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TMS320C6412GNZA500

Texas Instruments

TMS320C6412GNZA500 by Texas Instruments

TMS320C6412GNZA500 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75.19 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode and fixed-point format in a compact grid array package.

Median Price

$54.372

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$48.330

1k+ parts

$43.240

10k+ parts

$40.700

115

-

$48.330

$43.240

$40.700

DigiKey

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

115

-

-

-

-

Verical

USA . 81 parts In-Stock

1+ parts

-

100+ parts

$60.413

1k+ parts

$54.050

10k+ parts

$50.875

81

-

$60.413

$54.050

$50.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,783 parts In-Stock

1+ parts

$51.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,783

$51.006

-

-

-

Vyrian

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 446 parts In-Stock

1+ parts

$29.525

100+ parts

-

1k+ parts

$60.294

10k+ parts

-

446

$29.525

-

$60.294

-

DigiPath Technology Company

USA . 879 parts In-Stock

1+ parts

$32.511

100+ parts

$29.910

1k+ parts

-

10k+ parts

-

879

$32.511

$29.910

-

-

ChromeModa Solutions

Germany . 5,036 parts In-Stock

1+ parts

$33.174

100+ parts

$27.203

1k+ parts

-

10k+ parts

-

5,036

$33.174

$27.203

-

-

IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$33.174

100+ parts

$31.515

1k+ parts

$29.857

10k+ parts

-

1,614

$33.174

$31.515

$29.857

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Corohmni

South Africa . 1,078 parts In-Stock

1+ parts

$36.673

100+ parts

-

1k+ parts

-

10k+ parts

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1,078

$36.673

-

-

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Corphita

USA . 1,011 parts In-Stock

1+ parts

$48.321

100+ parts

-

1k+ parts

-

10k+ parts

-

1,011

$48.321

-

-

-

Component Stockers USA

USA . 352 parts In-Stock

1+ parts

$54.530

100+ parts

$51.260

1k+ parts

-

10k+ parts

-

352

$54.530

$51.260

-

-

Overview

Unlock the power of digital signal processing with the TMS320C6412GNZA500 by Texas Instruments. Designed with precision and reliability in mind, this DSP boasts a multitude of applications in various industries, offering unparalleled value and benefits to customers. Whether you need high-speed data processing or advanced audio/video capabilities, this DSP delivers exceptional performance and efficiency. Trust Texas Instruments for top-of-the-line technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the digital signal processor, ensuring longevity and reliability.

Surface Mount: YES

Convenient installation process and saves space on the circuit board.

Maximum Supply Voltage: 1.44 V

Allows for efficient power usage while maintaining high performance.

Address Bus Width: 23

Enables efficient communication between the processor and memory, enhancing overall processing speed.

Package Shape: SQUARE

Optimal design for efficient placement on the circuit board and space utilization.

Bit Size: 32

High processing capability for complex digital signal processing tasks.

Power Supplies (V): 1.4,3.3

Compatibility with various power supply options for flexibility in different applications.

No. of Terminals: 548

Sufficient connections for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

Facilitates easy soldering and assembly on the circuit board.

Minimum Supply Voltage: 1.36 V

Ensures stable operation at lower power levels for energy efficiency.

Terminal Finish: TIN LEAD

Provides a reliable connection and prevents oxidation for long-term performance.

Terminal Position: BOTTOM

Simplifies the assembly process and enhances thermal dissipation.

Maximum Seated Height: 2.8 mm

Low profile design for compact electronic devices.

RAM Words: 262144

High memory capacity for storing and processing data efficiently.

Width: 27 mm

Compact size for easy integration into electronic systems with space constraints.

Boundary Scan: YES

Allows for efficient testing and debugging of the digital signal processor during production.

External Data Bus Width: 64

Enhanced data transfer capability for faster processing of input/output data.

Maximum Clock Frequency: 75.19 MHz

High clock speed for rapid data processing and real-time signal analysis.

Internal Bus Architecture: MULTIPLE

Optimized bus structure for efficient data transfer within the processor.

Length: 27 mm

Balanced dimensions for a square package shape, optimizing circuit board layout.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality and compatibility with various peripherals for diverse applications.

Technology: CMOS

Low power consumption and high-speed operation for energy-efficient performance.

Terminal Form: BALL

Provides reliable connections for stable performance under various operating conditions.

Nominal Supply Voltage: 1.4 V

Standard operating voltage for optimal performance and compatibility with power supplies.

Terminal Pitch: 1 mm

Evenly spaced terminals for easy assembly and compatibility with standard PCB designs.

Format: FIXED POINT

Accurate and efficient computation for digital signal processing tasks.

Moisture Sensitivity Level (MSL): 4

Suitable for environments with moderate exposure to moisture, ensuring reliability and longevity.

Low Power Mode: YES

Energy-saving feature for extended battery life and reduced overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412GNZA500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412GNZA500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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