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TMS320C6414TBZLZA6

Texas Instruments

TMS320C6414TBZLZA6 by Texas Instruments

TMS320C6414TBZLZA6 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75 MHz max clock frequency. Ideal for industrial applications requiring fixed-point format processing in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,976 parts In-Stock

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Digiode

USA . 260 parts In-Stock

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260

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One Stop Electronics

USA . 296 parts In-Stock

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$13.000

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296

$13.000

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AZTECH Wire

Italy . 588 parts In-Stock

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$13.685

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Corohmni

South Africa . 3,220 parts In-Stock

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$18.077

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Parana Technologies

USA . 796 parts In-Stock

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$22.660

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$23.316

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DigiPath Technology Company

USA . 1,135 parts In-Stock

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$24.952

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$22.956

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$24.952

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ChromeModa Solutions

Germany . 1,733 parts In-Stock

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$25.461

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$20.878

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

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$25.461

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$24.188

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$22.915

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Corphita

USA . 3,556 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,545 parts In-Stock

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Microchip USA

USA . 268 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the TMS320C6414TBZLZA6 by Texas Instruments. Designed for high performance and reliability, this DSP offers unparalleled quality and precision in a compact package. Ideal for a wide range of applications, from telecommunications to audio processing, this product delivers exceptional value and benefits to customers looking to enhance their systems with cutting-edge technology. Trust Texas Instruments for superior products that push the boundaries of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.16 V

The maximum supply voltage of 1.16V ensures safe operation of the DSP, preventing any damage due to overvoltage.

Address Bus Width: 23

A wider address bus allows for efficient data processing and handling, enhancing the performance of the DSP.

Bit Size: 32

The 32-bit architecture of the DSP enables high-speed data processing and complex computations, making it suitable for demanding applications.

Power Supplies (V): 1.1,3.3

Support for multiple power supply voltages offers flexibility in system design and makes the DSP compatible with a wide range of applications.

No. of Terminals: 532

The high number of terminals allows for connectivity with various peripherals and components, enhancing the versatility of the DSP.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures secure mounting on the PCB and efficient heat dissipation, improving the reliability of the DSP.

Minimum Supply Voltage: 1.05 V

The minimum supply voltage of 1.05V ensures stable operation of the DSP even under low voltage conditions, enhancing reliability.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the DSP to function reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the DSP can operate in a wide range of temperature conditions, making it suitable for various applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the DSP.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure mounting on the PCB, improving the overall reliability of the DSP.

Maximum Seated Height: 3.25 mm

The low seated height allows for compact PCB designs and efficient use of space, making the DSP suitable for miniaturized applications.

RAM Words: 262144

The large RAM capacity enables efficient data storage and processing, improving the performance and versatility of the DSP.

Width: 23 mm

The compact width of 23mm allows for space-efficient PCB layout, making the DSP suitable for applications with size constraints.

Boundary Scan: YES

The presence of boundary scan capability allows for easy testing and debugging of the DSP during the manufacturing process, ensuring product quality and reliability.

External Data Bus Width: 64

The wide external data bus width allows for efficient data transfer between the DSP and external peripherals, enhancing performance in data-intensive applications.

Maximum Clock Frequency: 75 MHz

The high maximum clock frequency of 75MHz enables fast data processing and high-speed operation, making the DSP ideal for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature of 30 seconds prevents thermal stress on the components, ensuring reliable solder joints and long-term durability of the DSP.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering of the components, enhancing the overall reliability of the DSP.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data routing and processing within the DSP, enhancing performance and versatility.

Length: 23 mm

The compact length of 23mm allows for space-efficient PCB layout, making the DSP suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the DSP in harsh environmental conditions, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The presence of various peripheral IC types enhances the connectivity and compatibility of the DSP with external devices, improving overall system integration.

Technology: CMOS

The use of CMOS technology enables low power consumption and high speed operation, making the DSP energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections, ensuring long-term performance and durability of the DSP.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V ensures stable and efficient operation of the DSP, optimizing performance and power consumption.

Terminal Pitch: 0.8 mm

The fine terminal pitch of 0.8mm allows for high-density PCB designs and efficient use of space, making the DSP suitable for compact applications.

Format: FIXED POINT

The fixed-point format allows for efficient and precise numerical calculations, making the DSP suitable for applications requiring high computational accuracy.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 indicates a moderate level of moisture sensitivity, ensuring proper handling and storage to maintain the reliability of the DSP.

Low Power Mode: YES

The low power mode feature enables energy-efficient operation of the DSP, extending battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBZLZA6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBZLZA6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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