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TMS320C6745BPTP3

Texas Instruments

TMS320C6745BPTP3 by Texas Instruments

TMS320C6745BPTP3 by Texas Instruments is a 32-bit DSP with 16-bit address and data bus width, operating at max 30 MHz. It features low power mode, floating-point format, and boundary scan support. Ideal for digital signal processing applications requiring high-speed computation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,136 parts In-Stock

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Digiode

USA . 2,824 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 493 parts In-Stock

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$15.783

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One Stop Electronics

USA . 1,300 parts In-Stock

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$24.000

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Parana Technologies

USA . 614 parts In-Stock

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$58.667

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ChromeModa Solutions

Germany . 2,779 parts In-Stock

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$65.918

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$54.053

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2,779

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$54.053

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IDEA Electronic Components Group

UK . 2,179 parts In-Stock

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$65.918

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$62.622

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$59.326

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2,179

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$59.326

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Corohmni

South Africa . 759 parts In-Stock

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$84.836

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759

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DigiPath Technology Company

USA . 787 parts In-Stock

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$59.432

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Microchip USA

USA . 345 parts In-Stock

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Corphita

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Overview

Experience the cutting-edge technology of the TMS320C6745BPTP3 from Texas Instruments, a top-tier manufacturer known for its high-quality products. This Digital Signal Processor (DSP) offers unparalleled performance and versatility in a compact package, making it ideal for a wide range of applications. With features like low power mode and a maximum clock frequency of 30 MHz, this product provides superior value and benefits to customers looking for reliable and efficient signal processing solutions. Trust Texas Instruments to deliver innovation and excellence with the TMS320C6745BPTP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and inexpensive, making the DSP easier to handle and cost-effective.

Surface Mount: YES

Surface mounting allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.32 V

Operates efficiently within a low voltage range, reducing power consumption and heat generation.

Address Bus Width: 16

The wide address bus width allows for efficient data transfer and processing capabilities.

Package Shape: SQUARE

The square package shape is compact and space-saving, ideal for densely populated circuit boards.

Bit Size: 32

A 32-bit architecture provides high processing power and precision for demanding signal processing tasks.

Power Supplies (V): 1.2,1.8,3.3

Offers flexibility in power supply options, accommodating a variety of system requirements.

No. of Terminals: 176

With a high number of terminals, this DSP can support a wide range of input and output connections.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The various package styles offer compatibility with different mounting and cooling options for versatile integration.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for efficient power usage and extends battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6745BPTP3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

176

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6745BPTP3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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