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TMS320C6711BGFN150

Texas Instruments

TMS320C6711BGFN150 by Texas Instruments

TMS320C6711BGFN150 by Texas Instruments is a 32-bit DSP with 149.25 MHz clock frequency, 22-bit address bus width, and 32-bit external data bus width. Ideal for digital signal processing applications due to its floating-point format, low power mode, and boundary scan capability.

Median Price

$60.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 10 parts In-Stock

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$60.000

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10

$60.000

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Vyrian

USA . 6,468 parts In-Stock

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Digiode

USA . 2,025 parts In-Stock

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2,025

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Microfarads

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 357 parts In-Stock

1+ parts

$16.742

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357

$16.742

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One Stop Electronics

USA . 1,101 parts In-Stock

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$22.000

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$22.000

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Parana Technologies

USA . 2,281 parts In-Stock

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$37.050

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DigiPath Technology Company

USA . 2,094 parts In-Stock

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$40.796

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2,094

$40.796

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ChromeModa Solutions

Germany . 4,548 parts In-Stock

1+ parts

$41.629

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$34.136

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4,548

$41.629

$34.136

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IDEA Electronic Components Group

UK . 1,539 parts In-Stock

1+ parts

$41.629

100+ parts

$39.548

1k+ parts

$37.466

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1,539

$41.629

$39.548

$37.466

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Corohmni

South Africa . 2,719 parts In-Stock

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$66.120

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Corphita

USA . 4,472 parts In-Stock

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Microchip USA

USA . 395 parts In-Stock

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Overview

Discover the TMS320C6711BGFN150 by Texas Instruments, a top-tier manufacturer known for delivering high-quality Digital Signal Processors. This powerful processor offers unparalleled performance and efficiency, making it ideal for a wide range of applications. With advanced features and cutting-edge technology, this product provides exceptional value and benefits to customers looking to elevate their projects to the next level. Experience seamless operation and unmatched reliability with the TMS320C6711BGFN150 - your ultimate solution for all DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, reducing assembly time and cost.

Maximum Supply Voltage: 2 V

Operates efficiently with a maximum supply voltage of 2V, making it suitable for low power applications.

Address Bus Width: 22

Wide address bus width allows for efficient communication and processing of data.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on the circuit board.

Bit Size: 32

32-bit architecture provides high processing power and accuracy for complex signal processing tasks.

Power Supplies (V): 1.8,3.3

Supports multiple power supply voltages, enabling flexibility in design and power management.

No. of Terminals: 256

Ample terminals allow for efficient connectivity and data transfer within the system.

Package Style (Meter): GRID ARRAY

Grid array package style provides a compact and organized layout for the terminals, saving space on the circuit board.

Minimum Supply Voltage: 1.8 V

Supports low minimum supply voltage, ensuring energy efficiency and extended battery life in portable devices.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the circuit board.

Maximum Seated Height: 2.32 mm

Low seated height allows for compact and slim device design.

RAM Words: 18432

Large RAM capacity enables storage and manipulation of a significant amount of data for processing.

Width: 27 mm

Compact width dimension enables space-saving integration into small electronic devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging of the product during manufacturing.

External Data Bus Width: 32

Wide external data bus width facilitates high-speed data transfer and processing.

Maximum Clock Frequency: 149.25 MHz

High maximum clock frequency allows for fast and efficient signal processing operations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and processing efficiency.

Length: 27 mm

Compact length dimension enables space-saving integration into electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type ensures optimized processing of digital signals for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for efficient data transfer.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage ensures consistent performance and reliability of the product.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact placement of terminals and efficient connectivity.

Format: FLOATING POINT

Floating-point format enables high-precision arithmetic operations for accurate signal processing.

Low Power Mode: YES

Low power mode option enables energy-efficient operation, ideal for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6711BGFN150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

149.25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

18432

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6711BGFN150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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