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TMS320C6742BZWT2

Texas Instruments

TMS320C6742BZWT2 by Texas Instruments

TMS320C6742BZWT2 by Texas Instruments is a 32-bit DSP with 23-bit address bus, operating at max 30 MHz. Ideal for digital signal processing applications, it features low power mode, 1.14-1.32 V supply voltage range, and 8192 RAM words for efficient data processing.

Median Price

$9.110

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 429 parts In-Stock

1+ parts

$9.110

100+ parts

$8.930

1k+ parts

$8.750

10k+ parts

-

429

$9.110

$8.930

$8.750

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,924 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,924

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-

-

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Digiode

USA . 4,306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,306

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 365 parts In-Stock

1+ parts

$15.528

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$15.528

-

-

-

One Stop Electronics

USA . 1,431 parts In-Stock

1+ parts

$32.000

100+ parts

-

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1,431

$32.000

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-

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Parana Technologies

USA . 2,019 parts In-Stock

1+ parts

$51.656

100+ parts

-

1k+ parts

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2,019

$51.656

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-

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DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

$56.880

100+ parts

$52.330

1k+ parts

-

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-

1,302

$56.880

$52.330

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-

ChromeModa Solutions

Germany . 5,269 parts In-Stock

1+ parts

$58.041

100+ parts

$47.594

1k+ parts

-

10k+ parts

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5,269

$58.041

$47.594

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-

IDEA Electronic Components Group

UK . 1,491 parts In-Stock

1+ parts

$58.041

100+ parts

$55.139

1k+ parts

$52.237

10k+ parts

-

1,491

$58.041

$55.139

$52.237

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Corohmni

South Africa . 379 parts In-Stock

1+ parts

$81.157

100+ parts

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379

$81.157

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QUARKTWIN TECHNOLOGY LTD

USA . 22,203 parts In-Stock

1+ parts

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22,203

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Corphita

USA . 2,852 parts In-Stock

1+ parts

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2,852

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Microchip USA

USA . 458 parts In-Stock

1+ parts

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458

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Overview

Experience unparalleled performance and reliability with the TMS320C6742BZWT2 by Texas Instruments, a leading manufacturer in the industry. As a cutting-edge Digital Signal Processor (DSP), this product offers endless possibilities in applications such as audio processing, telecommunications, and industrial control systems. With its advanced technology and low power mode, customers can expect superior quality, efficiency, and value like never before. Upgrade your projects today with the TMS320C6742BZWT2 and unlock a world of innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the DSP lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and secure mounting on circuit boards, enabling efficient manufacturing processes.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage ensures stable and reliable performance under varying voltage conditions.

Address Bus Width: 23

The wide address bus width of 23 enhances the memory addressing capability, enabling efficient data processing and storage.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for space-saving integration into electronic devices.

Bit Size: 32

The 32-bit size offers high computational power and precision, making the DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.2,1.8/3.3

The availability of multiple power supply options allows for flexibility in different voltage requirements, catering to diverse applications.

No. of Terminals: 361

With a high number of terminals, the DSP can support connectivity with various external components and interfaces, expanding its capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers efficient heat dissipation, space utilization, and compatibility with modern electronic designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy-efficient operation and minimizes power consumption during low-power mode.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain performance in demanding thermal environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold conditions, expanding the range of applicable environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity, corrosion resistance, and solderability for robust connections.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easier PCB layout and assembly, enhancing the overall manufacturability of the product.

Maximum Seated Height: 1.4 mm

With a low maximum seated height, the DSP can be integrated into compact devices and still allow for proper airflow and cooling.

RAM Words: 8192

The large RAM capacity of 8192 words enables efficient data storage and processing, supporting complex algorithms and real-time applications.

Width: 16 mm

The compact width of 16 mm allows for space-efficient placement on the PCB, contributing to overall system miniaturization.

Boundary Scan: YES

The presence of boundary scan capability allows for comprehensive testing and debugging of the DSP during manufacturing and maintenance, ensuring product quality and reliability.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer with external devices, improving overall system performance and data throughput.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30 MHz ensures rapid signal processing and execution of instructions, suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, the DSP can undergo solder reflow processes without compromising its reliability and performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and bonding of the DSP to the PCB, maintaining electrical connections under thermal stress.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data transfer and communication within the DSP, improving efficiency and reducing complexity in the system design.

Length: 16 mm

The short length of 16 mm contributes to the compact form factor of the DSP, enabling integration into space-constrained applications without sacrificing performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With peripheral IC type as a digital signal processor and other functionalities, the DSP offers versatility in signal processing tasks and supports a wide range of applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and compatibility with modern integrated circuits, enhancing the overall performance and efficiency of the DSP.

Terminal Form: BALL

Having a terminal form of balls improves solder joint reliability, thermal performance, and electrical connections, enhancing the durability and longevity of the DSP.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V offers a stable operating voltage for the DSP, ensuring consistent and reliable performance in various operating conditions.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8 mm facilitates high-density mounting and interconnection of the DSP, enhancing PCB space utilization and enabling complex system designs.

Format: FLOATING POINT

The floating-point format allows for precise and efficient mathematical computations, supporting complex algorithms and accurate signal processing tasks in real-time applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate exposure to moisture during handling and storage, ensuring product integrity and reliability under typical environmental conditions.

Low Power Mode: YES

The availability of a low power mode allows the DSP to operate efficiently at reduced power levels, prolonging battery life and improving energy efficiency in portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6742BZWT2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6742BZWT2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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