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TMS320C6415TBCLZ6

Texas Instruments

TMS320C6415TBCLZ6 by Texas Instruments

TMS320C6415TBCLZ6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.18 MHz. Ideal for digital signal processing applications requiring low power mode and flash ROM programmability.

Median Price

$118.918

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,760 parts In-Stock

1+ parts

$118.918

100+ parts

$115.341

1k+ parts

$89.412

10k+ parts

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1,760

$118.918

$115.341

$89.412

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,011 parts In-Stock

1+ parts

$112.972

100+ parts

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2,011

$112.972

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Vyrian

USA . 7,430 parts In-Stock

1+ parts

-

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7,430

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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3

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Bristol Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,166 parts In-Stock

1+ parts

$20.970

100+ parts

-

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1,166

$20.970

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Parana Technologies

USA . 1,129 parts In-Stock

1+ parts

$25.744

100+ parts

-

1k+ parts

$26.351

10k+ parts

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1,129

$25.744

-

$26.351

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ChromeModa Solutions

Germany . 5,411 parts In-Stock

1+ parts

$28.926

100+ parts

$23.719

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5,411

$28.926

$23.719

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

1+ parts

$28.926

100+ parts

$27.480

1k+ parts

$26.033

10k+ parts

-

2,324

$28.926

$27.480

$26.033

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Corphita

USA . 1,467 parts In-Stock

1+ parts

$107.026

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1,467

$107.026

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Corohmni

South Africa . 214 parts In-Stock

1+ parts

$107.787

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214

$107.787

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

1+ parts

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7,500

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QUARKTWIN TECHNOLOGY LTD

USA . 6,768 parts In-Stock

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6,768

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DigiPath Technology Company

USA . 2,366 parts In-Stock

1+ parts

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100+ parts

$26.080

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2,366

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$26.080

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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3

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Overview

Unlock the power of innovation with the TMS320C6415TBCLZ6 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. This Digital Signal Processor (DSP) offers integrated cache, low power mode, and boundary scan capabilities, making it ideal for a wide range of applications. From audio processing to telecommunications, this product delivers exceptional performance and efficiency. Experience the value and benefits that only Texas Instruments can provide with the TMS320C6415TBCLZ6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a sturdy and reliable housing for the DSP, ensuring durability and longevity.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data, leading to faster performance.

Maximum Supply Voltage: 1.16 V

Allows for efficient power usage while still providing sufficient voltage for operation.

Address Bus Width: 23

Enables the DSP to access a large memory address space for complex calculations and data processing.

Bit Size: 32

Offers high precision and accuracy in mathematical calculations and signal processing tasks.

No. of Terminals: 532

Provides ample connectivity options for interfacing with other components and peripherals.

Maximum Operating Temperature: 90 °C

Ensures reliable performance even under high temperature conditions, making it suitable for various environments.

RAM Words: 16384

Offers sufficient memory capacity for storing and processing data efficiently.

Maximum Clock Frequency: 75.18 MHz

Allows for high-speed data processing and real-time signal analysis.

ROM Programmability: FLASH

Enables easy and flexible firmware updates, enhancing the versatility and adaptability of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6415TBCLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6415TBCLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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