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TMS320C6712GFN100

Texas Instruments

TMS320C6712GFN100 by Texas Instruments

TMS320C6712GFN100 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 16-bit external data bus, and max clock frequency of 100 MHz. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,424 parts In-Stock

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2,424

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Vyrian

USA . 2,395 parts In-Stock

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2,395

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Greenchips

USA . 4 parts In-Stock

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4

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SIE Connect GmbH - GreenChips

Germany . 4 parts In-Stock

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4

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Distributors (Availability)

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One Stop Electronics

USA . 1,072 parts In-Stock

1+ parts

$7.000

100+ parts

-

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1,072

$7.000

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AZTECH Wire

Italy . 451 parts In-Stock

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$13.248

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451

$13.248

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Parana Technologies

USA . 480 parts In-Stock

1+ parts

$36.828

100+ parts

$3,420.057

1k+ parts

$33.145

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480

$36.828

$3,420.057

$33.145

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DigiPath Technology Company

USA . 1,611 parts In-Stock

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$40.552

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1,611

$40.552

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ChromeModa Solutions

Germany . 4,994 parts In-Stock

1+ parts

$41.380

100+ parts

$33.932

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4,994

$41.380

$33.932

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IDEA Electronic Components Group

UK . 1,244 parts In-Stock

1+ parts

$41.380

100+ parts

$39.311

1k+ parts

$37.242

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1,244

$41.380

$39.311

$37.242

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Corohmni

South Africa . 28 parts In-Stock

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$77.339

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28

$77.339

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Corphita

USA . 2,177 parts In-Stock

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Microchip USA

USA . 161 parts In-Stock

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Perfect Parts

USA . 15 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6712GFN100 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This versatile DSP is perfect for a wide range of applications, providing unparalleled performance and efficiency. With its advanced features and innovative design, the TMS320C6712GFN100 offers unmatched value and benefits to customers looking to elevate their projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is cost-effective and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mounting allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.89 V

Operating at a maximum supply voltage of 1.89V ensures energy efficiency and prevents overheating, improving product longevity.

Address Bus Width: 22

A wider address bus allows for faster data transfer and processing, enhancing the performance of the DSP.

Package Shape: SQUARE

Square package shape optimizes space utilization on the PCB, enabling compact and efficient system designs.

Bit Size: 32

32-bit architecture provides high computational accuracy and efficiency, making the DSP suitable for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexible integration into various electronic systems, enhancing compatibility.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options, enabling versatile interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array package style offers high pin density and efficient heat dissipation, enhancing overall reliability and performance.

Minimum Supply Voltage: 1.71 V

Operating at a minimum supply voltage of 1.71V ensures reliable operation even under low power conditions, improving energy efficiency.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, improving signal integrity and reducing electromagnetic interference.

Maximum Seated Height: 2.32 mm

Low maximum seated height minimizes space requirements, facilitating integration into compact devices and systems.

RAM Words: 16384

Availability of 16384 RAM words provides sufficient memory capacity for storing and processing data in real-time applications.

Width: 27 mm

Compact width dimension allows for easy integration into space-constrained designs, ensuring versatility in various system configurations.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP, ensuring reliable performance and ease of maintenance.

External Data Bus Width: 16

16-bit external data bus width ensures efficient data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 100 MHz

Operating at a maximum clock frequency of 100MHz enables fast signal processing and high-speed data throughput, suitable for demanding applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and supports parallel processing, improving overall computational performance.

Length: 27 mm

Compact length dimension allows for seamless integration into space-limited designs, enhancing versatility and flexibility in system configurations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types extends compatibility and functionality, enabling diverse applications and system architectures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy efficiency and reliable operation in diverse environments.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring robust connections and high reliability in demanding operating conditions.

Nominal Supply Voltage: 1.8 V

Operating at a nominal supply voltage of 1.8V ensures stable and efficient performance, meeting industry-standard power requirements.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm allows for reliable and precise connections, ensuring signal integrity and high-speed data transfer.

Format: FLOATING POINT

Floating-point format enables high-precision mathematical computations, making the DSP suitable for complex algorithm processing and signal analysis.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and extends battery life, making the DSP ideal for portable and battery-operated devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6712GFN100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6712GFN100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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