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TMS320C6205DZWT200

Texas Instruments

TMS320C6205DZWT200 by Texas Instruments

TMS320C6205DZWT200 by Texas Instruments is a 32-bit DSP with 288 terminals, operating at max 200 MHz. It features integrated cache, 32-bit data bus width, and flash ROM programmability. Ideal for digital signal processing applications requiring low power consumption and high-speed performance.

Median Price

$21.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 214 parts In-Stock

1+ parts

$21.950

100+ parts

$16.470

1k+ parts

$15.700

10k+ parts

$14.080

214

$21.950

$16.470

$15.700

$14.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,781 parts In-Stock

1+ parts

$20.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,781

$20.852

-

-

-

Vyrian

USA . 8,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,748

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,737 parts In-Stock

1+ parts

$19.755

100+ parts

-

1k+ parts

-

10k+ parts

-

1,737

$19.755

-

-

-

Parana Technologies

USA . 1,977 parts In-Stock

1+ parts

$30.772

100+ parts

-

1k+ parts

$69.388

10k+ parts

-

1,977

$30.772

-

$69.388

-

ChromeModa Solutions

Germany . 4,913 parts In-Stock

1+ parts

$34.575

100+ parts

$28.352

1k+ parts

-

10k+ parts

-

4,913

$34.575

$28.352

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-

IDEA Electronic Components Group

UK . 731 parts In-Stock

1+ parts

$34.575

100+ parts

$32.846

1k+ parts

$31.118

10k+ parts

-

731

$34.575

$32.846

$31.118

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Corohmni

South Africa . 40 parts In-Stock

1+ parts

$72.213

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$72.213

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-

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Microchip USA

USA . 1,233 parts In-Stock

1+ parts

$143.470

100+ parts

$140.980

1k+ parts

$139.730

10k+ parts

$138.480

1,233

$143.470

$140.980

$139.730

$138.480

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

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DigiPath Technology Company

USA . 1,737 parts In-Stock

1+ parts

-

100+ parts

$31.173

1k+ parts

-

10k+ parts

-

1,737

-

$31.173

-

-

Overview

Unlock the power of digital signal processing with the TMS320C6205DZWT200 by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a high-performance solution for a wide range of applications. With integrated cache and low power mode, this DSP offers unmatched efficiency and speed. Whether you're working on audio processing, telecommunications, or industrial control, this versatile processor provides the value, benefits, and advantages that customers need to take their projects to the next level. Choose Texas Instruments for reliability and innovation in every design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside, ensuring a longer lifespan for the product.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP, making it suitable for high-performance applications.

Maximum Supply Voltage: 1.57 V

With a relatively high maximum supply voltage, this DSP can handle higher power requirements without getting damaged.

Bit Size: 32

A 32-bit architecture allows for processing larger chunks of data at a time, increasing the overall processing speed and efficiency of the DSP.

RAM Words: 65536

With a large RAM capacity, this DSP can store and process a significant amount of data at a time, ideal for complex signal processing tasks.

Maximum Clock Frequency: 200 MHz

A high clock frequency allows for faster execution of instructions and computations, making this DSP suitable for real-time applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a specialized digital signal processor, this product is designed specifically for handling signal processing tasks efficiently and effectively.

ROM Programmability: FLASH

The flash programmability of ROM allows for easy reprogramming of the DSP, enabling flexibility in updating algorithms and functionalities as needed.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this DSP energy-efficient and reliable for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205DZWT200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205DZWT200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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