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TMS320C6416TGLZ6

Texas Instruments

TMS320C6416TGLZ6 by Texas Instruments

TMS320C6416TGLZ6 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and max clock freq of 75 MHz. Ideal for industrial applications requiring fixed-point format processing in low power mode.

Median Price

$126.214

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 454 parts In-Stock

1+ parts

-

100+ parts

$112.190

1k+ parts

$100.380

10k+ parts

$94.470

454

-

$112.190

$100.380

$94.470

DigiKey

USA . 454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

454

-

-

-

-

Verical

USA . 440 parts In-Stock

1+ parts

-

100+ parts

$140.238

1k+ parts

$125.475

10k+ parts

$118.088

440

-

$140.238

$125.475

$118.088

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$111.140

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$111.140

-

-

-

Digiode

USA . 1,049 parts In-Stock

1+ parts

$118.418

100+ parts

-

1k+ parts

-

10k+ parts

-

1,049

$118.418

-

-

-

Vyrian

USA . 8,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,701

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 656 parts In-Stock

1+ parts

$11.245

100+ parts

-

1k+ parts

-

10k+ parts

-

656

$11.245

-

-

-

Parana Technologies

USA . 750 parts In-Stock

1+ parts

$33.916

100+ parts

-

1k+ parts

$137.209

10k+ parts

-

750

$33.916

-

$137.209

-

ChromeModa Solutions

Germany . 4,223 parts In-Stock

1+ parts

$38.108

100+ parts

$31.249

1k+ parts

-

10k+ parts

-

4,223

$38.108

$31.249

-

-

IDEA Electronic Components Group

UK . 2,055 parts In-Stock

1+ parts

$38.108

100+ parts

$36.203

1k+ parts

$34.297

10k+ parts

-

2,055

$38.108

$36.203

$34.297

-

Ampacity Inc.

Singapore . 450 parts In-Stock

1+ parts

$105.950

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$105.950

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

$111.100

100+ parts

$105.545

1k+ parts

-

10k+ parts

$98.879

100

$111.100

$105.545

-

$98.879

Continental Prestige Electronics

USA . 5,758 parts In-Stock

1+ parts

$111.140

100+ parts

-

1k+ parts

-

10k+ parts

$108.917

5,758

$111.140

-

-

$108.917

Corohmni

South Africa . 4,910 parts In-Stock

1+ parts

$111.140

100+ parts

-

1k+ parts

-

10k+ parts

-

4,910

$111.140

-

-

-

Corphita

USA . 4,340 parts In-Stock

1+ parts

$112.185

100+ parts

-

1k+ parts

-

10k+ parts

-

4,340

$112.185

-

-

-

Argo Parts USA

USA . 3,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,828

-

-

-

-

DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

-

100+ parts

$34.358

1k+ parts

-

10k+ parts

-

1,615

-

$34.358

-

-

A-Z Elektronik GmbH

Germany . 546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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546

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TMS320C6416TGLZ6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This digital signal processor (DSP) offers unparalleled performance and versatility, making it ideal for a wide range of applications. Experience seamless operation and optimized efficiency with this innovative product. Elevate your projects to new heights with the TMS320C6416TGLZ6 and discover the endless possibilities it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and saves space on the board.

Maximum Supply Voltage: 1.16 V

A high maximum supply voltage allows for flexibility in power sources and compatibility with various systems.

Address Bus Width: 23

A wider address bus allows for larger memory capacity and more efficient data processing.

Package Shape: SQUARE

The square package shape is compact and easy to mount, saving space in the system design.

Bit Size: 32

A 32-bit architecture enables high-speed processing and complex calculations, ideal for DSP applications.

Power Supplies (V): 1.1, 3.3

The availability of multiple power supply options allows for flexible integration into different systems.

No. of Terminals: 532

A high number of terminals provide connectivity options and support for various input/output devices.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch style offers high density and improved signal integrity for efficient signal transmission.

Minimum Supply Voltage: 1.05 V

A low minimum supply voltage ensures efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for reliable performance in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures the product can operate in extreme cold conditions as well.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and system integration.

Maximum Seated Height: 3.25 mm

The low profile design with a maximum seated height saves space and enables slim device designs.

RAM Words: 16384

A large RAM capacity allows for efficient data storage and processing, enhancing overall system performance.

Width: 23 mm

Compact width dimensions make the product suitable for space-constrained applications.

Boundary Scan: YES

Boundary scan capability aids in testing, debugging, and diagnosing issues during product development and maintenance.

External Data Bus Width: 64

A wide external data bus width enables high-speed data transfer and efficient communication between components.

Maximum Clock Frequency: 75 MHz

A high maximum clock frequency allows for rapid data processing and real-time operation in demanding applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture supports parallel processing and optimized data flow for enhanced performance.

Length: 23 mm

The compact length dimensions contribute to a small footprint and easy integration into space-limited systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC types expand functionality and compatibility with various digital signal processing applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of systems.

Terminal Form: BALL

Ball terminal form enables secure and reliable connections for improved signal transmission and system reliability.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the product.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for dense packing and efficient use of PCB space in system designs.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency in DSP tasks.

Low Power Mode: YES

The low power mode option enables power-saving operation for extended battery life in portable devices or energy-efficient systems.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TGLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TGLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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