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TMS320C6722BRFP250

Texas Instruments

TMS320C6722BRFP250 by Texas Instruments

TMS320C6722BRFP250 by Texas Instruments is a 32-bit digital signal processor (DSP) with integrated cache and an on-chip data RAM width of 8. It is commonly used in applications such as audio processing, telecommunications, and industrial control systems.

Median Price

$26.540

Lifecycle Status

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Texas Instruments

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Mouser Electronics

USA . 97 parts In-Stock

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$26.540

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$19.200

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97

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DigiKey

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Nova Conductors

Japan . 550 parts In-Stock

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Digiode

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Vyrian

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TME

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Continental Prestige Electronics

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Netroflash

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Ampacity Inc.

Singapore . 172 parts In-Stock

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$15.780

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Corphita

USA . 3,595 parts In-Stock

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Corohmni

South Africa . 5,106 parts In-Stock

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Parana Technologies

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USA . 462 parts In-Stock

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$76.369

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ChromeModa Solutions

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IDEA Electronic Components Group

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$80.469

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$76.234

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Perfect Parts

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Overview

Experience the power of digital signal processing with the TMS320C6722BRFP250 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The TMS320C6722BRFP250 is a versatile processor with numerous applications that include audio processing, telecommunications, and industrial automation. This cutting-edge product offers unmatched value and benefits to customers, thanks to its integrated cache, high-speed performance, and advanced features. With Texas Instruments, you can trust that you're getting a product that exceeds expectations and empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the DSP, making it resistant to physical damage and suitable for various environments.

Integrated Cache:

YES - The integrated cache enhances the processor's performance by storing frequently used data, allowing for faster access and improved overall processing speed.

Surface Mount:

YES - The surface mount feature enables easy and efficient installation of the DSP onto a circuit board, saving time and reducing production costs.

Maximum Supply Voltage:

1.32 V - With a higher maximum supply voltage, this DSP can handle more power, ensuring stable and reliable operation even under demanding conditions.

On Chip Data RAM Width:

8 - The wider data RAM width allows for larger data transfer and storage capabilities, enabling the DSP to handle complex signal processing tasks effectively.

Address Bus Width:

32 - The wide address bus width enables the DSP to access a large memory space, accommodating extensive data storage and ensuring efficient data retrieval.

Package Shape:

SQUARE - The square package shape provides better space utilization and compatibility with standard board layouts, optimizing the integration of the DSP into the system.

Bit Size:

32 - The 32-bit architecture allows for enhanced precision and accuracy in digital signal processing, resulting in high-quality output and improved overall performance.

Power Supplies (V):

1.2,3.3 - This DSP supports multiple power supply voltages, providing flexibility and compatibility with different system requirements.

No. of Terminals:

144 - With a large number of terminals, the DSP can accommodate various input and output connections, enabling seamless integration with external components.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - The combination of these package styles offers compactness, ease of assembly, and efficient signal transmission, making this DSP suitable for space-constrained applications.

Minimum Supply Voltage:

1.14 V - The low minimum supply voltage ensures reliable operation under low power conditions, making it energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature:

90 °C - The high maximum operating temperature allows the DSP to withstand harsh environmental conditions, ensuring consistent performance in demanding applications.

Minimum Operating Temperature:

0 °C - With a low minimum operating temperature, this DSP is suitable for use in cold environments, ensuring reliable operation even in extreme conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD - The terminal finish enhances the DSP's conductivity, corrosion resistance, and reliability, ensuring secure and long-lasting connections.

Terminal Position:

QUAD - The quad terminal position simplifies installation and connection processes, reducing the chance of errors and facilitating efficient integration into electronic systems.

Maximum Seated Height:

1.2 mm - The low maximum seated height allows for compact and space-efficient designs, enabling the use of the DSP in miniaturized electronic devices.

RAM Words:

131072 - With a large number of RAM words, this DSP can handle extensive data processing and storage, accommodating complex signal processing requirements.

Width:

20 mm - The compact width of the DSP enables efficient space utilization on circuit boards, facilitating integration into tight layouts and reducing overall system size.

Boundary Scan:

YES - The boundary scan feature simplifies testing and debugging processes, ensuring proper functioning and easy maintenance of the DSP in the system.

External Data Bus Width:

32 - Supporting a wide external data bus width enables efficient data transfer between the DSP and external devices, facilitating seamless integration and fast information exchange.

Maximum Clock Frequency:

25 MHz - With a high maximum clock frequency, this DSP can execute instructions quickly, enabling rapid signal processing and reducing overall processing time.

Maximum Time At Peak Reflow Temperature (s):

30 - The DSP can withstand the peak reflow temperature for 30 seconds, ensuring proper soldering during manufacturing processes and avoiding heat-related damage.

Peak Reflow Temperature °C:

260 - With a high peak reflow temperature, this DSP can withstand the high temperatures experienced during manufacturing processes, ensuring reliable solder connections.

Internal Bus Architecture:

MULTIPLE - The multiple internal bus architecture enhances data throughput and ensures efficient communication between different components within the DSP, improving overall performance.

Length:

20 mm - The compact length of the DSP allows for space-efficient integration into electronic systems, making it suitable for applications with limited space availability.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - This versatile DSP can handle various peripheral IC types, making it adaptable to different signal processing requirements and ensuring compatibility with a wide range of applications.

Technology:

CMOS - The CMOS technology used in this DSP offers low power consumption, high speed, and excellent noise immunity, making it an energy-efficient and reliable choice for signal processing applications.

Terminal Form:

GULL WING - The gull wing terminal form allows for easy soldering and secure connections, simplifying the assembly process and ensuring reliable performance of the DSP.

Nominal Supply Voltage:

1.2 V - The nominal supply voltage provides the recommended operating voltage for the DSP, ensuring stable and efficient performance under normal operating conditions.

No. of DMA Channels:

16 - With a significant number of DMA channels, this DSP can efficiently manage data transfer between different devices, improving overall system performance and responsiveness.

ROM Programmability:

MROM - The MROM (Mask-Read-Only Memory) programmability allows for permanent storage of instructions within the DSP, ensuring secure and stable operation without the risk of accidental modification.

Terminal Pitch:

0.5 mm - The small terminal pitch facilitates miniaturized circuit board designs, enabling compact system layouts and making this DSP ideal for space-constrained applications.

Format:

FLOATING POINT - Supporting floating-point format enables precise and accurate mathematical operations, making this DSP suitable for applications that require high computational accuracy.

Moisture Sensitivity Level (MSL):

4 - With an MSL of 4, this DSP can withstand moderate humidity levels during storage and handling, ensuring the product's reliability and avoiding moisture-related damage.

On Chip Program ROM Width:

8 - The wide program ROM width allows for extensive program storage, enabling the DSP to handle complex algorithms and perform advanced signal processing tasks effectively.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6722BRFP250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3 I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

16

No. of Terminals:

144

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320C6722BRFP250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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