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TMS320C6421ZDU6

Texas Instruments

TMS320C6421ZDU6 by Texas Instruments

TMS320C6421ZDU6 by Texas Instruments is a 32-bit DSP with 600 MHz clock frequency, 12288 RAM words, and 22-bit address bus width. Widely used in digital signal processing applications due to its high performance and multiple internal bus architecture. Ideal for commercial-grade projects requiring fixed-point format and boundary scan capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,091 parts In-Stock

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8,091

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Digiode

USA . 1,635 parts In-Stock

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1,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,625 parts In-Stock

1+ parts

$12.000

100+ parts

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1,625

$12.000

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$13.883

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233

$13.883

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Corohmni

South Africa . 2,462 parts In-Stock

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$34.392

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2,462

$34.392

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Parana Technologies

USA . 1,137 parts In-Stock

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$40.366

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1,137

$40.366

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DigiPath Technology Company

USA . 2,172 parts In-Stock

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$44.448

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2,172

$44.448

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IDEA Electronic Components Group

UK . 1,653 parts In-Stock

1+ parts

$45.355

100+ parts

$43.087

1k+ parts

$40.820

10k+ parts

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1,653

$45.355

$43.087

$40.820

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ChromeModa Solutions

Germany . 127 parts In-Stock

1+ parts

$45.355

100+ parts

$37.191

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127

$45.355

$37.191

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Corphita

USA . 4,765 parts In-Stock

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4,765

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Microchip USA

USA . 430 parts In-Stock

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430

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Overview

Experience unparalleled performance and reliability with the TMS320C6421ZDU6 by Texas Instruments, a leading manufacturer in the industry. As a cutting-edge Digital Signal Processor (DSP), this product offers endless possibilities for applications in telecommunications, audio processing, and more. With its advanced features and high-quality construction, customers can trust in the value and benefits that this innovative technology brings. Upgrade your projects with the TMS320C6421ZDU6 and unlock a new world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, making the product suitable for small and densely packed electronic devices.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage ensures safe operation without risking damage to the components.

Address Bus Width: 22

The wide address bus width allows for efficient communication between components, enhancing the processing capabilities of the DSP.

Package Shape: SQUARE

The square package shape facilitates easy mounting and alignment in circuit boards, optimizing space usage and connectivity.

Bit Size: 32

A 32-bit architecture offers improved processing power and performance for handling complex digital signal processing tasks.

Power Supplies (V): 1.05/1.2,1.8/3.3

Support for multiple power supply voltages enables compatibility with various systems and ensures versatile use in different applications.

No. of Terminals: 376

A high number of terminals provide ample connectivity options and interfaces for connecting with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers enhanced mechanical strength and thermal performance, ensuring reliability under challenging operating conditions.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage ensures stable operation even under low power conditions, improving efficiency and reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the DSP to function reliably in various environmental conditions, increasing its versatility.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP can operate in cold environments without compromising performance or functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enables easy integration into electronic systems, streamlining assembly processes.

Maximum Seated Height: 2.48 mm

The low maximum seated height allows for a slim and compact design, making the DSP suitable for space-constrained applications.

RAM Words: 12288

The large RAM capacity allows for efficient data storage and processing, enabling the DSP to handle complex algorithms and computations effectively.

Width: 23 mm

The moderate width of the DSP facilitates easy integration into various electronic devices without occupying excessive space.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes, improving overall product reliability and manufacturability.

External Data Bus Width: 8

An 8-bit external data bus width ensures compatibility with a wide range of peripherals and simplifies data transfer operations.

Maximum Clock Frequency: 600 MHz

A high maximum clock frequency enables fast processing speeds and real-time execution of signal processing tasks, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering processes, reducing production time and costs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints and component connections during manufacturing and assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing efficiency and allows for parallel execution of tasks, improving overall performance.

Length: 23 mm

The moderate length of the DSP contributes to a balanced form factor that is suitable for various electronic applications and installations.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges, making the DSP suitable for commercial and industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types enhances compatibility with different systems and enables diverse functionality and connectivity options.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the DSP.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures secure connections, improving the overall reliability and durability of the DSP.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable operating voltage level for the DSP, ensuring consistent performance and reliability.

Terminal Pitch: 1 mm

The small terminal pitch allows for densely packed connections, maximizing space efficiency and enabling high-density PCB designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and data processing tasks, making the DSP suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the DSP requires careful handling during storage and assembly to prevent moisture-related damage and ensure operational reliability.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6421ZDU6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.05V NOMINAL SUPPLY AT 450MHZ

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

600 MHz

External Data Bus Width:

8

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

376

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

12288

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6421ZDU6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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