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TMS320C6711DGDP250

Texas Instruments

TMS320C6711DGDP250 by Texas Instruments

TMS320C6711DGDP250 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and 65536 RAM words. It operates at up to 250 MHz clock frequency and features integrated cache. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$28.460

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 696 parts In-Stock

1+ parts

$26.169

100+ parts

$23.261

1k+ parts

$17.104

10k+ parts

-

696

$26.169

$23.261

$17.104

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$39.240

100+ parts

$29.410

1k+ parts

$27.120

10k+ parts

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2

$39.240

$29.410

$27.120

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Rochester

USA . 10,174 parts In-Stock

1+ parts

-

100+ parts

$24.600

1k+ parts

$22.010

10k+ parts

$20.710

10,174

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$24.600

$22.010

$20.710

DigiKey

USA . 10,174 parts In-Stock

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Verical

USA . 9,778 parts In-Stock

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$30.750

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$27.512

10k+ parts

$25.887

9,778

-

$30.750

$27.512

$25.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,692 parts In-Stock

1+ parts

$22.572

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-

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2,692

$22.572

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DigiKey Marketplace

USA . 10,214 parts In-Stock

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Vyrian

USA . 2,855 parts In-Stock

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2,855

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,894 parts In-Stock

1+ parts

$20.200

100+ parts

-

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5,894

$20.200

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Corphita

USA . 827 parts In-Stock

1+ parts

$21.384

100+ parts

-

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827

$21.384

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Corohmni

South Africa . 973 parts In-Stock

1+ parts

$29.620

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973

$29.620

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Microchip USA

USA . 2,490 parts In-Stock

1+ parts

$56.830

100+ parts

$55.840

1k+ parts

$55.350

10k+ parts

$54.860

2,490

$56.830

$55.840

$55.350

$54.860

Parana Technologies

USA . 2,378 parts In-Stock

1+ parts

$59.128

100+ parts

-

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2,378

$59.128

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ChromeModa Solutions

Germany . 3,581 parts In-Stock

1+ parts

$66.436

100+ parts

$54.478

1k+ parts

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3,581

$66.436

$54.478

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IDEA Electronic Components Group

UK . 1,701 parts In-Stock

1+ parts

$66.436

100+ parts

$63.114

1k+ parts

$59.792

10k+ parts

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1,701

$66.436

$63.114

$59.792

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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DigiPath Technology Company

USA . 1,823 parts In-Stock

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$59.899

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1,823

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$59.899

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unleash the power of cutting-edge technology with the TMS320C6711DGDP250 by Texas Instruments. This top-of-the-line Digital Signal Processor (DSP) offers unparalleled performance and efficiency for a wide range of applications. With integrated cache and advanced features, this product delivers exceptional value to customers seeking high-quality solutions. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing and experience the benefits of superior processing capabilities with the TMS320C6711DGDP250. Elevate your projects to new heights with this innovative and reliable DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good thermal insulation and electrical insulation, making the product durable and reliable.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the DSP, enhancing its performance.

Maximum Supply Voltage: 1.47 V

Having a maximum supply voltage of 1.47 V ensures safe operation within specified power limits, preventing damage.

Address Bus Width: 22

A wider address bus width of 22 bits allows for larger memory addressing capacity, enabling more complex signal processing tasks.

Package Shape: SQUARE

Square package shape facilitates easy mounting and space-efficient PCB layout, contributing to overall system design simplicity.

Bit Size: 32

32-bit processing capability enables high-speed and efficient signal processing operations, suitable for a wide range of applications.

No. of Terminals: 272

Having 272 terminals allows for versatile connectivity options and integration possibilities, making the DSP suitable for diverse system configurations.

Power Supplies (V): 1.4,3.3

Support for multiple power supply voltages (1.4V, 3.3V) offers flexibility in system design and compatibility with various power sources.

Minimum Supply Voltage: 1.33 V

A minimum supply voltage of 1.33V ensures reliable operation even under low power conditions, enhancing the product's stability.

Maximum Operating Temperature: 90 °C

Capable of operating at temperatures up to 90°C, the DSP can handle demanding environmental conditions effectively without performance degradation.

No. of External Interrupts: 4

Having 4 external interrupts allows for efficient handling of external events and real-time signal processing, enhancing system responsiveness.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the DSP can operate reliably in a wide range of temperature environments, ensuring consistent performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and reliability during assembly, ensuring robust connections for long-term use.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and facilitates efficient heat dissipation, contributing to overall system thermal management.

Maximum Seated Height: 2.57 mm

A low maximum seated height of 2.57mm enables compact system designs and allows for easy integration in space-constrained applications.

RAM Words: 65536

With 65536 RAM words, the DSP offers ample memory capacity for storing and manipulating data, supporting complex signal processing algorithms.

Width: 27 mm

A width of 27mm provides a compact form factor, making the DSP suitable for small footprint applications where space is limited.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the DSP and enhances system reliability by detecting faults in the PCB assembly.

External Data Bus Width: 32

A wide external data bus width of 32 bits allows for fast data transfer rates and efficient communication with external devices, enhancing system performance.

Maximum Clock Frequency: 250 MHz

Support for a maximum clock frequency of 250MHz ensures high-speed processing capabilities, making the DSP suitable for real-time signal processing applications.

Peak Reflow Temperature °C: 220

With a peak reflow temperature of 220°C, the DSP can withstand standard solder reflow processes during manufacturing, ensuring reliable solder joints.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data transfer paths and enhances parallel processing capabilities, improving overall system performance.

Length: 27 mm

A length of 27mm complements the compact width of the DSP, allowing for a small form factor design suitable for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with various peripheral IC types, the DSP offers versatile connectivity options and integration possibilities for diverse applications.

No. of Timers: 2

Having 2 timers allows for precise timing control and synchronization of signal processing tasks, enhancing system functionality and performance.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and compatibility with various digital systems, making the DSP energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring reliable electrical connections and facilitating efficient PCB mounting.

Nominal Supply Voltage: 1.4 V

A nominal supply voltage of 1.4V ensures stable operation within specified power limits, providing consistent performance and reliability.

No. of DMA Channels: 16

Having 16 DMA channels enables efficient data transfer and offloads the CPU for other tasks, improving system performance and responsiveness.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization, enhancing the product's versatility and adaptability to changing requirements.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm facilitates PCB layout and assembly, ensuring precise connections and reliable performance in the system.

Format: FLOATING POINT

Support for floating-point format enables high-precision numerical calculations and complex signal processing algorithms, enhancing the DSP's computational capabilities.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the DSP can withstand moderate exposure to humidity during handling and assembly processes, ensuring long-term reliability.

Low Power Mode: YES

Low power mode functionality enhances energy efficiency and extends battery life, making the DSP suitable for power-constrained applications and portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6711DGDP250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6711DGDP250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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