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TMS320C6454BCTZ

Texas Instruments

TMS320C6454BCTZ by Texas Instruments

TMS320C6454BCTZ by Texas Instruments is a 32-bit DSP with integrated cache and 8-bit on-chip data RAM. It operates at a max clock frequency of 50 MHz, suitable for digital signal processing applications requiring high-speed performance in a compact package. With 64 DMA channels and low power mode, it offers efficient data handling and power management capabilities.

Median Price

$185.626

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 660 parts In-Stock

1+ parts

$170.690

100+ parts

$160.450

1k+ parts

$150.210

10k+ parts

-

660

$170.690

$160.450

$150.210

-

DigiKey

USA . 660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

660

-

-

-

-

Verical

USA . 660 parts In-Stock

1+ parts

-

100+ parts

$200.563

1k+ parts

$187.762

10k+ parts

-

660

-

$200.563

$187.762

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,783 parts In-Stock

1+ parts

$188.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,783

$188.280

-

-

-

DigiKey Marketplace

USA . 660 parts In-Stock

1+ parts

$190.860

100+ parts

-

1k+ parts

-

10k+ parts

-

660

$190.860

-

-

-

Vyrian

USA . 8,782 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,782

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 331 parts In-Stock

1+ parts

$21.058

100+ parts

-

1k+ parts

-

10k+ parts

-

331

$21.058

-

-

-

Parana Technologies

USA . 195 parts In-Stock

1+ parts

$74.946

100+ parts

-

1k+ parts

-

10k+ parts

-

195

$74.946

-

-

-

DigiPath Technology Company

USA . 1,000 parts In-Stock

1+ parts

$82.525

100+ parts

$75.923

1k+ parts

-

10k+ parts

-

1,000

$82.525

$75.923

-

-

ChromeModa Solutions

Germany . 1,280 parts In-Stock

1+ parts

$84.209

100+ parts

$69.051

1k+ parts

-

10k+ parts

-

1,280

$84.209

$69.051

-

-

IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$84.209

100+ parts

$79.999

1k+ parts

$75.788

10k+ parts

-

523

$84.209

$79.999

$75.788

-

Corphita

USA . 2,013 parts In-Stock

1+ parts

$178.371

100+ parts

-

1k+ parts

-

10k+ parts

-

2,013

$178.371

-

-

-

Component Stockers USA

USA . 926 parts In-Stock

1+ parts

$185.270

100+ parts

$174.160

1k+ parts

-

10k+ parts

-

926

$185.270

$174.160

-

-

Microchip USA

USA . 1,642 parts In-Stock

1+ parts

$210.250

100+ parts

$204.650

1k+ parts

$207.780

10k+ parts

$204.890

1,642

$210.250

$204.650

$207.780

$204.890

QUARKTWIN TECHNOLOGY LTD

USA . 18,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,680

-

-

-

-

Overview

Experience unparalleled performance and reliability with the TMS320C6454BCTZ by Texas Instruments, a leading manufacturer in the industry of Digital Signal Processors. This cutting-edge product offers integrated cache, high-speed processing capabilities, and a wide range of applications in industries such as telecommunications, automotive, and industrial automation. With a focus on quality and innovation, this DSP provides customers with exceptional value, efficiency, and flexibility to meet their unique needs and exceed their expectations. Elevate your projects to new heights with the TMS320C6454BCTZ and unleash the full potential of your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various environments.

Integrated Cache: YES

Integrated cache helps in improving the performance of the DSP by reducing data access time and enhancing processing speed.

Maximum Supply Voltage: 1.2875 V

The high maximum supply voltage allows for flexibility in power supply options and can support different applications.

Address Bus Width: 32

A wider address bus allows the DSP to access larger memory spaces, enabling it to handle more complex algorithms and data processing tasks.

Bit Size: 32

A 32-bit architecture allows for more precise calculations and data processing capabilities, making the DSP suitable for demanding tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP efficient and reliable for continuous operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6454BCTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.25,1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6454BCTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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