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TMS320C6414TBZLZ1

Texas Instruments

TMS320C6414TBZLZ1 by Texas Instruments

TMS320C6414TBZLZ1 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and operates at a max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,084 parts In-Stock

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Digiode

USA . 3,319 parts In-Stock

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3,319

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Odintec Ltd.

Israel . 180 parts In-Stock

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180

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One Stop Electronics

USA . 1,076 parts In-Stock

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$3.000

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$3.000

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Parana Technologies

USA . 733 parts In-Stock

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$15.992

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$16.337

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733

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AZTECH Wire

Italy . 315 parts In-Stock

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$17.374

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$17.374

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ChromeModa Solutions

Germany . 6,757 parts In-Stock

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$17.968

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$14.734

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$14.734

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IDEA Electronic Components Group

UK . 95 parts In-Stock

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$17.968

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$17.070

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$16.171

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95

$17.968

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$16.171

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Corohmni

South Africa . 1,859 parts In-Stock

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$72.222

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Corphita

USA . 3,892 parts In-Stock

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DigiPath Technology Company

USA . 1,307 parts In-Stock

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$16.200

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Microchip USA

USA . 498 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320C6414TBZLZ1 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors that are versatile and reliable. Whether you're working on audio processing, telecommunications, or industrial control applications, this DSP offers unparalleled performance and efficiency. With its advanced features and exceptional value, the TMS320C6414TBZLZ1 is the perfect choice for customers looking to elevate their projects to the next level. Unlock endless possibilities with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design.

Maximum Supply Voltage: 1.24 V

Operating within this voltage range ensures efficient performance and protects the DSP from overvoltage.

Address Bus Width: 23

A wider address bus width allows for more memory address locations, increasing the processing capabilities of the DSP.

Package Shape: SQUARE

The square shape is compact and facilitates easier integration into electronic systems.

Bit Size: 32

A 32-bit architecture enables faster and more accurate processing of digital signals.

Power Supplies (V): 1.1,3.3

Support for multiple power supplies allows flexibility in voltage requirements for different applications.

No. of Terminals: 532

Having a high number of terminals enables connectivity with various external components for enhanced functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch design enable high-density mounting, maximizing space utilization on PCBs.

Minimum Supply Voltage: 1.16 V

Operating within this voltage range ensures stable performance even under low power conditions.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can function reliably in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the DSP can operate in cold climates without issues.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making installation easier.

Maximum Seated Height: 3.25 mm

The low seated height allows for a compact overall design and space-saving in electronic devices.

RAM Words: 262144

With a large RAM capacity, the DSP can handle and process a significant amount of data efficiently.

Width: 23 mm

The compact width makes the DSP suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging during the manufacturing process.

External Data Bus Width: 64

A wide external data bus width enables fast data transfer between the DSP and external memory or peripherals.

Maximum Clock Frequency: 75 MHz

Operating at a high clock frequency allows for fast signal processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the DSP can withstand peak reflow temperatures for a specified period without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the DSP's ability to withstand soldering processes.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data flow efficiency within the DSP, optimizing performance.

Length: 23 mm

The compact length of the DSP makes it suitable for applications where space-saving is crucial.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripherals enhances the DSP's versatility for diverse applications.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed operation, ideal for energy-efficient devices.

Terminal Form: BALL

The ball terminal form provides a reliable electrical connection and facilitates easy soldering during assembly.

Nominal Supply Voltage: 1.2 V

Operating at the nominal supply voltage ensures stable performance and efficiency in power consumption.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density mounting and compact design on PCBs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and enhances computational efficiency in DSP algorithms.

Moisture Sensitivity Level (MSL): 4

The MSL rating of 4 ensures the DSP can withstand moderate levels of moisture and humidity during operation or storage.

Low Power Mode: YES

The availability of a low power mode option allows for energy-efficient operation and extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBZLZ1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBZLZ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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