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TMS320C6416TBGLZA8

Texas Instruments

TMS320C6416TBGLZA8 by Texas Instruments

TMS320C6416TBGLZA8 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 75 MHz clock frequency. Ideal for industrial applications requiring high-speed signal processing in a compact package.

Median Price

$356.192

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,800 parts In-Stock

1+ parts

$271.583

100+ parts

$263.415

1k+ parts

$204.198

10k+ parts

-

15,800

$271.583

$263.415

$204.198

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Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$440.800

100+ parts

-

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-

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15

$440.800

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Distributors (In-Stock)

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Digiode

USA . 3,007 parts In-Stock

1+ parts

$258.004

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-

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3,007

$258.004

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Vyrian

USA . 2,869 parts In-Stock

1+ parts

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2,869

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Cyclops Electronics Ltd

UK . 1,007 parts In-Stock

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1,007

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 694 parts In-Stock

1+ parts

$28.325

100+ parts

-

1k+ parts

$46.172

10k+ parts

-

694

$28.325

-

$46.172

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DigiPath Technology Company

USA . 1,818 parts In-Stock

1+ parts

$31.189

100+ parts

-

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1,818

$31.189

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ChromeModa Solutions

Germany . 3,784 parts In-Stock

1+ parts

$31.826

100+ parts

$26.097

1k+ parts

-

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3,784

$31.826

$26.097

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IDEA Electronic Components Group

UK . 1,640 parts In-Stock

1+ parts

$31.826

100+ parts

$30.235

1k+ parts

$28.643

10k+ parts

-

1,640

$31.826

$30.235

$28.643

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Corohmni

South Africa . 764 parts In-Stock

1+ parts

$62.337

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764

$62.337

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Corphita

USA . 1,522 parts In-Stock

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$244.425

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1,522

$244.425

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Microchip USA

USA . 6,844 parts In-Stock

1+ parts

$264.700

100+ parts

$257.640

1k+ parts

$254.110

10k+ parts

$250.580

6,844

$264.700

$257.640

$254.110

$250.580

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Lixinc

USA . 1,709 parts In-Stock

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1,709

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Perfect Parts

USA . 1,126 parts In-Stock

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GreenTree Electronics

Israel . 700 parts In-Stock

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700

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A-Z Elektronik GmbH

Germany . 590 parts In-Stock

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590

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Futuretech Components

Singapore . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the TMS320C6416TBGLZA8 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability in every product. The TMS320C6416TBGLZA8 is a versatile DSP that can be utilized in a wide range of applications, from telecommunications to audio processing. Experience seamless performance and unmatched efficiency with this innovative solution. Elevate your projects with the TMS320C6416TBGLZA8 and stay ahead of the curve in today's fast-paced technological landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body helps in reducing the overall weight of the product and ensures durability.

Integrated Cache: YES

Having an integrated cache allows for faster processing and improved performance of the DSP, making it suitable for applications requiring high-speed data processing.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage requirement helps in minimizing power consumption and heat generation, making the product energy efficient.

Address Bus Width: 23

With a wide address bus width of 23, the DSP can handle large amounts of data for complex computations and signal processing tasks.

Bit Size: 32

The 32-bit architecture allows for processing of data in larger chunks, leading to faster execution of algorithms and increased throughput.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the DSP suitable for industrial applications where extended temperature ranges are common.

Technology: CMOS

Being based on CMOS technology, the DSP offers low power consumption, high noise immunity, and faster switching speeds, making it energy efficient and reliable.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy reprogramming of the DSP firmware, enabling flexibility and adaptability in various application scenarios.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBGLZA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBGLZA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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