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TMS320C6416TBCLZA6

Texas Instruments

TMS320C6416TBCLZA6 by Texas Instruments

TMS320C6416TBCLZA6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for industrial applications requiring high-speed signal processing in digital communication systems.

Median Price

$179.640

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 425 parts In-Stock

1+ parts

$133.020

100+ parts

$129.019

1k+ parts

$100.015

10k+ parts

-

425

$133.020

$129.019

$100.015

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$226.260

100+ parts

$179.570

1k+ parts

-

10k+ parts

-

5

$226.260

$179.570

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 296 parts In-Stock

1+ parts

$126.369

100+ parts

-

1k+ parts

-

10k+ parts

-

296

$126.369

-

-

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Vyrian

USA . 5,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,248

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 48 parts In-Stock

1+ parts

$47.219

100+ parts

$42.969

1k+ parts

$38.720

10k+ parts

-

48

$47.219

$42.969

$38.720

-

Parana Technologies

USA . 370 parts In-Stock

1+ parts

$58.422

100+ parts

-

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-

10k+ parts

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370

$58.422

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-

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Corohmni

South Africa . 23 parts In-Stock

1+ parts

$60.782

100+ parts

-

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23

$60.782

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-

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ChromeModa Solutions

Germany . 6,913 parts In-Stock

1+ parts

$65.643

100+ parts

$53.827

1k+ parts

-

10k+ parts

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6,913

$65.643

$53.827

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IDEA Electronic Components Group

UK . 307 parts In-Stock

1+ parts

$65.643

100+ parts

$62.361

1k+ parts

$59.079

10k+ parts

-

307

$65.643

$62.361

$59.079

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Corphita

USA . 616 parts In-Stock

1+ parts

$119.718

100+ parts

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616

$119.718

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DigiPath Technology Company

USA . 418 parts In-Stock

1+ parts

-

100+ parts

$59.184

1k+ parts

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418

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$59.184

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Overview

Unleash the power of cutting-edge technology with the TMS320C6416TBCLZA6 by Texas Instruments, a top-tier manufacturer in the industry. As part of the Digital Signal Processors (DSPs) category, this innovative product offers integrated cache, high-speed processing, and versatile applications. With a focus on quality and performance, this DSP provides customers with unmatched value, benefits, and advantages for their projects. Elevate your designs with the TMS320C6416TBCLZA6 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

The integrated cache improves the processing speed and efficiency of the DSP, enhancing overall performance.

Surface Mount: YES

Surface mount feature allows for easy and compact assembly of the DSP onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.16 V

The maximum supply voltage ensures safe operation and prevents damage to the DSP.

Address Bus Width: 20

A wider address bus allows for larger memory addressing capabilities and more efficient data transfer within the DSP.

Package Shape: SQUARE

The square package shape facilitates easier handling and mounting of the DSP in electronic devices.

Bit Size: 32

A 32-bit architecture enables the DSP to process data in larger chunks, leading to faster computation and improved accuracy.

Power Supplies (V): 1.1, 3.3

Support for multiple power supply options allows flexibility in system design and compatibility with different voltage requirements.

No. of Terminals: 532

A large number of terminals provide ample connectivity options for interfacing with other components in a system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enhances signal integrity, thermal performance, and reliability of the DSP.

Minimum Supply Voltage: 1.05 V

The minimum supply voltage ensures efficient power consumption and extends the operating life of the DSP.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the DSP suitable for industrial applications and environments with varying temperature conditions.

No. of External Interrupts: 4

The presence of external interrupts allows the DSP to handle real-time events and improve responsiveness in system operations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures reliable performance even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier soldering and mounting of the DSP onto circuit boards.

Maximum Seated Height: 3.25 mm

The low maximum seated height allows for compact system designs and reduces the overall profile of electronic devices.

RAM Words: 4096

The large RAM capacity enables the DSP to store and access a significant amount of data for processing complex algorithms.

Width: 23 mm

The compact width of the DSP makes it suitable for space-constrained applications and allows for easy integration into various electronic devices.

Boundary Scan: YES

Boundary scan feature enables testing and diagnosis of the DSP's connections and helps identify any potential defects during manufacturing or operation.

External Data Bus Width: 64

A wide external data bus width facilitates high-speed data transfer between the DSP and external memory or peripherals.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency allows the DSP to execute instructions quickly and efficiently, improving overall processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature prevents overheating and thermal stress on the DSP during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering of the DSP onto circuit boards, enhancing the reliability of the connections.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer between different components within the DSP, optimizing overall performance.

Length: 23 mm

The compact length of the DSP allows for efficient use of space in electronic devices without compromising on performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the DSP in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types enhances the DSP's versatility and compatibility with different types of external devices and systems.

No. of Timers: 3

Multiple timers allow the DSP to schedule tasks, manage time-sensitive operations, and improve overall system performance.

Technology: CMOS

CMOS technology provides low power consumption, high speed, and reliability, making the DSP suitable for a wide range of applications.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections for the DSP, ensuring proper functionality and signal transmission.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage ensures stable and consistent power delivery to the DSP, optimizing its performance and reliability.

No. of DMA Channels: 64

The large number of DMA channels allows for efficient data transfer and management, reducing processing overhead and improving system performance.

ROM Programmability: FLASH

Flash ROM programmability provides flexibility for firmware updates and customization, enhancing the versatility and scalability of the DSP.

Terminal Pitch: 0.8 mm

The terminal pitch enables high-density mounting and compact footprint of the DSP on circuit boards, optimizing space utilization in electronic devices.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and supports efficient processing of integer data types, enhancing computational efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the DSP can withstand exposure to moderate levels of moisture during storage and handling, ensuring reliability in various environmental conditions.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy and extend battery life in portable devices or applications that require power efficiency.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits provides ample storage for program code and data, supporting efficient program execution and data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBCLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBCLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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