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TMS320C6747CZKB4

Texas Instruments

TMS320C6747CZKB4 by Texas Instruments

TMS320C6747CZKB4 by Texas Instruments is a 32-bit DSP with 13-bit address bus, 16-bit external data bus, and max clock frequency of 50 MHz. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in commercial temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,605 parts In-Stock

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Digiode

USA . 301 parts In-Stock

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301

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One Stop Electronics

USA . 1,251 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 516 parts In-Stock

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$10.052

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Parana Technologies

USA . 113 parts In-Stock

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$59.931

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DigiPath Technology Company

USA . 594 parts In-Stock

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$65.991

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594

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ChromeModa Solutions

Germany . 3,691 parts In-Stock

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$67.338

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$55.217

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$67.338

$55.217

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IDEA Electronic Components Group

UK . 854 parts In-Stock

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$67.338

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$63.971

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$60.604

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854

$67.338

$63.971

$60.604

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Corohmni

South Africa . 3,028 parts In-Stock

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$70.575

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Microchip USA

USA . 3,106 parts In-Stock

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Corphita

USA . 2,791 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,265 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6747CZKB4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are not only reliable but also versatile. The TMS320C6747CZKB4 is perfect for a wide range of applications, offering customers unmatched value, performance, and efficiency. Whether you're looking to enhance audio processing, improve image recognition, or boost network performance, this DSP is the solution you've been searching for.Upgrade your projects today with the TMS320C6747CZKB4 and experience the difference Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and protection against external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount technology provides a compact and efficient way of mounting components onto circuit boards, allowing for a smaller form factor and better overall performance.

Maximum Supply Voltage: 1.35 V

The low maximum supply voltage helps in reducing power consumption and heat generation, leading to better energy efficiency and prolonged battery life.

Bit Size: 32

A higher bit size allows for more complex calculations and processing capabilities, making this product suitable for applications requiring advanced signal processing.

RAM Words: 8192

With a large RAM capacity, this product can store and process a significant amount of data at a faster rate, enhancing the overall performance and efficiency of the device.

Maximum Clock Frequency: 50 MHz

The high clock frequency enables faster data processing and response times, making this product ideal for applications that require real-time signal processing and high-speed data transfers.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6747CZKB4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6747CZKB4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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