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15,035

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Cyclops Electronics Ltd (Excess)

UK . 23 parts In-Stock

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23

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Overview

Unlock the power of digital signal processing with the TMS320DM6433ZDU7 by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This DSP offers seamless integration, high-speed performance, and low power consumption, making it ideal for a wide range of applications. Whether you're working on audio processing, image recognition, or telecommunications, this versatile processor delivers unmatched value and reliability. Stay ahead of the curve with Texas Instruments' innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for portable devices.

Integrated Cache: YES

Integrated cache helps in improving the processing speed by storing frequently used data, enhancing overall performance.

Maximum Supply Voltage: 1.26 V

Operating at a lower maximum supply voltage helps in reducing power consumption and heat generation, making the product more energy efficient.

No. of DMA Channels: 72

Having a high number of DMA channels allows for efficient data transfer between peripherals and memory, enhancing the product's performance.

Maximum Clock Frequency: 27 MHz

With a high maximum clock frequency, the product can handle complex signal processing tasks quickly and efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6433ZDU7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

ROM Programmability:

MROM

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6433ZDU7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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