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TMS320C6455BGTZA

Texas Instruments

TMS320C6455BGTZA by Texas Instruments

TMS320C6455BGTZA by Texas Instruments is a 32-bit DSP with integrated cache, 64 DMA channels, and 66.6 MHz clock frequency. Ideal for industrial applications requiring high-speed processing and low power consumption. Features include 20-bit address bus width, 64-bit external data bus width, and boundary scan capability.

Median Price

$319.517

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$319.517

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$319.517

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Vyrian

USA . 4,225 parts In-Stock

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Digiode

USA . 2,542 parts In-Stock

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One Stop Electronics

USA . 675 parts In-Stock

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$13.000

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$13.000

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AZTECH Wire

Italy . 442 parts In-Stock

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$16.129

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Ampacity Inc.

Singapore . 1,231 parts In-Stock

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$22.000

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Parana Technologies

USA . 2,098 parts In-Stock

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$31.530

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$82.371

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$31.530

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DigiPath Technology Company

USA . 1,975 parts In-Stock

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$34.718

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$31.941

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$34.718

$31.941

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

1+ parts

$35.427

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$33.656

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$31.884

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$35.427

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$31.884

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ChromeModa Solutions

Germany . 1,107 parts In-Stock

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$35.427

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$29.050

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Corohmni

South Africa . 728 parts In-Stock

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$66.527

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Microchip USA

USA . 1,803 parts In-Stock

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$311.660

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$303.350

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$299.190

10k+ parts

$295.040

1,803

$311.660

$303.350

$299.190

$295.040

Continental Prestige Electronics

USA . 1,220 parts In-Stock

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$319.517

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$313.126

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Netroflash

USA . 100 parts In-Stock

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$319.517

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$303.541

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$297.150

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$319.517

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$297.150

Lixinc

USA . 13,154 parts In-Stock

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Corphita

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Argo Parts USA

USA . 1,247 parts In-Stock

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A-Z Elektronik GmbH

Germany . 809 parts In-Stock

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Futuretech Components

Singapore . 184 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320C6455BGTZA by Texas Instruments. As a leading manufacturer in the digital signal processor category, Texas Instruments delivers top-notch quality and reliability. This processor is designed for a wide range of applications, offering unmatched performance and efficiency. Experience seamless operation and enhanced functionality with integrated cache and low power mode features. Trust in Texas Instruments to provide innovative solutions that exceed expectations and elevate your projects to new heights. Choose the TMS320C6455BGTZA for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Integrated Cache: YES

Having an integrated cache improves overall processing speed and efficiency, making the product suitable for tasks that require quick data access.

Maximum Supply Voltage: 1.2875 V

The higher maximum supply voltage allows for flexibility in powering the product, accommodating different power supply options.

Address Bus Width: 20

A wider address bus width allows for larger memory addressing capabilities, enabling the product to handle more complex data processing tasks.

Package Shape: SQUARE

The square package shape provides efficient use of space and easy integration into various electronic systems.

Bit Size: 32

With a larger bit size, the product can handle more data at once, leading to improved processing speeds and performance.

Power Supplies (V): 1.2

The stable power supply of 1.2V ensures consistent and reliable performance of the product.

No. of Terminals: 697

A higher number of terminals allows for more connectivity options and versatility in usage scenarios.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch package style offers high density integration and efficient thermal management for the product.

Minimum Supply Voltage: 1.2125 V

The low minimum supply voltage helps in minimizing power consumption and improving energy efficiency of the product.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures that the product can perform reliably in harsh environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function effectively in both extreme cold and hot temperatures.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and ensures proper electrical connections for the product.

RAM Words: 32768

With a large RAM capacity of 32768 words, the product can store and process significant amounts of data efficiently.

Width: 24 mm

The compact width of 24mm makes the product suitable for applications where space is limited or size constraints are a consideration.

Boundary Scan: YES

Having boundary scan capability allows for easier testing and debugging of the product during development and production stages.

External Data Bus Width: 64

A wider external data bus width of 64 bits enables faster data transfer rates and improved overall system performance.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency of 66.6 MHz indicates fast processing speeds and real-time performance for the product.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures stable solder joints and reliable connectivity during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data flow and processing within the product, enhancing overall performance.

Length: 24 mm

The compact length of 24mm makes the product suitable for applications where space is limited or size constraints are a consideration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the product can operate in rugged industrial environments without performance degradation.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Having a specialized digital signal processor peripheral IC type makes the product ideal for signal processing applications requiring high computational power.

No. of Timers: 4

The availability of 4 timers enables precise timing functionality in the product, making it suitable for applications that require accurate timekeeping.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and facilitates easy integration into electronic assemblies.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage of 1.25V ensures stable and consistent power delivery to the product for reliable performance.

No. of DMA Channels: 64

The high number of DMA channels allows for efficient data transfer and management, enhancing the product's overall data processing capabilities.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm enables high-density mounting and compact design of the product.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency for the product.

Moisture Sensitivity Level (MSL): 4

A moisture sensitivity level of 4 indicates that the product requires careful handling during storage and assembly to prevent moisture-related damage.

Low Power Mode: YES

The availability of a low-power mode allows the product to conserve energy and extend battery life in portable or low-power applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BGTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BGTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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