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TMS320C6727GDH300

Texas Instruments

TMS320C6727GDH300 by Texas Instruments

TMS320C6727GDH300 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 25 MHz clock frequency, and 1.2-3.3 V power supplies. Ideal for digital signal processing applications due to its floating-point format, boundary scan capability, and multiple internal bus architecture.

Median Price

$14.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$13.430

1k+ parts

$12.020

10k+ parts

$11.310

68

-

$13.430

$12.020

$11.310

DigiKey

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$15.530

1k+ parts

-

10k+ parts

-

68

-

$15.530

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,345 parts In-Stock

1+ parts

$14.184

100+ parts

-

1k+ parts

-

10k+ parts

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3,345

$14.184

-

-

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Vyrian

USA . 7,517 parts In-Stock

1+ parts

-

100+ parts

-

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7,517

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-

-

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DigiKey Marketplace

USA . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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68

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,417 parts In-Stock

1+ parts

$13.437

100+ parts

-

1k+ parts

-

10k+ parts

-

3,417

$13.437

-

-

-

Parana Technologies

USA . 1,121 parts In-Stock

1+ parts

$34.736

100+ parts

-

1k+ parts

-

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1,121

$34.736

-

-

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ChromeModa Solutions

Germany . 4,518 parts In-Stock

1+ parts

$39.029

100+ parts

$32.004

1k+ parts

-

10k+ parts

-

4,518

$39.029

$32.004

-

-

IDEA Electronic Components Group

UK . 738 parts In-Stock

1+ parts

$39.029

100+ parts

$37.078

1k+ parts

$35.126

10k+ parts

-

738

$39.029

$37.078

$35.126

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Microchip USA

USA . 244 parts In-Stock

1+ parts

$40.120

100+ parts

$39.550

1k+ parts

$39.260

10k+ parts

$38.980

244

$40.120

$39.550

$39.260

$38.980

Corohmni

South Africa . 13 parts In-Stock

1+ parts

$46.339

100+ parts

-

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-

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13

$46.339

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QUARKTWIN TECHNOLOGY LTD

USA . 4,903 parts In-Stock

1+ parts

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4,903

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DigiPath Technology Company

USA . 87 parts In-Stock

1+ parts

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100+ parts

$35.189

1k+ parts

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10k+ parts

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87

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$35.189

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Overview

Experience unparalleled performance and efficiency with the TMS320C6727GDH300 by Texas Instruments, a leading manufacturer in Digital Signal Processors. This powerful DSP offers a wide range of applications in various industries, providing customers with advanced processing capabilities and seamless integration. With its high-quality package body material and cutting-edge technology, this product delivers exceptional value and benefits to users, making it the ultimate choice for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the internal components of the DSP.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the DSP onto a circuit board.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 32

A wider address bus allows for a larger memory address space, enabling more complex processing tasks.

Package Shape: SQUARE

The square package shape helps in efficient use of space on a circuit board.

Bit Size: 32

The 32-bit architecture allows for processing of data in larger chunks, leading to faster performance.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages enables compatibility with different systems.

No. of Terminals: 256

A higher number of terminals allow for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides better mechanical support and thermal performance.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and heat generation.

Terminal Position: BOTTOM

The bottom terminal position ensures easy and secure connections to the circuit board.

Maximum Seated Height: 2.02 mm

The low maximum seated height allows for a compact design, suitable for space-constrained applications.

RAM Words: 262144

A large RAM size enables storage of a significant amount of data for processing.

Width: 17 mm

The compact width makes the DSP suitable for integration into small form factor devices.

Boundary Scan: YES

Boundary scan support simplifies testing and troubleshooting during manufacturing and maintenance.

External Data Bus Width: 32

The wide external data bus width allows for efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency enables fast processing of data and real-time operations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures provide flexibility in data routing and communication within the DSP.

Length: 17 mm

The compact length complements the width, making the DSP suitable for compact designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances the connectivity and functionality of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the DSP.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies the assembly process.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage for consistent performance.

Terminal Pitch: 1 mm

The narrow terminal pitch allows for dense packing of terminals, saving space on the circuit board.

Format: FLOATING POINT

Support for floating-point format enhances the precision and accuracy of mathematical calculations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727GDH300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

NO

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727GDH300 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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