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TMS320C6654CZHA7

Texas Instruments

TMS320C6654CZHA7 by Texas Instruments

TMS320C6654CZHA7 by Texas Instruments is a 32-bit DSP with 16-bit address bus, 32-bit external data bus, and CMOS technology. It is used in industrial applications for digital signal processing tasks due to its low power mode and floating-point format.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,668 parts In-Stock

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Digiode

USA . 1,306 parts In-Stock

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One Stop Electronics

USA . 1,373 parts In-Stock

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$8.000

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$8.000

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Ampacity Inc.

Singapore . 256 parts In-Stock

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$17.000

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256

$17.000

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AZTECH Wire

Italy . 466 parts In-Stock

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$18.619

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$18.619

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Parana Technologies

USA . 1,648 parts In-Stock

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$72.605

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Corohmni

South Africa . 5,055 parts In-Stock

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$73.756

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$73.756

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DigiPath Technology Company

USA . 2,228 parts In-Stock

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$79.947

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$73.552

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$79.947

$73.552

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ChromeModa Solutions

Germany . 3,478 parts In-Stock

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$81.579

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$66.895

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IDEA Electronic Components Group

UK . 1,017 parts In-Stock

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$81.579

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$77.500

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$73.421

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Corphita

USA . 4,501 parts In-Stock

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Overview

Experience the power of innovation with the TMS320C6654CZHA7 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-quality products that cater to a wide range of applications. The TMS320C6654CZHA7 offers unmatched value, benefits, and advantages to customers looking for cutting-edge technology. With its advanced features and high performance, this DSP ensures optimal functionality and reliability for your projects. Trust Texas Instruments to provide you with the best tools for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Address Bus Width: 16

Offers sufficient capacity to handle memory addressing requirements for processing complex digital signals.

Package Shape: SQUARE

Facilitates streamlined and compact design of the DSP, making it suitable for space-constrained applications.

No. of Terminals: 625

Provides ample connectivity options for interfacing with external devices and peripherals, enhancing the versatility of the DSP.

Maximum Operating Temperature: 100 °C

Ensures reliable performance even under high temperature environments, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates that the DSP is specifically designed for processing digital signals efficiently, making it a reliable choice for signal processing tasks.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance, making it an energy-efficient solution for digital signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6654CZHA7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B625

JESD-609 Code:

e1

Length:

21 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.99 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

TMS320C6654CZHA7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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