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TMS320C6424ZDUL

Texas Instruments

TMS320C6424ZDUL by Texas Instruments

TMS320C6424ZDUL by Texas Instruments is a 32-bit DSP with 20480 RAM words, operating at 30 MHz. It features a max supply voltage of 1.26 V and is suitable for digital signal processing applications requiring low power consumption and high-speed data processing capabilities. The package style is grid array with a terminal pitch of 1 mm, making it ideal for surface mount designs in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,341 parts In-Stock

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6,341

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Digiode

USA . 1,688 parts In-Stock

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1,688

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Distributors (Availability)

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AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$5.288

100+ parts

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204

$5.288

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Parana Technologies

USA . 627 parts In-Stock

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$14.230

100+ parts

-

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$14.682

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627

$14.230

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$14.682

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ChromeModa Solutions

Germany . 5,632 parts In-Stock

1+ parts

$15.989

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$13.111

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5,632

$15.989

$13.111

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IDEA Electronic Components Group

UK . 832 parts In-Stock

1+ parts

$15.989

100+ parts

$15.190

1k+ parts

$14.390

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832

$15.989

$15.190

$14.390

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Corohmni

South Africa . 254 parts In-Stock

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$24.161

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254

$24.161

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One Stop Electronics

USA . 1,554 parts In-Stock

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$30.000

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1,554

$30.000

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DigiPath Technology Company

USA . 2,208 parts In-Stock

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$14.416

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Microchip USA

USA . 114 parts In-Stock

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Corphita

USA . 77 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320C6424ZDUL by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments has delivered a game-changing DSP that offers unparalleled performance and reliability. From advanced audio processing to cutting-edge telecommunications, this DSP is versatile and efficient, making it an essential tool for a wide range of applications. Experience the value and benefits that the TMS320C6424ZDUL brings to your projects, ensuring optimal results and customer satisfaction every time. Step up your game with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy package body material provides good thermal insulation and mechanical protection for the DSP, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26V ensures that the DSP operates within safe voltage limits, preventing damage and ensuring stable performance.

Address Bus Width: 32

With a 32-bit address bus width, the DSP can access a large memory address space, enabling efficient data processing and storage.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB real estate and easy placement on the board during assembly.

Bit Size: 32

32-bit architecture provides high processing power and precision, making the DSP suitable for demanding signal processing tasks.

Power Supplies (V): 1.1, 1.8, 3.3

Multiple power supply options of 1.1V, 1.8V, and 3.3V offer flexibility in design and compatibility with different power sources.

No. of Terminals: 376

With 376 terminals, the DSP can easily interface with other components and peripherals, expanding its functionality and connectivity options.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug enhances thermal management and heat dissipation, ensuring optimal performance under high processing loads.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14V ensures stable operation even under low power conditions, improving energy efficiency and reliability.

Maximum Operating Temperature: 90 °C

High maximum operating temperature of 90°C allows the DSP to operate reliably in harsh environments and under heavy workloads without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures that the DSP can function effectively in a wide range of temperature conditions, providing versatility in usage.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier to integrate the DSP into electronic systems.

Maximum Seated Height: 2.48 mm

Low maximum seated height of 2.48mm allows for compact and slim design layouts, saving space in the overall system configuration.

RAM Words: 20480

Ample RAM capacity of 20480 words enables efficient data storage and retrieval for processing large datasets and complex algorithms.

Width: 23 mm

Compact width of 23mm makes the DSP suitable for space-constrained applications and designs, without compromising on performance.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging during manufacturing and maintenance, improving overall product quality and reliability.

External Data Bus Width: 32

32-bit external data bus width allows for high-speed data transfer between the DSP and external peripherals, enhancing overall system performance.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency of 30 MHz enables fast data processing and real-time signal handling, making the DSP suitable for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and assembly of the DSP on the PCB, preventing damage and ensuring reliability.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for effective soldering and mounting of the DSP on the PCB, ensuring robust connections and stability in operation.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and throughput, enabling parallel processing and optimized performance.

Length: 23 mm

Compact length of 23mm makes the DSP suitable for space-constrained applications and designs, without compromising on performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type makes the DSP compatible with various digital signal processing applications and allows for integration with different systems and devices.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making the DSP suitable for energy-efficient and high-performance applications.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, ensuring stable electrical contact and preventing signal losses or interference.

Nominal Supply Voltage: 1.2 V

Nominal supply voltage of 1.2V offers a balanced operating range for the DSP, ensuring optimal performance and efficiency under normal operating conditions.

Terminal Pitch: 1 mm

1mm terminal pitch allows for easy and convenient soldering and mounting of the DSP on the PCB, simplifying assembly and ensuring proper electrical connections.

Format: FIXED POINT

Fixed-point format simplifies mathematical computations and algorithms, making the DSP easier to program and optimize for specific signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that the DSP can withstand moderate exposure to moisture during storage and handling, ensuring product longevity and reliability.

Low Power Mode: YES

Low power mode capability allows the DSP to conserve energy and operate efficiently under reduced power consumption, making it suitable for battery-powered or energy-efficient devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6424ZDUL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

376

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Words:

20480

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6424ZDUL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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