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TMS320DM642AGNZA6

Texas Instruments

TMS320DM642AGNZA6 by Texas Instruments

TMS320DM642AGNZA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.19 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode capability.

Median Price

$89.493

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 642 parts In-Stock

1+ parts

$89.493

100+ parts

$79.549

1k+ parts

$58.492

10k+ parts

-

642

$89.493

$79.549

$58.492

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$66.509

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$66.509

-

-

-

Digiode

USA . 4,399 parts In-Stock

1+ parts

$85.018

100+ parts

-

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-

10k+ parts

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4,399

$85.018

-

-

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Vyrian

USA . 7,841 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,841

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$13.492

100+ parts

-

1k+ parts

-

10k+ parts

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343

$13.492

-

-

-

Parana Technologies

USA . 2,047 parts In-Stock

1+ parts

$32.668

100+ parts

-

1k+ parts

$111.110

10k+ parts

-

2,047

$32.668

-

$111.110

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DigiPath Technology Company

USA . 558 parts In-Stock

1+ parts

$35.972

100+ parts

$33.094

1k+ parts

-

10k+ parts

-

558

$35.972

$33.094

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-

ChromeModa Solutions

Germany . 5,298 parts In-Stock

1+ parts

$36.706

100+ parts

$30.099

1k+ parts

-

10k+ parts

-

5,298

$36.706

$30.099

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IDEA Electronic Components Group

UK . 2,029 parts In-Stock

1+ parts

$36.706

100+ parts

$34.871

1k+ parts

$33.035

10k+ parts

-

2,029

$36.706

$34.871

$33.035

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$65.178

100+ parts

-

1k+ parts

$62.571

10k+ parts

-

1,000

$65.178

-

$62.571

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Corohmni

South Africa . 1,232 parts In-Stock

1+ parts

$68.888

100+ parts

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1,232

$68.888

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Ampacity Inc.

Singapore . 630 parts In-Stock

1+ parts

$76.070

100+ parts

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630

$76.070

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Corphita

USA . 2,063 parts In-Stock

1+ parts

$80.544

100+ parts

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1k+ parts

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10k+ parts

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2,063

$80.544

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Microchip USA

USA . 125 parts In-Stock

1+ parts

$119.190

100+ parts

$117.600

1k+ parts

$117.600

10k+ parts

$116.010

125

$119.190

$117.600

$117.600

$116.010

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1,000

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Overview

Experience the power of Texas Instruments with the TMS320DM642AGNZA6 Digital Signal Processor. Designed for high-performance applications, this versatile DSP offers integrated cache and low power mode for optimal efficiency. With a wide range of applications in industries such as telecommunications, industrial automation, and automotive, the TMS320DM642AGNZA6 delivers unmatched value and reliability. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache reduces access time to frequently used data, improving overall processing speed.

Maximum Supply Voltage: 1.44 V

Higher maximum supply voltage allows for flexibility in power input.

Address Bus Width: 23

Wider address bus allows for a larger memory address space, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

Square shape makes it easier for the package to be mounted in various orientations, increasing flexibility in design.

Bit Size: 32

32-bit architecture enables the DSP to process larger chunks of data at a time, improving efficiency.

Power Supplies (V): 1.4,3.3

Having multiple power supply options provides compatibility with different systems, increasing versatility.

No. of Terminals: 548

Having a high number of terminals allows for connectivity with multiple external components, enhancing functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and reliability compared to other package styles.

Minimum Supply Voltage: 1.36 V

Lower minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the DSP can perform reliably in various environmental conditions.

No. of External Interrupts: 4

Having multiple external interrupts allows for efficient handling of external events and communication with other devices.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, the DSP can function in extreme cold conditions without any issues.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability, ensuring proper connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making assembly and maintenance easier.

Maximum Seated Height: 2.8 mm

Low maximum seated height allows for a more compact design, saving space in the overall system.

RAM Words: 16384

Having a large RAM capacity enables the DSP to store and process a significant amount of data efficiently.

Width: 27 mm

Compact width size allows for easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan capability helps in debugging and testing the DSP during manufacturing and maintenance.

External Data Bus Width: 64

Wider external data bus allows for faster data transfer between the DSP and external devices, improving overall performance.

Maximum Clock Frequency: 75.19 MHz

High maximum clock frequency enables the DSP to process data at a faster rate, enhancing performance.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures proper soldering and reliability during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data transfer within the DSP, enhancing overall processing speed.

Length: 27 mm

Compact length size allows for easy integration into various electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can withstand harsh environmental conditions typical in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Having multiple peripheral IC types expands the versatility and compatibility of the DSP with various systems and devices.

No. of Timers: 3

Multiple timers allow for precise timing operations, essential for many applications requiring time-sensitive processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Terminal Form: BALL

Ball terminal form provides good electrical conductivity and mechanical stability, ensuring reliable connections.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance and reliability of the DSP.

No. of DMA Channels: 64

Having multiple DMA channels enables efficient data transfer between the DSP and external memory or peripherals without CPU intervention.

Terminal Pitch: 1 mm

Compact terminal pitch size allows for high-density mounting and space-saving on the PCB.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and accelerates processing speed, making the DSP ideal for applications requiring real-time computation.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the DSP can withstand multiple solder reflow cycles, ensuring long-term reliability in manufacturing and operation.

Low Power Mode: YES

Having a low power mode allows the DSP to conserve energy when not performing intensive tasks, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AGNZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AGNZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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