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TMS320C6671ACYPA25

Texas Instruments

TMS320C6671ACYPA25 by Texas Instruments

TMS320C6671ACYPA25 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 144 DMA channels. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include multiple internal bus architecture, floating-point format, and boundary scan capability.

Median Price

$180.873

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 272 parts In-Stock

1+ parts

$180.873

100+ parts

$163.721

1k+ parts

$155.925

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272

$180.873

$163.721

$155.925

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Distributors (In-Stock)

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Digiode

USA . 291 parts In-Stock

1+ parts

$171.829

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291

$171.829

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Vyrian

USA . 6,999 parts In-Stock

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6,999

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Chip Stock

USA . 399 parts In-Stock

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399

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Distributors (Availability)

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AZTECH Wire

Italy . 896 parts In-Stock

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$15.620

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896

$15.620

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Parana Technologies

USA . 916 parts In-Stock

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$32.510

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$106.905

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916

$32.510

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$106.905

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DigiPath Technology Company

USA . 2,076 parts In-Stock

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$35.797

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2,076

$35.797

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IDEA Electronic Components Group

UK . 2,127 parts In-Stock

1+ parts

$36.528

100+ parts

$34.702

1k+ parts

$32.875

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2,127

$36.528

$34.702

$32.875

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ChromeModa Solutions

Germany . 288 parts In-Stock

1+ parts

$36.528

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$29.953

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288

$36.528

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Corohmni

South Africa . 2,157 parts In-Stock

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$53.552

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Corphita

USA . 2,172 parts In-Stock

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$162.786

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Microchip USA

USA . 1,265 parts In-Stock

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$261.954

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Perfect Parts

USA . 49 parts In-Stock

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Overview

Enhance your digital signal processing projects with the Texas Instruments TMS320C6671ACYPA25 DSP. Known for its top-notch quality and reliability, Texas Instruments delivers superior performance in the field of digital signal processors. This cutting-edge product offers a wide range of applications in various industries, providing customers with unmatched value, benefits, and advantages. Say goodbye to limitations and experience the power of innovation with the TMS320C6671ACYPA25 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making it ideal for consumer electronics and portable devices.

Integrated Cache: YES

Having an integrated cache helps improve the processing speed and efficiency of the DSP, making it suitable for applications that require fast data processing.

Maximum Supply Voltage: 1.05 V

Operating within a low voltage range helps reduce power consumption and heat generation, making the DSP suitable for energy-efficient devices.

Address Bus Width: 16

Having a wide address bus allows the DSP to access a larger memory space, making it suitable for applications that require handling a large amount of data.

Bit Size: 32

With a 32-bit architecture, the DSP can perform complex calculations and process data efficiently, making it suitable for demanding signal processing tasks.

Maximum Operating Temperature: 100 °C

Being able to operate at high temperatures makes the DSP suitable for industrial environments or applications where heat dissipation is a concern.

Technology: CMOS

CMOS technology is known for its low power consumption and high integration capabilities, making the DSP suitable for battery-powered devices or compact systems.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6671ACYPA25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

144

No. of Terminals:

841

No. of Timers:

18

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6671ACYPA25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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