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TMS320DM642AGDKA6

Texas Instruments

TMS320DM642AGDKA6 by Texas Instruments

TMS320DM642AGDKA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.19 MHz. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$107.296

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 713 parts In-Stock

1+ parts

$89.493

100+ parts

$79.549

1k+ parts

$58.492

10k+ parts

-

713

$89.493

$79.549

$58.492

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Mouser Electronics

USA . 7 parts In-Stock

1+ parts

$125.100

100+ parts

$94.950

1k+ parts

-

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7

$125.100

$94.950

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 30 parts In-Stock

1+ parts

$78.390

100+ parts

-

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-

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30

$78.390

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Digiode

USA . 4,073 parts In-Stock

1+ parts

$85.018

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-

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4,073

$85.018

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Vyrian

USA . 7,629 parts In-Stock

1+ parts

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7,629

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Speed Components Ltd

Israel . 11 parts In-Stock

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11

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Distributors (Availability)

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$11.377

100+ parts

-

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192

$11.377

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-

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Corohmni

South Africa . 5,202 parts In-Stock

1+ parts

$37.035

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-

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5,202

$37.035

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Ampacity Inc.

Singapore . 145 parts In-Stock

1+ parts

$76.070

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145

$76.070

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Parana Technologies

USA . 656 parts In-Stock

1+ parts

$77.064

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656

$77.064

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Netroflash

USA . 100 parts In-Stock

1+ parts

$78.390

100+ parts

-

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$74.470

10k+ parts

$72.903

100

$78.390

-

$74.470

$72.903

Corphita

USA . 900 parts In-Stock

1+ parts

$80.544

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900

$80.544

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DigiPath Technology Company

USA . 1,694 parts In-Stock

1+ parts

$84.857

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1,694

$84.857

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ChromeModa Solutions

Germany . 4,557 parts In-Stock

1+ parts

$86.589

100+ parts

$71.003

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4,557

$86.589

$71.003

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IDEA Electronic Components Group

UK . 1,778 parts In-Stock

1+ parts

$86.589

100+ parts

$82.260

1k+ parts

$77.930

10k+ parts

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1,778

$86.589

$82.260

$77.930

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Microchip USA

USA . 264 parts In-Stock

1+ parts

$119.400

100+ parts

$117.800

1k+ parts

$117.800

10k+ parts

$116.210

264

$119.400

$117.800

$117.800

$116.210

Lixinc

USA . 13,819 parts In-Stock

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13,819

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A-Z Elektronik GmbH

Germany . 1,425 parts In-Stock

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1,425

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Overview

Experience the power of cutting-edge technology with the Texas Instruments TMS320DM642AGDKA6 Digital Signal Processor. As a leader in the industry, Texas Instruments delivers top-quality products that push boundaries and set new standards. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Take your projects to the next level with the TMS320DM642AGDKA6 and unlock a world of possibilities. Elevate your work with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable applications.

Integrated Cache: YES

The integrated cache helps to improve the performance of the DSP by reducing memory access times, making it suitable for high-speed processing tasks.

Surface Mount: YES

The surface mount capability makes installation and assembly easier, saving time and effort during production.

Maximum Supply Voltage: 1.44 V

The higher maximum supply voltage allows for flexibility in power requirements and compatibility with a wide range of power sources.

Address Bus Width: 23

The 23-bit address bus width enables the processor to access a large memory space, making it suitable for data-intensive applications.

Package Shape: SQUARE

The square package shape provides efficient use of space and easy integration into electronic systems.

Bit Size: 32

The 32-bit architecture of the DSP allows for processing of larger data sets and complex algorithms, making it powerful for demanding tasks.

Power Supplies (V): 1.4,3.3

The availability of multiple power supply options (1.4V and 3.3V) enhances versatility and compatibility with different system requirements.

No. of Terminals: 548

The large number of terminals enables connectivity with a variety of external devices, expanding the functionality of the DSP.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style provides good thermal performance and reliability, essential for high-performance applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM642AGDKA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

4096

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM642AGDKA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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