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TMS320C6415TBCLZ7

Texas Instruments

TMS320C6415TBCLZ7 by Texas Instruments

TMS320C6415TBCLZ7 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$125.972

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 780 parts In-Stock

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$125.972

100+ parts

$122.184

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$94.716

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780

$125.972

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$94.716

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Distributors (In-Stock)

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Digiode

USA . 3,947 parts In-Stock

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$119.673

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Vyrian

USA . 4,940 parts In-Stock

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$125.972

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Lantek

USA . 120 parts In-Stock

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Prism Electronics

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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AZTECH Wire

Italy . 263 parts In-Stock

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$19.640

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$20.525

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$18.678

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$16.830

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$20.525

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$16.830

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Corohmni

South Africa . 4 parts In-Stock

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$38.998

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Parana Technologies

USA . 923 parts In-Stock

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$51.980

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DigiPath Technology Company

USA . 899 parts In-Stock

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$57.237

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$57.237

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ChromeModa Solutions

Germany . 4,770 parts In-Stock

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$58.405

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$47.892

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$58.405

$47.892

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IDEA Electronic Components Group

UK . 178 parts In-Stock

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$58.405

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$55.485

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$52.564

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$52.564

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Corphita

USA . 4,445 parts In-Stock

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$113.375

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Emar International I/E

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GreenTree Electronics

Israel . 120 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of advanced signal processing with the TMS320C6415TBCLZ7 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This digital signal processor is perfect for a wide range of applications, offering fast processing speeds and integrated cache for optimal performance. With low power mode and integrated peripherals, this DSP provides unmatched value and benefits to customers seeking high-quality solutions for their projects. Experience the difference with the TMS320C6415TBCLZ7 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for portable and rugged applications.

Integrated Cache: YES

The integrated cache improves processing speed and efficiency by reducing access time to frequently used instructions and data.

Surface Mount: YES

The surface mount feature allows for easy and compact integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy efficient.

Address Bus Width: 20

The wide address bus width allows for efficient memory addressing and data transfer, enhancing overall processing capabilities.

Package Shape: SQUARE

The square package shape provides uniformity in design and facilitates easier mounting and handling during production.

Bit Size: 32

The 32-bit architecture enables high-speed processing of data and instructions, suitable for complex signal processing tasks.

Power Supplies (V): 1.2,3.3

The availability of multiple power supply options enhances flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 532

The high number of terminals allows for versatile connectivity and I/O options, catering to diverse interface needs in signal processing applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables high-density mounting and reliable connections, leading to compact system designs with improved performance.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage ensures stability in operation and efficient power management, enhancing the longevity of the product.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions, suitable for industrial and outdoor applications.

No. of External Interrupts: 4

The multiple external interrupt capabilities enable efficient handling of external events or signals, ensuring timely response and real-time processing.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance even in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish with tin, silver, and copper enhances conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: BOTTOM

The bottom terminal position allows for easy PCB mounting and soldering processes, simplifying assembly and maintenance tasks.

Maximum Seated Height: 3.25 mm

The maximum seated height provides compatibility with various PCB layouts and enclosure designs, offering flexibility in system integration.

RAM Words: 4096

The large RAM capacity allows for efficient data storage and processing, enabling the handling of complex algorithms and large datasets.

Width: 23 mm

The compact width size ensures space efficiency in system designs, particularly beneficial for compact and embedded signal processing applications.

Boundary Scan: YES

The boundary scan feature allows for easy testing and debugging of the product during production and maintenance, ensuring high reliability and quality assurance.

External Data Bus Width: 64

The wide external data bus width facilitates high-speed data transfer and efficient communication with external devices, enhancing overall system performance.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency allows for fast signal processing and real-time operation, suitable for applications requiring rapid data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and component reliability during assembly processes, reducing the risk of soldering defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures compatibility with lead-free soldering processes, meeting industry standards for environmental compliance.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data processing efficiency and allows for parallel processing of instructions, improving overall system performance.

Length: 23 mm

The compact length size enhances space efficiency in system designs, making the product suitable for compact and portable signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type as a digital signal processor ensures specialized signal processing capabilities, making the product ideal for digital signal processing tasks.

No. of Timers: 3

The multiple timers provide precise timing control and synchronization, essential for time-sensitive signal processing applications and task scheduling.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and noise immunity, making the product energy efficient and reliable for signal processing tasks.

Terminal Form: BALL

The ball terminal form allows for secure and reliable connections, suitable for applications with high vibration or mechanical stress.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent performance and reliability, essential for uninterrupted signal processing operations.

No. of DMA Channels: 64

The high number of DMA channels enables efficient data transfer and processing, reducing the load on the CPU and enhancing overall system performance.

ROM Programmability: FLASH

The ROM programmability using flash technology allows for easy firmware updates and customization, ensuring adaptability to changing signal processing requirements.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting and miniaturization, facilitating compact and space-efficient system designs.

Format: FIXED POINT

The fixed-point format provides precision and efficiency in numerical calculations, suitable for signal processing algorithms that require consistent and accurate results.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level 4 indicates a low sensitivity to moisture, ensuring component reliability and performance in varied environmental conditions.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low activity periods, prolonging battery life and energy efficiency.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits allows for storage of program instructions directly on the chip, enhancing data access speed and system efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBCLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY; SEATED HEIGHT-MAX ALSO AVAILABLE IN 3.15 MM

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TBCLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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