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TMS320C6746BZWT4

Texas Instruments

TMS320C6746BZWT4 by Texas Instruments

TMS320C6746BZWT4 by Texas Instruments is a 32-bit DSP with 23-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications, it features low power mode, 1.25-1.35 V supply voltage range, and a compact square package with 361 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,569 parts In-Stock

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Digiode

USA . 3,607 parts In-Stock

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ComSIT Distribution GmbH

Germany . 15 parts In-Stock

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ComSIT USA

USA . 15 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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Dan-Mar Components

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AZTECH Wire

Italy . 520 parts In-Stock

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$5.723

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Corohmni

South Africa . 625 parts In-Stock

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$23.054

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Parana Technologies

USA . 1,234 parts In-Stock

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$23.981

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$24.634

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One Stop Electronics

USA . 560 parts In-Stock

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DigiPath Technology Company

USA . 2,197 parts In-Stock

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ChromeModa Solutions

Germany . 865 parts In-Stock

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$22.095

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IDEA Electronic Components Group

UK . 16 parts In-Stock

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Component Stockers USA

USA . 206 parts In-Stock

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Corphita

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Microchip USA

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Overview

Elevate your digital signal processing capabilities with the Texas Instruments TMS320C6746BZWT4. As a leader in the industry, Texas Instruments delivers top-quality products trusted by professionals worldwide. This DSP offers unparalleled performance and efficiency for a wide range of applications, making it the perfect choice for those looking to take their projects to the next level. With advanced features and reliable functionality, this processor provides exceptional value and benefits that will exceed your expectations. Upgrade your system today with the TMS320C6746BZWT4 and experience the difference Texas Instruments can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material is durable and lightweight, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.35 V

Low maximum supply voltage helps in reducing power consumption and heat generation, contributing to energy efficiency.

Address Bus Width: 23

Wider address bus width allows for efficient communication with external memory, enhancing overall processing speed and performance.

Bit Size: 32

32-bit architecture allows for handling of complex mathematical operations and large data sets, making the product suitable for signal processing tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Multiple power supply options provide flexibility in system design and compatibility with various power sources.

No. of Terminals: 361

A high number of terminals allow for versatile connectivity options and integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style enables easy mounting, efficient heat dissipation, and compact design for space-constrained applications.

Minimum Supply Voltage: 1.25 V

Having a low minimum supply voltage ensures stable operation even under low power conditions, increasing energy efficiency.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature tolerance makes the product suitable for industrial and harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature rating ensures reliable performance even in cold environments.

Terminal Finish: TIN SILVER COPPER

Terminal finish with a combination of tin, silver, and copper provides good conductivity, corrosion resistance, and solderability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout, enhances signal integrity, and allows for efficient heat dissipation.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables slim and compact device designs, ideal for portable and space-constrained applications.

RAM Words: 8192

Large RAM capacity allows for efficient data storage and quick access, enhancing the processing capabilities of the DSP.

Width: 16 mm

Compact width dimensions facilitate space-saving integration into electronic devices and PCB layouts.

Boundary Scan: YES

Boundary scan feature enables efficient testing, debugging, and monitoring of the device during manufacturing and in-field operations.

External Data Bus Width: 16

Matched external data bus width facilitates seamless data transfer between the processor and external peripherals, improving performance.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency supports fast data processing and real-time signal handling, suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum reflow time ensures reliable soldering and prevents component damage during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures proper soldering and assembly reliability during the manufacturing process.

Internal Bus Architecture: SINGLE

Single internal bus architecture simplifies the design, reduces complexity, and improves system efficiency.

Length: 16 mm

Compact length dimensions offer versatility in product design, allowing for integration in various electronic applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral functionality, the product offers enhanced signal processing capabilities for diverse applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Terminal Form: BALL

Ball terminal form facilitates easy and reliable connections during device assembly and ensures good electrical contact.

Nominal Supply Voltage: 1.3 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the digital signal processor.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high terminal density, enabling compact device design and efficient PCB routing.

Format: FLOATING POINT

Floating-point format supports accurate representation and processing of decimal numbers, essential for complex mathematical computations in signal processing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring appropriate handling and packaging to prevent damage.

Low Power Mode: YES

Low power mode feature enables the processor to operate efficiently at reduced power consumption levels, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6746BZWT4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.35 V

Minimum Supply Voltage:

1.25 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6746BZWT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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