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TMS320C6454BZTZ

Texas Instruments

TMS320C6454BZTZ by Texas Instruments

TMS320C6454BZTZ by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. With 32768 RAM words and boundary scan support, it's ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$205.285

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$188.770

100+ parts

$177.440

1k+ parts

$166.120

10k+ parts

-

2

$188.770

$177.440

$166.120

-

DigiKey

USA . 2 parts In-Stock

1+ parts

-

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-

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2

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Verical

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$221.800

1k+ parts

$207.650

10k+ parts

-

2

-

$221.800

$207.650

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 778 parts In-Stock

1+ parts

$208.221

100+ parts

-

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778

$208.221

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DigiKey Marketplace

USA . 2 parts In-Stock

1+ parts

$227.950

100+ parts

-

1k+ parts

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2

$227.950

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-

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Vyrian

USA . 8,277 parts In-Stock

1+ parts

-

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8,277

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Bristol Electronics

USA . 68 parts In-Stock

1+ parts

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68

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 743 parts In-Stock

1+ parts

$53.909

100+ parts

-

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743

$53.909

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DigiPath Technology Company

USA . 1,441 parts In-Stock

1+ parts

$59.361

100+ parts

$54.612

1k+ parts

-

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1,441

$59.361

$54.612

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ChromeModa Solutions

Germany . 2,716 parts In-Stock

1+ parts

$60.572

100+ parts

$49.669

1k+ parts

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2,716

$60.572

$49.669

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IDEA Electronic Components Group

UK . 170 parts In-Stock

1+ parts

$60.572

100+ parts

$57.543

1k+ parts

$54.515

10k+ parts

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170

$60.572

$57.543

$54.515

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Corohmni

South Africa . 5,049 parts In-Stock

1+ parts

$195.420

100+ parts

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5,049

$195.420

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Corphita

USA . 2,188 parts In-Stock

1+ parts

$197.262

100+ parts

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2,188

$197.262

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Microchip USA

USA . 228 parts In-Stock

1+ parts

$214.600

100+ parts

$208.880

1k+ parts

$206.010

10k+ parts

$209.130

228

$214.600

$208.880

$206.010

$209.130

ChipTracer

USA . 68 parts In-Stock

1+ parts

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68

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Overview

Experience unparalleled performance and reliability with the TMS320C6454BZTZ by Texas Instruments, a cutting-edge Digital Signal Processor that sets industry standards. With Texas Instruments' reputation for excellence in technology innovation, this DSP is perfect for a wide range of applications, delivering unmatched precision and efficiency. From audio processing to telecommunications, the TMS320C6454BZTZ offers exceptional value, making it the ideal choice for customers seeking top-tier performance and quality. Elevate your projects with this powerful DSP and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during production.

Maximum Supply Voltage: 1.89 V

With a high maximum supply voltage, this DSP can handle power fluctuations without compromising performance.

Address Bus Width: 20

The wide address bus width allows for efficient data handling and processing, enhancing the overall performance of the DSP.

Bit Size: 32

With a 32-bit size, this DSP can perform complex calculations and process data quickly, making it ideal for demanding applications.

Power Supplies (V): 1.2,1.8,3.3

Having multiple power supply options ensures compatibility with different systems and improves flexibility in deployment.

No. of Terminals: 697

The high number of terminals allows for versatile connectivity options and enhances the DSP's ability to interface with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables compact design and efficient use of PCB space, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures energy efficiency and reliable operation even under low power conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, this DSP can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: 0 °C

The wide operating temperature range allows the DSP to function effectively in both hot and cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on PCBs, enhancing stability and reliability.

Maximum Seated Height: 3.3 mm

The compact seated height allows for low-profile integration in space-limited applications, optimizing PCB layout.

RAM Words: 32768

With a large RAM capacity, this DSP can handle complex data processing tasks efficiently, enhancing overall performance.

Width: 24 mm

The compact width makes the DSP suitable for compact designs and applications where space is limited.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP during production and maintenance, improving reliability.

External Data Bus Width: 64

The wide external data bus width allows for fast data transfer between the DSP and external devices, enhancing efficiency.

Maximum Clock Frequency: 66.6 MHz

With a high maximum clock frequency, this DSP can perform tasks quickly and efficiently, making it suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature during manufacturing ensures the reliability and longevity of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the DSP can withstand the manufacturing process without damage.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for parallel processing and efficient data flow, improving overall performance.

Length: 24 mm

The compact length of the DSP makes it suitable for space-constrained applications without compromising functionality.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates the versatility of the DSP in handling various signal processing tasks, making it a versatile choice.

Technology: CMOS

The CMOS technology used in this DSP ensures low power consumption and high speed operation, making it energy efficient and reliable.

Terminal Form: BALL

The ball terminal form allows for easy and reliable connections during installation, ensuring stable performance.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage provides a stable power source for the DSP, ensuring consistent and reliable operation.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for high-density mounting on PCBs, saving space and enabling compact designs.

Format: FIXED POINT

The fixed-point format enables efficient and accurate numerical calculations, making the DSP suitable for precise signal processing tasks.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level indicates the DSP's resistance to moisture damage, ensuring reliability in humid environments.

Barrel Shifter: YES

The barrel shifter feature enhances the DSP's ability to perform complex arithmetic and logic operations, improving processing efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6454BZTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6454BZTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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