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TMS320C6747DZKBA3

Texas Instruments

TMS320C6747DZKBA3 by Texas Instruments

TMS320C6747DZKBA3 by Texas Instruments is a 32-bit DSP with integrated cache, 16-bit external data bus width, and max clock frequency of 30 MHz. Ideal for industrial applications requiring low power mode, it features 40 DMA channels and operates in temperature range of -40 to 85 °C.

Median Price

$19.300

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,680 parts In-Stock

1+ parts

$17.880

100+ parts

$15.618

1k+ parts

$10.771

10k+ parts

-

4,680

$17.880

$15.618

$10.771

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Chip1Stop

Japan . 14 parts In-Stock

1+ parts

$19.300

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-

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14

$19.300

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Mouser Electronics

USA . 270 parts In-Stock

1+ parts

$28.580

100+ parts

$19.690

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$19.400

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270

$28.580

$19.690

$19.400

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DigiKey

USA . 190 parts In-Stock

1+ parts

$28.580

100+ parts

$20.272

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$19.402

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190

$28.580

$20.272

$19.402

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Avnet

USA . 130 parts In-Stock

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-

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$18.389

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$16.928

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130

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$18.389

$16.928

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Distributors (In-Stock)

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Digiode

USA . 1,600 parts In-Stock

1+ parts

$16.986

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1,600

$16.986

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Vyrian

USA . 6,534 parts In-Stock

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Chip Stock

USA . 4,500 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,888 parts In-Stock

1+ parts

$15.200

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-

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1,888

$15.200

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Corphita

USA . 550 parts In-Stock

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$16.092

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550

$16.092

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Parana Technologies

USA . 1,250 parts In-Stock

1+ parts

$30.290

100+ parts

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$68.952

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1,250

$30.290

-

$68.952

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DigiPath Technology Company

USA . 452 parts In-Stock

1+ parts

$33.353

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452

$33.353

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ChromeModa Solutions

Germany . 3,908 parts In-Stock

1+ parts

$34.034

100+ parts

$27.908

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3,908

$34.034

$27.908

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IDEA Electronic Components Group

UK . 2,251 parts In-Stock

1+ parts

$34.034

100+ parts

$32.332

1k+ parts

$30.631

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2,251

$34.034

$32.332

$30.631

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Corohmni

South Africa . 690 parts In-Stock

1+ parts

$53.860

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690

$53.860

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QUARKTWIN TECHNOLOGY LTD

USA . 27,648 parts In-Stock

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27,648

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iodParts Technologies Inc.

India . 17,129 parts In-Stock

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Lixinc

USA . 5,528 parts In-Stock

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5,528

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A-Z Elektronik GmbH

Germany . 5,172 parts In-Stock

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Perfect Parts

USA . 2,108 parts In-Stock

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Continental Prestige Electronics

USA . 1,225 parts In-Stock

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Argo Parts USA

USA . 1,155 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 700 parts In-Stock

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700

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Aranea Global

USA . 500 parts In-Stock

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Kepictronics

USA . 481 parts In-Stock

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481

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Overview

Unlock the power of digital signal processing with the Texas Instruments TMS320C6747DZKBA3. Designed by a trusted manufacturer, this DSP offers unmatched quality and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Experience improved performance and efficiency with this state-of-the-art device. Choose the TMS320C6747DZKBA3 for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product.

Integrated Cache: YES

Integrated cache helps in faster processing and efficient handling of data.

Surface Mount: YES

Surface mount technology enables easy installation and space-saving design.

Maximum Supply Voltage: 1.32 V

Operating within 1.32 V supply voltage ensures energy efficiency and proper functionality.

Address Bus Width: 15

A wider address bus width allows for handling larger memory addresses and data transfers.

Package Shape: SQUARE

Square package shape helps in efficient layout and space utilization on PCBs.

Bit Size: 32

32-bit processing capability enables handling of complex computations and data manipulation.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply voltages enhances flexibility in different operational scenarios.

No. of Terminals: 256

A higher number of terminals provide more connectivity options and functionalities.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and reliability in demanding environments.

Minimum Supply Voltage: 1.14 V

Having a minimum supply voltage of 1.14 V ensures stable operation under varying conditions.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85°C allows the product to function in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliability in cold environments.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB mounting and better heat dissipation.

Maximum Seated Height: 2.05 mm

Low maximum seated height allows for compact and slim designs in electronic systems.

RAM Words: 8192

Larger RAM capacity with 8192 words enables efficient data storage and retrieval.

Width: 17 mm

Compact width of 17 mm allows for space-efficient design and integration in various applications.

Boundary Scan: YES

Boundary scan feature offers easy testing and debugging capabilities for the product.

External Data Bus Width: 16

Having an external data bus width of 16 enhances data transfer speed and efficiency.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz provides swift processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C supports lead-free soldering processes.

Internal Bus Architecture: SINGLE

Single internal bus architecture simplifies the design and enhances compatibility with other components.

Length: 17 mm

Compact length of 17 mm allows for space-saving integration in electronic systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for digital signal processing and other peripherals enhances the versatility of the product.

No. of Timers: 4

Having 4 timers offers precise timing control and synchronization in various applications.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation for efficient performance.

Terminal Form: BALL

Ball terminal form enables reliable connections and robust solder joints on the PCB.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2 V ensures consistent performance and power efficiency.

No. of DMA Channels: 40

Having 40 DMA channels provides efficient data transfer capabilities and minimizes CPU load.

Terminal Pitch: 1 mm

1 mm terminal pitch allows for easy soldering and assembly of the product on the PCB.

Format: FLOATING POINT

Support for floating-point format enables precise and accurate mathematical computations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, suitable for standard manufacturing processes.

Low Power Mode: YES

Low power mode option enhances energy efficiency and prolongs battery life in portable applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747DZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

No. of Timers:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747DZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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